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  4. > Flip Chip Technology Market by Wafer Bumping Process, Packaging Technology, Packaging Type, Product, Application and Geography - Global Forecast to 2022

“Miniaturization of semiconductor devices, improved performance, and reduced size driving the flip chip technology market”

The flip chip technology market is expected to grow from USD 19.01 billion in 2015 to USD 31.27 billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in the consumer electronics market.

“The market for CPU of flip chip technology to gain maximum traction during the forecast period”

CPUs packaged using the flip chip technology are estimated to hold the largest market share during the forecast period. The market for LED is expected to gain traction and grow at the highest CAGR in the next six years. These are the most sustainable product segments for the flip chip technology market. CPUs have a wide range of applications in computers, smartphones (application processor), high-end networks such as servers, wearables, and now automotive. The performance of application processor in smartphones and tablets remains a key feature leading to fierce competition among brands. Therefore, increasing need for more functionality and reduced package size is expected to drive the integration of flip chip technology in baseband and application processors for mobile platforms.

The market in APAC expected to witness highest growth during the forecast period

APAC accounted for the major market share of the overall flip chip technology market in 2015. Moreover, the market in APAC is expected to grow at the highest CAGR between 2016 and 2022. Asia-Pacific is a major manufacturing hub and expected to provide ample opportunities for the growth of flip chip technology. The growing demand for high performance in smartphones and automotive MCUs is driving the market in this region.

In the process of determining and verifying the market size for several segments and sub-segments gathered through the secondary research, extensive primary interviews with key people have been conducted. The break-up of profile of primary participants is as given below:

- By Company Type: Tier 1 – 22%, Tier 2 – 45% and Tier 3 – 33%
- By Designation: C-level – 43%, Manager level – 57%
- By Region: North America – 12%, Europe – 38%, APAC – 25%, RoW – 25%

Owing to the rise in the demand for flip chip packaging solutions in smartphones, computers, and tablets, the flip chip technology market is expected to have huge opportunity for growth in the next six years.

Various key players in the flip chip technology market profiled in the report are as follows:
1. TSMC, Ltd. (Taiwan)
2. Samsung (South Korea)
3. Intel Corporation (U.S.)
4. United Microelectronics Corporation (Taiwan)
5. ASE Group (Taiwan)
6. Amkor Technology (U.S.)
7. STATS ChipPAC (Singapore)
8. Powertech Technology (Taiwan)
9. SPIL, Co., Ltd. (Taiwan)
10. JCET, Co., Ltd. (China)

The report would help key players/new entrants in this market in the following ways:
1. This report segments the flip chip technology market comprehensively and provides the closest approximations of the size of the overall market and sub-segments across different verticals and regions.
2. The report helps stakeholders understand the pulse of the market and provides them information on key market drivers, restraints, challenges, and opportunities.
3. This report would help stakeholders to better understand a competitor and gain more insights to improve their position in the business. The competitive landscape section includes competitor ecosystem, new product developments, partnerships, mergers and acquisitions.

Table Of Contents

Flip Chip Technology Market by Wafer Bumping Process, Packaging Technology, Packaging Type, Product, Application and Geography - Global Forecast to 2022
TABLE OF CONTENTS

1 INTRODUCTION 15
1.1 OBJECTIVES OF THE STUDY 15
1.2 MARKET DEFINITION 15
1.3 STUDY SCOPE 16
1.3.1 MARKETS COVERED 16
1.3.2 YEARS CONSIDERED FOR THE STUDY 16
1.4 CURRENCY 17
1.5 LIMITATIONS 17
1.6 MARKET STAKEHOLDERS 17
2 RESEARCH METHODOLOGY 18
2.1 RESEARCH DATA 19
2.1.1 SECONDARY DATA 19
2.1.1.1 Key data from secondary sources 19
2.1.2 PRIMARY DATA 20
2.1.2.1 Key data from primary sources 20
2.1.2.2 Key industry insights 21
2.1.2.3 Breakdown of primaries 21
2.2 MARKET SIZE ESTIMATION 22
2.2.1 BOTTOM-UP APPROACH 23
2.2.2 TOP-DOWN APPROACH 24
2.2.3 MARKET SHARE ESTIMATION 24
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 25
2.4 RESEARCH ASSUMPTIONS 26
2.4.1 ASSUMPTIONS 26
3 EXECUTIVE SUMMARY 27
4 PREMIUM INSIGHTS 32
4.1 ATTRACTIVE OPPORTUNITIES IN THE GLOBAL FLIP CHIP TECHNOLOGY MARKET 32
4.2 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE, 2016-2022 33
4.3 FLIP CHIP TECHNOLOGY MARKET SIZE, BY WAFER BUMPING PROCESS, 2016-2022 33
4.4 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TECHNOLOGY, 2016-2022 34
4.5 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PRODUCT, 2016-2022 34
4.6 FLIP CHIP TECHNOLOGY MARKET SIZE, BY APPLICATION, 2016-2022 35
4.7 FLIP CHIP TECHNOLOGY MARKET SIZE, BY GEOGRAPHY 35

