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Reverse Costing of FLiR One 2G & Lepton 3 Infrared Camera & IR sensor

  • February 2016
  • -
  • System Plus Consulting
  • -
  • 260 pages

After the world’s first consumer thermal camera (FLIR One) in 2014, FLIR just released the second generation of the FLIR One featuring a completely new design and an upgraded Lepton core. The major achievement for FLIR has been to propose, in the same module size, a 4x improved resolution without consuming more power and at a lower cost!

Based on a complete teardown analysis of the new FLIR One for Android and iOS, the report provides the bill-of-material (BOM) and the manufacturing cost of the infrared camera as well as a complete physical analysis and manufacturing cost estimation of the Lepton infrared module.

The new Lepton 3 LWIR core shares almost the same dimensions than the previous Lepton core but offers a four times improved resolution of 160×120 pixels (versus 80×60 pixel for the Lepton 2). Despite this improvement, it consumes slightly the same power with 160mW versus 150mW. This achievement has been made possible by the reduction of the pixel size, from 17µm to 12µm in the Lepton 3. This new pixel size has been accompanied by new processes for the ROIC, the microbolometer and the wafer-level window (new technology node, new pixel integration with the ROIC and a simplified window which no longer needs an SOI wafer…).

On the optical module side, strong efforts have been made to improve lenses resulting in a wider field of view (FOV). The lenses are still wafer-level silicon optics but area has been enhanced thanks to hexagonal shapes compared to square shapes previously.

To finish, a comparison between FLIR One 1st and 2nd Generation, Seek Thermal and Therm-App Cameras highlights the differences in technical choices made by each company.

Table Of Contents

Reverse Costing of FLiR One 2G and Lepton 3 Infrared Camera and IR sensor
FLIR One System -75 pages

Overview/Introduction

Physical Analysis

Package Opening
Views and Dimensions of the Camera
FLIR One Disassembly
Shutter Disassembly
Housing Disassembly
Electronic Boards
Global View
Top and Bottom Sides HR Photos
Components Identification
Cost Analysis

Cost of the PCBs
Cost of Sonix Controller
Electronic Boards BOM Cost
Housing BOM Cost
Packaging BOM Cost
Material Cost Breakdown
Electronic Boards Assembly Cost
Housing Assembly Cost
Assembly Cost Breakdown
Manufacturing Cost Breakdown
Estimated Price Analysis

Estimation of the Manufacturing Price
FLIR Lepton LWIR Module -185 pages

Overview/Introduction

Physical Analysis

Lepton Module
View, Dimensions and Pin-Out
Module Opening, Housing, Lenses
IR Sensor Assembly
Lepton Module Cross-Section
Substrate, Heat Spreader, Lenses
IR Sensor Die
View, Dimensions and Marking
Window Removed and Details
Pixel Area and Pixel Details
ROIC Delayering and Process
IR Sensor Cross-Section
Overview, Sealing, Window
ROIC, Microbolometer
ASIC Dies
View, Dimensions and Marking
Delayering and Process, Cross-Section
Manufacturing Process Flow

ASICs, ROIC, µbolometer and Window
Wafer Fab Units
Cost Analysis

ASICs Wafer and Dies Cost
ROIC, µbolometer and Window Front-End Cost
IR Sensor Wafer and Die Cost
Lenses and Module Assembly Cost
Lepton Module Cost
Estimated Price Analysis

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