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  5. > Reverse Costing of EgisTec ET300 Fingerprint Sensor

Reverse Costing of EgisTec ET300 Fingerprint Sensor

  • February 2016
  • -
  • System Plus Consulting
  • -
  • 89 pages

After a first introduction in the Aurora i966, EgisTec integrates again its fingerprint ET300 in the Philips i999, a smartphone for the Chinese market.With very simple technical choices concerning the technical detection design and the packaging, EgisTec offers a very competitive sensor in terms of size and manufacturing cost.

Located on the back side of the smartphone, the fingerprint sensor of the Philips i999 has dimensions of 11.6 x 11.6. It is assembled on a square LGA packaging and is protected by metal support.

The sensor has a resolution of 17,920 pixels with a pixel density of 500ppi. It uses a capacitive touch technology to take an image of the fingerprint from the subepidermal layers of the skin.

The sensor die is manufactured with CMOS 0.15µm technology and it is connected by mean of wire bonding to the rigid PCB.

Thanks to its design and manufacturing process, EgisTec device is very smart and cost effective in respect to the competitors.

The report includes comparisons with the latest Huawei’s, Samsung’s and Apple’s fingerprints buttons.

Table Of Contents

Reverse Costing of EgisTec ET300 Fingerprint Sensor
Overview / Introduction

Company Profile and Supply Chain

Physical Analysis

Physical Analysis Methodology
Fingerprint sensor disassembly
Fingerprint sensor Removal
Fingerprint sensor assembly view
Fingerprint sensor assembly
Fingerprint sensor Views
Fingerprint sensor Cross-Section
Sensor Die
Sensor Die View and Dimensions
Sensor Die Marking
Sensor Die Capacitors
Sensor Die Edge Contact
Sensor Delayering and main Blocs
Sensor Die Process
Sensor Die Cross-Section
Sensor Die Process Characteristic
Manufacturing Process Flow

Sensor Die Front-End Process
LGA Packaging Process
Final Test and Packaging
Fabrication unit
Synthesis of the main parts
Cost Analysis

Sensor Die Front-End Cost, Probe Test, Thinning and Dicing
LGA Packaging Cost
Sensor Component Cost
Synthesis of the assembling
Fingerprint Component Cost
Technology and Cost comparison with Huawei's, Apple's and Samsung's fingerprint sensors

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