5 MARKET OVERVIEW 36
5.1 INTRODUCTION 36
5.2 MARKET SEGMENTATION 36
5.2.1 FLIP CHIP TECHNOLOGY MARKET, BY WAFER BUMPING PROCESS 36
5.2.2 FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY 36
5.2.3 FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TYPE 36
5.2.4 FLIP CHIP TECHNOLOGY MARKET, BY PRODUCT 36
5.2.5 FLIP CHIP TECHNOLOGY MARKET, BY APPLICATION 37
5.2.6 GEOGRAPHIC ANALYSIS 37
5.3 MARKET DYNAMICS 38
5.3.1 DRIVERS 39
5.3.1.1 Increasing demand for miniaturization and high-performing electronic devices 39
5.3.1.2 Penetration in the consumer electronics sub segment 39
5.3.2 RESTRAINTS 40
5.3.2.1 Reliability challenges 40
5.3.3 OPPORTUNITIES 41
5.3.3.1 Growth in the IC industry 41
5.3.4 CHALLENGES 42
5.3.4.1 High cost associated with flip chip packaging solutions 42
6 INDUSTRY TRENDS 43
6.1 INTRODUCTION 43
6.2 VALUE CHAIN ANALYSIS 43
6.3 PORTER'S FIVE FORCES ANALYSIS 47
6.3.1 THREAT OF NEW ENTRANTS 49
6.3.2 THREAT OF SUBSTITUTES 50
6.3.3 BARGAINING POWER OF SUPPLIERS 51
6.3.4 BARGAINING POWER OF BUYERS 52
6.3.5 INTENSITY OF COMPETITIVE RIVALRY 53
7 FLIP CHIP TECHNOLOGY MARKET, BY WAFER BUMPING PROCESS 54
7.1 INTRODUCTION 55
7.2 COPPER (CU) PILLAR 56
7.2.1 BENEFITS OF COPPER PILLAR BUMPING PROCESS OVER OTHER WAFER BUMPING PROCESSES 57
7.3 LEAD (PB)-FREE 57
7.4 TIN-LEAD (SN-PB) EUTECTIC SOLDER 58
7.5 GOLD-STUD+ PLATED SOLDER 58

8 FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TECHNOLOGY 59
8.1 INTRODUCTION 60
8.2 2D IC PACKAGING TECHNOLOGY 62
8.3 2.5D IC PACKAGING TECHNOLOGY 63
8.3.1 MAJOR BENEFITS OF 2.5D IC PACKAGING OVER THE TRADITIONAL 2D IC PACKAGING TECHNOLOGY 64
8.4 3D IC PACKAGING TECHNOLOGY 64
8.5 COMPARISON BETWEEN 2D, 2.5D, 3D IC PACKAGING TECHNOLOGY 66
9 FLIP CHIP TECHNOLOGY MARKET, BY PACKAGING TYPE 67
9.1 INTRODUCTION 68
9.2 FC BGA (FLIP CHIP BALL GRID ARRAY) 69
9.3 FC PGA (FLIP CHIP PIN GRID ARRAY) 70
9.4 FC LGA (FLIP CHIP LAND GRID ARRAY) 71
9.5 FC QFN (FLIP CHIP QUAD FLAT NO-LEAD) 72
9.6 FC SIP (FLIP CHIP SYSTEM-IN-PACKAGE) 72
9.7 FC CSP (FLIP CHIP-CHIP-SCALE PACKAGE) 73
10 FLIP CHIP TECHNOLOGY MARKET, BY PRODUCT 74
10.1 INTRODUCTION 75
10.2 MEMORY 76
10.3 LIGHT-EMITTING DIODE (LED) 77
10.4 CMOS IMAGE SENSOR 78
10.5 RF, ANALOG, MIXED SIGNAL, AND POWER IC 79
10.6 CPU 80
10.7 GPU 81
10.8 SOC 82
11 FLIP CHIP TECHNOLOGY MARKET, BY APPLICATION 84
11.1 INTRODUCTION 85
11.2 CONSUMER ELECTRONICS 86
11.2.1 SMARTPHONES and TABLETS 86
11.2.2 LAPTOPS 87
11.2.3 DESKTOP PC 87
11.2.4 SET-TOP BOX/HYBRID SET TOP BOX 87
11.2.5 GAME STATIONS 87
11.3 TELECOMMUNICATIONS 89
11.3.1 NETWORK EQUIPMENT 89
11.3.2 BASE STATIONS 89
11.3.3 SERVERS 89

