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  4. > Reverse Costing of ams TSV TSL2584TSV Ambient Light Sensor (ALS)

Reverse Costing of ams TSV TSL2584TSV Ambient Light Sensor (ALS)

  • January 2016
  • -
  • System Plus Consulting
  • -
  • 70 pages

ams has adopted through-silicon via (TSV) packaging technology for advanced light sensor technology. TSV technology, with the advantage of having in-house wafer fabrication expertise, eliminates the use of wire bonds and provides a direct connection from the device I/Os to a solder ball.

The TSL2584TSV ALS is only 1.14 x 1.66mm footprint and 0.32mm height. The small size of the TSV package technology addresses the small form factor requirement in wearable products (watch, glasses…). ams uses for this device an untraditional and elegant tungsten TSV-last process compared to copper filled TSV used by many other players.

For the light sensing, a very sensitive analog front-end (AFE) is used with a patented dual-diode architecture to transform light intensity into a digital count value. A broadband photodiode responsive to visible and infrared is used in conjunction with an infrared-only responsive photodiode and the two photodiodes channel responses are mathematically subtracted via a lux equation on a micro-controller through the digital I²C interface.

The TSL2584TSV includes an on-chip photopic infrared-blocking interference filter that rejects unwanted UV and IR producing a near-photopic response.

The report also includes a comparison with ams Ambient Light Sensor featured in the iPhone 6s.

Table Of Contents

Reverse Costing of ams TSV TSL2584TSV Ambient Light Sensor (ALS)
Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

Physical Analysis Methodology
Sensor Die
Sensor View and Dimensions
Sensor Marking
Sensor Packaging
Sensor Delayering
CMOS Process
Photodiodes
TSV
Sensor Cross-Section
Substrate
Metal Layers
Filter
IC Process
Photodiodes
TSV
RDL and Solder Bump
Manufacturing Process Flow

Global Overview
Sensor Front-End Process
Sensor TSV Packaging Process Flow
Wafer Fabrication Unit
Cost Analysis

Sensor Front-End Cost
Sensor TSV Packaging Cost
TSV Packaging Cost per Steps
Sensor Filter Cost
Sensor Wafer Cost
Sensor Die Cost
Sensor Test Cost
Sensor Cost and Price
Selling Price Analysis

Sensor Price Estimation
Comparison with ams ALS in iPhone 6s

View This Report »

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