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Reverse Costing of Infineon RRN7740-RTN7750 Radar Receiver & Transmitter

  • January 2016
  • -
  • System Plus Consulting
  • -
  • 87 pages

The new integrated Radar and Camera (RACam) 77GHz automotive radar from Delphi integrates receiver and transmitter components from Infineon. These components use the latest SiGe:C HBT technology.

The two bare dies RF component are developed and manufactured by Infineon. The two chips are integrated in the RF board with specific thermal management. The dies have wire bonding and are directly connected to microstrip line transmission which lead the signal to antenna via a specific way through the PCB.

The RF transistors are the newest generation SiGe:C HBT dies from Infineon. The circuits use advanced insulation structure and modern copper metal layers.

The report includes a complete physical analysis of the dies, with details on technical choices regarding the design and the manufacturing process. The SiGe HBT are equally analyzed.

Infineon offer several RASIC with different package (bare die, eWLB). in order to understand the choice made by Delphi, the RF function and design are compared with the Infineon RRN7745P and RTN7735P (eWLB packaging) found in the Bosch MRR1Plus automotive radar.

Table Of Contents

Reverse Costing of Infineon RRN7740-RTN7750 Radar Receiver and Transmitter
Overview / Introduction

Infineon Company Profile

Physical Analysis

Radar system
Integration of the die
System Comparison
Die
Die View and Dimensions
Main Blocks Identification
Die Marking
Die Process
Die Comparison
Die Integration
Die Cross-Section
Cost Analysis

Hypotheses
Component Summary
Front-End Summary
Wafer Fabrication Unit
Back-End: Probe Test, Backgrinding and Dicing
Back-End: Final Test
Cost Analysis
Yields Synthesis
Unprobed Wafer Cost
Die Cost
Final Test Cost
Component Cost
Estimated Price Analysis

Infineon Financial Results
Component Selling Price

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