11.4 AUTOMOTIVE 91
11.4.1 ECU 91
11.4.2 SENSORS 91
11.4.3 POWER MODULES 91
11.4.4 OTHERS 91
11.5 INDUSTRIAL 93
11.5.1 INDUSTRIAL WIRELESS SENSOR NETWORK 93
11.5.2 IDENTIFICATION AND MONITORING 93
11.5.3 OTHERS 93
11.6 MEDICAL DEVICES 95
11.6.1 PATIENT MONITORING DEVICES 95
11.6.2 SMART SENSOR SYSTEM 95
11.6.3 OTHERS 96
11.7 SMART TECHNOLOGIES 97
11.7.1 MILITARY and AEROSPACE 98
11.7.2 RADAR EQUIPMENT 98
11.7.3 SATELLITE COMMUNICATION DEVICES 99
11.7.4 OTHERS 99
12 GEOGRAPHIC ANALYSIS 101
12.1 INTRODUCTION 102
12.2 AMERICAS 104
12.2.1 NORTH AMERICA 105
12.2.1.1 U.S. 105
12.2.1.2 Canada 105
12.2.1.3 Brazil 105
12.2.1.4 Argentina 106
12.2.1.5 Others 106
12.3 EUROPE 110
12.3.1 GERMANY 111
12.3.2 FRANCE 111
12.3.3 U.K. 111
12.3.4 OTHERS 111
12.4 ASIA-PACIFIC 113
12.4.1 CHINA 114
12.4.2 JAPAN 114
12.4.3 TAIWAN 114
12.4.4 SOUTH KOREA 114
12.4.5 OTHERS 114
12.5 REST OF THE WORLD (ROW) 116
12.5.1 MIDDLE EAST and AFRICA 116
12.5.2 RUSSIA 116
13 COMPETITIVE LANDSCAPE 118
13.1 INTRODUCTION 118
13.2 MARKET RANKING ANALYSIS, 2015 119
13.3 COMPETITIVE SITUATIONS AND TRENDS 120
13.3.1 COLLABORATIONS 121
13.3.2 ACQUISITIONS, JOINT VENTURES, AND AGREEMENTS 122
13.3.3 OTHERS 122
14 COMPANY PROFILES 123
(Overview, Products and Services, Financials, Strategy and Development)*
14.1 INTRODUCTION 123
14.2 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED (TSMC LTD.) 124
14.3 SAMSUNG ELECTRONICS CO., LTD. 127
14.4 INTEL CORP. 130
14.5 UNITED MICROELECTRONICS CORP. 133
14.6 ASE GROUP 135
14.7 AMKOR TECHNOLOGY 138
14.8 SILICONWARE PRECISION INDUSTRIES CO., LTD. 141
14.9 POWERTECH TECHNOLOGY, INC. 143
14.10 STATS CHIPPAC LTD. 145
14.11 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD 147
*Details on Overview, Products and Services, Financials, Strategy and Development might not be Captured in case of Unlisted Companies.
15 APPENDIX 149
15.1 INSIGHTS OF INDUSTRY EXPERTS 149
15.2 DISCUSSION GUIDE 150
15.3 KNOWLEDGE STORE: MARKETSANDMARKETS' SUBSCRIPTION PORTAL 153
15.4 INTRODUCING RT: REAL-TIME MARKET INTELLIGENCE 155
15.5 AVAILABLE CUSTOMIZATIONS 157
15.6 RELATED REPORTS 157


