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Reverse Costing of Google Nexus 6P Fingerprint Sensor

  • December 2015
  • -
  • System Plus Consulting
  • -
  • 109 pages

The Nexus 6P is a smartphone designed and manufactured by Huawei. Like in the Ascend Mate 7, the Chinese company integrates a fingerprint sensor from Fingerprint Cards on the back of the device but introduces significant modifications in term of resolution and packaging.

The FPC1025 has been chosen by different smartphone manufacturers; it can be found also in products from Lenovo, ZTE, QiKU, LG and many others.

SystemPlus Consulting report presents a complete report with teardown technical analysis, manufacturing process, supply chain and manufacturing cost analysis of FPC1025.

Located on the back side of the smartphone, the fingerprint sensor of the Nexus 6P has dimensions of 11.6 x 11.6mm. It is assembled on a square LGA package and is protected by metal support.

The sensor has a resolution of 15,600 pixels with a pixel density of 508ppi. It uses a capacitive touch technology to takes an image of the fingerprint from the subepidermal layers of the skin.

The sensor die is manufactured with CMOS 65nm technology and is connected by mean of wire bonding to the rigid PCB.

The components also includes an ASIC die manufactued using a 0.5µm CMOS process and connected to the flex PCB.

This report includes comparisons with Ascend Mate 7 fingerprint sensor and with the latest Samsung’s and Apple’s fingerprints buttons.

Table Of Contents

Reverse Costing of Google Nexus 6P Fingerprint Sensor
Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

Physical Analysis Methodology
Fingerprint Button assembly
Fingerprint Scanner Views
Fingerprint Scanner Croos-Section
Fingerprint Scanner Patents
Sensor Die
Sensor Die View and Dimensions
Sensor Die Capacitor
Sensor Die Edge Contact
Sensor Delayering and main Blocs
Sensor Die Process
Sensor Die Cross-Section
Sensor Die Process Characteristic
ASIC Die
Dimensions and Markings
Delayering
IC Process
Die Cross-Section
Nexus 6P's vs Ascend Mate 7's fingerprint sensor

Manufacturing Process Flow

Sensor Die Front-End Process
LGA Packaging Process
Sensor Die Front-End Process
Final Test and Packaging
Fabrication unit
Synthesis of the main parts
Cost Analysis

Sensor Die Front-End Cost, Probe Test, Thinning and Dicing
LGA Packaging Cost
Sensor Component Cost
ASIC Die Front-End Cost, Probe Test, Thinning and Dicing
ASIC Component Cost
Assembled Components Cost
Synthesis of the assembling
Fingerprint Component Cost
Technology and Cost comparison with Huawei's Ascend Mate and Samsung 6S fingerprint sensors

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