LIST OF TABLES

TABLE 1 ANALYSIS OF MARKET DRIVERS 39
TABLE 2 ANALYSIS OF MARKET RESTRAINTS 40
TABLE 3 ANALYSIS OF MARKET OPPORTUNITIES 41
TABLE 4 ANALYSIS OF MARKET CHALLENGES 42
TABLE 5 FLIP CHIP TECHNOLOGY MARKET SIZE, BY WAFER BUMPING PROCESS,
2013-2022 (USD BILLION) 55
TABLE 6 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TECHNOLOGY,
2013-2022 (USD BILLION) 60
TABLE 7 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 68
TABLE 8 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC BGA, BY PRODUCT,
2013-2022 (USD MILLION) 69
TABLE 9 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC PGA, BY PRODUCT,
2013-2022 (USD MILLION) 70
TABLE 10 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC LGA, BY PRODUCT,
2013-2022 (USD MILLION) 71
TABLE 11 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC QFN, BY PRODUCT,
2013-2022 (USD MILLION) 72
TABLE 12 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC SIP, BY PRODUCT,
2013-2022 (USD MILLION) 72
TABLE 13 FLIP CHIP TECHNOLOGY MARKET SIZE FOR FC CSP, BY PRODUCT,
2013-2022 (USD MILLION) 73
TABLE 14 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PRODUCT, 2013-2022 (USD MILLION) 75
TABLE 15 FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEMORY,
BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 76
TABLE 16 FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEMORY, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 77
TABLE 17 FLIP CHIP TECHNOLOGY MARKET SIZE FOR LED, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 77
TABLE 18 FLIP CHIP TECHNOLOGY MARKET SIZE FOR LED, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 78
TABLE 19 FLIP CHIP TECHNOLOGY MARKET SIZE FOR CMOS IMAGE SENSOR,
BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 78
TABLE 20 FLIP CHIP TECHNOLOGY MARKET SIZE FOR CMOS IMAGE SENSOR,
BY PACKAGING TYPE, 2013-2022 (USD MILLION) 79
TABLE 21 FLIP CHIP TECHNOLOGY MARKET SIZE FOR RF, ANALOG, MIXED SIGNAL,
AND POWER IC, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 79
TABLE 22 FLIP CHIP TECHNOLOGY MARKET SIZE FOR RF, ANALOG, MIXED SIGNAL,
AND POWER IC, BY PACKAGING TYPE, 2013-2022 (USD MILLION) 80
TABLE 23 FLIP CHIP TECHNOLOGY MARKET SIZE FOR CPU, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 80
TABLE 24 FLIP CHIP TECHNOLOGY MARKET SIZE FOR CPU, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 81
TABLE 25 FLIP CHIP TECHNOLOGY MARKET SIZE FOR GPU, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 81
TABLE 26 FLIP CHIP TECHNOLOGY MARKET SIZE FOR GPU, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 82
TABLE 27 FLIP CHIP TECHNOLOGY MARKET SIZE FOR SOC, BY PACKAGING TECHNOLOGY, 2013-2022 (USD MILLION) 82
TABLE 28 FLIP CHIP TECHNOLOGY MARKET SIZE FOR SOC, BY PACKAGING TYPE,
2013-2022 (USD MILLION) 83
TABLE 29 FLIP CHIP TECHNOLOGY MARKET SIZE, BY APPLICATION,
2013-2022 (USD MILLION) 85
TABLE 30 FLIP CHIP TECHNOLOGY MARKET SIZE, BY CONSUMER ELECTRONICS,
2013-2022 (USD MILLION) 87
TABLE 31 FLIP CHIP TECHNOLOGY MARKET SIZE FOR CONSUMER ELECTRONICS,
BY REGION, 2013-2022 (USD MILLION) 88
TABLE 32 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 88
TABLE 33 FLIP CHIP TECHNOLOGY MARKET SIZE, BY TELECOMMUNICATION APPLICATION, 2013-2022 (USD MILLION) 89
TABLE 34 FLIP CHIP TECHNOLOGY MARKET SIZE FOR TELECOMMUNICATION, BY REGION, 2013-2022 (USD MILLION) 90
TABLE 35 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 90
TABLE 36 FLIP CHIP TECHNOLOGY MARKET SIZE, BY AUTOMOTIVE APPLICATION,
2013-2022 (USD MILLION) 92
TABLE 37 FLIP CHIP TECHNOLOGY MARKET SIZE FOR AUTOMOTIVE, BY REGION,
2013-2022 (USD MILLION) 92
TABLE 38 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 93
TABLE 39 FLIP CHIP TECHNOLOGY MARKET SIZE, BY INDUSTRIAL,
2013-2022 (USD MILLION) 94
TABLE 40 FLIP CHIP TECHNOLOGY MARKET SIZE FOR INDUSTRIAL, BY REGION,
2013-2022 (USD MILLION) 94
TABLE 41 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 95
TABLE 42 FLIP CHIP TECHNOLOGY MARKET SIZE, BY MEDICAL DEVICES,
2013-2022 (USD MILLION) 96
TABLE 43 FLIP CHIP TECHNOLOGY MARKET SIZE FOR MEDICAL DEVICES, BY REGION,
2013-2022 (USD MILLION) 96
TABLE 44 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 97
TABLE 45 FLIP CHIP TECHNOLOGY MARKET SIZE, BY SMART TECHNOLOGIES,
2013-2022 (USD MILLION) 97
TABLE 46 FLIP CHIP TECHNOLOGY MARKET SIZE FOR SMART TECHNOLOGIES, BY REGION, 2013-2022 (USD MILLION) 98
TABLE 47 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 98
TABLE 48 GLOBAL FLIP CHIP TECHNOLOGY MARKET SIZE, BY MILITARY AND AEROSPACE APPLICATION, 2013-2022 (USD MILLION) 99
TABLE 49 FLIP CHIP TECHNOLOGY MARKET SIZE FOR MILITARY and AEROSPACE APPLICATION, BY REGION, 2013-2022 (USD MILLION) 100
TABLE 50 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE FOR MILITARY and AEROSPACE APPLICATION, BY REGION, 2013-2022 (USD MILLION) 100
TABLE 51 FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION, 2013-2022 (USD MILLION) 102
TABLE 52 AMERICAS: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 107
TABLE 53 NORTH AMERICA: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY,
2013-2022 (USD MILLION) 107
TABLE 54 SOUTH AMERICA: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY,
2013-2022 (USD MILLION) 107
TABLE 55 FLIP CHIP TECHNOLOGY MARKET SIZE IN AMERICAS, BY APPLICATION,
2013-2022 (USD MILLION) 108
TABLE 56 FLIP CHIP TECHNOLOGY MARKET SIZE IN NORTH AMERICA, BY APPLICATION,
2013-2022 (USD MILLION) 108
TABLE 57 FLIP CHIP TECHNOLOGY MARKET SIZE IN SOUTH AMERICA, BY APPLICATION,
2013-2022 (USD MILLION) 109
TABLE 58 EUROPE: FLIP CHIP TECHNOLOGY MARKET SIZE, BY COUNTRY,
2013-2022 (USD MILLION) 111
TABLE 59 FLIP CHIP TECHNOLOGY MARKET SIZE IN EUROPE, BY APPLICATION,
2013-2022 (USD MILLION) 112
TABLE 60 FLIP CHIP TECHNOLOGY MARKET SIZE IN APAC, BY COUNTRY,
2013-2022 (USD MILLION) 115
TABLE 61 FLIP CHIP TECHNOLOGY MARKET SIZE IN APAC, BY APPLICATION,
2013-2022 (USD MILLION) 115
TABLE 62 ROW: FLIP CHIP TECHNOLOGY MARKET SIZE, BY REGION,
2013-2022 (USD MILLION) 116
TABLE 63 FLIP CHIP TECHNOLOGY MARKET SIZE IN ROW, BY APPLICATION,
2013-2022 (USD MILLION) 117
TABLE 64 MOST SIGNIFICANT COLLABORATIONS IN THE FLIP CHIP TECHNOLOGY MARKET, 2010-2015 121
TABLE 65 MOST SIGNIFICANT ACQUISITIONS, JOINT VENTURES, AND AGREEMENTS IN
THE FLIP CHIP TECHNOLOGY MARKET, 2014-2015 122
TABLE 66 MOST SIGNIFICANT OTHER STRATEGIES IN THE FLIP CHIP TECHNOLOGY MARKET, 2014-2015 122


LIST OF FIGURES

FIGURE 1 FLIP CHIP TECHNOLOGY MARKET SEGMENTATION 16
FIGURE 2 FLIP CHIP TECHNOLOGY MARKET: RESEARCH DESIGN 18
FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION 22
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH 23
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH 24
FIGURE 6 MARKET BREAKDOWN and DATA TRIANGULATION 25
FIGURE 7 ASSUMPTIONS OF THE RESEARCH STUDY 26
FIGURE 8 FLIP CHIP TECHNOLOGY MARKET SIZE, BY PACKAGING TYPE, 2016-2022 27
FIGURE 9 2D IC PACKAGING TECHNOLOGY TO HOLD THE LARGEST MARKET SIZE IN 2016, WHILE THE 3D IC PACKAGING TECHNOLOGY TO GROW AT THE HIGHEST RATE DURING 2016-2022 28
FIGURE 10 COPPER (CU) PILLAR BUMPING PROCESS TO HOLD LARGEST MARKET SIZE 2016 29
FIGURE 11 LED EXPECTED TO GROW AT THE HIGHEST RATE DURING FORECAST PERIOD 29
FIGURE 12 CONSUMER ELECTRONICS APPLICATION TO HOLD LARGEST MARKET SIZE IN 2016 AND ALSO GROW AT THE HIGHEST RATE DURING THE FORECAST PERIOD 30
FIGURE 13 APAC HELD THE LARGEST MARKET IN 2015 AND EXPECTED TO GROW AT
THE HIGHEST RATE DURING THE FORECAST PERIOD 31
FIGURE 14 INCREASING DEMAND FOR MINIATURIZATION ALONG WITH HIGH PERFORMANCE IN ELECTRONICS DEVICES TO SPUR THE MARKET GROWTH 32
FIGURE 15 THE MARKET FOR FC CSP TO GROW AT A HIGH RATE DURING
THE FORECAST PERIOD 33
FIGURE 16 COPPER (CU) PILLAR PROCESS TO GROW AT THE HIGHEST RATE DURING
THE FORECAST PERIOD 33
FIGURE 17 THE MARKET FOR 3D IC PACKAGING TECHNOLOGY TO GROW AT
THE HIGHEST RATE DURING THE FORECAST PERIOD 34
FIGURE 18 THE MARKET FOR LED OF FLIP CHIP TO GROW AT THE HIGHEST RATE DURING
THE FORECAST PERIOD 34
FIGURE 19 THE MARKET FOR CONSUMER ELECTRONICS SEGMENT TO GROW AT
THE HIGHEST RATE DURING THE FORECAST PERIOD 35
FIGURE 20 THE FLIP CHIP TECHNOLOGY MARKET IN THE APAC EXPECTED TO GROW AT
THE HIGHEST RATE DURING FORECAST PERIOD 35
FIGURE 21 FLIP CHIP TECHNOLOGY MARKET, BY GEOGRAPHY 37
FIGURE 22 FLIP CHIP TECHNOLOGY MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES,
AND CHALLENGES 38
FIGURE 23 ECOSYSTEM OF FLIP CHIP TECHNOLOGY 45
FIGURE 24 PORTER'S FIVE FORCES ANALYSIS, 2015 47
FIGURE 25 PORTER'S FIVE FORCES ANALYSIS, 2015 48
FIGURE 26 FLIP CHIP TECHNOLOGY MARKET: THREAT OF NEW ENTRANTS 49
FIGURE 27 FLIP CHIP TECHNOLOGY MARKET: THREAT OF SUBSTITUTES 50
FIGURE 28 FLIP CHIP TECHNOLOGY MARKET: BARGAINING POWER OF SUPPLIERS 51
FIGURE 29 FLIP CHIP TECHNOLOGY MARKET: BARGAINING POWER OF BUYERS 52

FIGURE 30 FLIP CHIP TECHNOLOGY MARKET: INTENSITY OF COMPETITIVE RIVALRY 53
FIGURE 31 MARKET, BY WAFER BUMPING PROCESS 55
FIGURE 32 MARKET FOR COPPER (CU) PILLAR BUMPING PROCESS EXPECTED TO GROW AT THE HIGHEST RATE 56
FIGURE 33 MARKET, BY PACKAGING TECHNOLOGY 60
FIGURE 34 MARKET FOR 3D IC PACKAGING TECHNOLOGY EXPECTED TO GROW AT
THE HIGHEST RATE 61
FIGURE 35 ILLUSTRATION OF 2D IC PACKAGING TECHNOLOGY 62
FIGURE 36 ILLUSTRATION OF 2.5D IC PACKAGING TECHNOLOGY 63
FIGURE 37 ILLUSTRATION OF 3D IC PACKAGING TECHNOLOGY 65
FIGURE 38 MARKET, BY PACKAGING TYPE 68
FIGURE 39 MARKET FOR FC CSP PACKAGING TYPE IS EXPECTED TO GROW AT
THE HIGHEST RATE 69
FIGURE 40 MARKET, BY PRODUCT 75
FIGURE 41 MARKET FOR LED EXPECTED TO GROW AT THE HIGHEST RATE 76
FIGURE 42 MARKET, BY APPLICATION 85
FIGURE 43 MARKET FOR CONSUMER ELECTRONICS APPLICATION EXPECTED TO GROW AT THE HIGHEST RATE 86
FIGURE 44 GEOGRAPHIC SNAPSHOT, 2015 102
FIGURE 45 THE FLIP CHIP TECHNOLOGY MARKET IN THE APAC REGION EXPECTED TO GROW AT THE HIGHEST RATE 103
FIGURE 46 AMERICAS SNAPSHOT 104
FIGURE 47 FLIP CHIP TECHNOLOGY MARKET SIZE IN BRAZIL, 2013-2022 (USD MILLION) 105
FIGURE 48 FLIP CHIP TECHNOLOGY MARKET SIZE IN ARGENTINA, 2013-2022 (USD MILLION) 106
FIGURE 49 FLIP CHIP TECHNOLOGY MARKET SIZE IN OTHER COUNTRIES,
2013-2022 (USD MILLION) 106
FIGURE 50 EUROPE SNAPSHOT 110
FIGURE 51 APAC SNAPSHOT 113
FIGURE 52 COMPANIES ADOPTED COLLABORATIONS AS THE KEY GROWTH STRATEGY BETWEEN 2010 AND 2015 118
FIGURE 53 MARKET RANKING ANALYSIS FOR THE FLIP CHIP TECHNOLOGY MARKET, 2015 119
FIGURE 54 MARKET EVALUATION FRAMEWORK 120
FIGURE 55 BATTLE FOR MARKET SHARE: COLLABORATION WAS THE KEY STRATEGY 121
FIGURE 56 GEOGRAPHY REVENUE MIX FOR TOP FIVE PLAYERS 123
FIGURE 57 TSMC LTD.: COMPANY SNAPSHOT 124
FIGURE 58 TSMC LTD.: SWOT ANALYSIS 126
FIGURE 59 SAMSUNG ELECTRONICS CO., LTD.: COMPANY SNAPSHOT 128
FIGURE 60 SAMSUNG ELECTRONICS CO., LTD.: SWOT ANALYSIS 129
FIGURE 61 INTEL CORP.: COMPANY SNAPSHOT 130
FIGURE 62 INTEL CORP.: SWOT ANALYSIS 132
FIGURE 63 UNITED MICROELECTRONICS CORP.: COMPANY SNAPSHOT 133
FIGURE 64 ASE GROUP.: COMPANY SNAPSHOT 135
FIGURE 65 ASE GROUP: SWOT ANALYSIS 137

FIGURE 66 AMKOR TECHNOLOGY: COMPANY SNAPSHOT 138
FIGURE 67 AMKOR TECHNOLOGY: SWOT ANALYSIS 140
FIGURE 68 SPIL CO., LTD. : COMPANY SNAPSHOT 141
FIGURE 69 POWERTECH TECHNOLOGY, INC.: COMPANY SNAPSHOT 143
FIGURE 70 STATS CHIPPAC LTD.: COMPANY SNAPSHOT 145
FIGURE 71 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT 147

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  • October 2016
  • by MarketsandMarkets

“Growing demand for PoE-enabled products is fueling the growth of the power over Ethernet (PoE) solutions market.” The global power over Ethernet solutions market is expected to grow at a CAGR of ...

Global Digital Power Management ICs Industry

Global Digital Power Management ICs Industry

  • $ 4950
  • Industry report
  • September 2016
  • by Global Industry Analysts

This report analyzes the worldwide markets for Digital Power Management ICs in US$ Thousand by the following Application Types: Consumer Electronics, Data Communications, Computer Networks & Telecommunications, ...

Photonic Integrated Circuit Market Analysis By Component, Integration, Raw Material, Application And Segment Forecasts To 2024

Photonic Integrated Circuit Market Analysis By Component, Integration, Raw Material, Application And Segment Forecasts To 2024

  • $ 4950
  • Industry report
  • August 2016
  • by Grand View Research

The photonic IC market is expected to reach USD 3.54 billion by 2024 according to a new report by Grand View Research, Inc. Photonic IC is an integrated circuit that uses optical wavelength as an information ...


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