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Electrically conductive adhesives are used to form interconnects in a broad range of products and industries. Trends such as increasing numbers of LEDs and sensors, curved and flexible displays in more products, in-mould electronics, and thin film photovoltaics are placing more stringent requirements on ECAs and driving a $3.3 billion market by 2026.Materials are needed to replace the estimated 50,000 metric tons of tin-lead solder currently used each year, because of toxicity concerns, but there are no "drop-in" replacements for eutectic tin-lead solder. Electrically Conductive Adhesives (ECAs) are becoming increasingly common to replace solders in a variety of functions, applications and industries. This report covers the three main categories of conductive adhesives available as safe and environmentally-sound solder alternatives.

The key applications include:

- Photovoltaic modules - Traditional ECAs have suffered from poor stability when applied to copper and tin metals, but improved ECAs for PV applications have been available since 2010. Lower temperature interconnections can allow thinner wafers, and reduce warpage and breakage of solar cells. ECAs are expected to be used for interconnection in 20% of solar cells by 2025.
- LCD and OLED displays - ACFs have found a particular niche market in packaging flat panel displays.
- Touch panels - The damage to the substrates can be reduced by lowering the bonding temperature during assembly. ECAs can allow lower temperature bonding.
- LEDs - It is quick and cheap to mount LEDs using conductive adhesives and the thermal penalty is tolerable if the adhesive layer is kept thin.
- RFID chips - Conductive adhesives are used for mounting temperature-sensitive chips on smart cards, because of low curing temperatures.

There are increasing opportunities for these materials as these industries move towards curved screens, flexible displays, in-mould electronics, displays designed for automotive, and e-textiles, all of which have stringent requirements for conductive adhesives.

Isotropic Conductive Adhesives have a high loading of metallic fillers (often silver) and must be carefully screen-printed or dispensed into discrete dots. They are reliable and compatible with reel-to-reel processing. There is research towards using nano-sized fillers to enable ink-jetting for higher precision, and ensuring the ICP also works as a structural adhesive.

Anisotropic Conductive Pastes are simple and cost-effective because of the low-loading of filler particles and ease of processing. The minimum pitch width is poor, and so application is limited.

Currently, 74% of Anisotropic Conductive Film (ACF) is used in the manufacture of LCD or OLED displays. Displays are becoming more widely used in consumer electronics, aerospace, defence, automotive, and infrastructure sectors. UV-thermal cure mechanisms must be developed to lower cure temperature to allow plastic substrates for flexible displays. However, this market is still set to diversify with the market for ACF in non-display applications reaching over $1 billion by 2026, due to the reliable properties, thinness and ease of processing. Metallic coatings on polymeric particles will allow lower cost fillers.

This report offers worldwide coverage of the Electrically Conductive Adhesives, most of which are manufactured in Asia-Pacific but start-ups and innovation exists in Europe and North America. The report is based on extensive research, includes twelve primary interviews with the market leading manufacturers. It includes forecasts by revenue, split by technology and function, until 2026.

Table Of Contents

Electrically Conductive Adhesives 2016-2026 : Technologies, Markets, Forecasts and Opportunities
1. EXECUTIVE SUMMARY
1.1. Hierarchy
1.2. Comparison of solders to ECAs
1.3. Top three technical requirements
1.4. Forecasts
1.5. Conclusions
2. INTRODUCTION
2.1. The need to replace solder
2.2. Lead-free solders
2.3. Electronic Materials
2.4. Hierarchy
2.5. Conductive Adhesives vs Solders
2.6. Stability in Conductive Adhesive Market
3. ISOTROPIC VS ANISOTROPIC
3.1. Schematic of Interconnects
3.2. Factors which influence the choice of material
4. ISOTROPIC CONDUCTIVE PASTE (ICP)
4.1. Isotropic Conductive Paste
4.2. Composition
4.3. Resins
4.4. Key Parameters of Commercial ICP
4.5. Other Characteristics of Commercial ICP
4.6. Processing
4.7. Thermal Curing
4.8. ICP for printed electronics
4.9. Silver migration control
5. INNOVATIONS IN ICP
5.1. Conductive, structural adhesives
5.2. Reduced silver content
5.3. Nanotechnology
5.4. ICP for back-contact PV modules
6. ANISOTROPIC CONDUCTIVE ADHESIVES
6.1. Introduction
6.2. ACP vs ACF
7. ANISOTROPIC CONDUCTIVE PASTE
7.1. Anisotropic Conductive Pastes
7.2. Market Demands
7.3. Materials for ACPs
7.4. Properties of Commercial ACP
7.5. Nanotechnology in ACP
7.6. MesoGlue
8. FUNCTIONS OF ACPS
8.1. Display Interconnection
8.2. Chip-on-Glass
9. ANISOTROPIC CONDUCTIVE FILM
9.1. Anisotropic Conductive Film
9.2. ACF Introduction
9.3. ACF Bonding Process
9.4. Filler Particles
9.5. Filler Particle Examples
9.6. Thickness of commercially available products
9.7. Issues
9.8. Technical Developments
9.9. Key Application Opportunities
10. FUNCTIONS OF ACFS
10.1. Typical ACF Assemblies
10.2. Touch Panels
10.3. Sensors
11. INNOVATIONS IN ACF
11.1. Dexerials - Particle-Arrayed ACF
11.2. Hitachi Chemical
11.3. Nanotechnology in ACF
11.4. Transparent ACF
12. APPLICATIONS
12.1. Cameras
12.2. Displays
12.3. Photovoltaics
12.4. Interconnections for Photovoltaics
12.5. Advantages of using ECAs in PV applications
12.6. Market Share of ECAs in PV applications
12.7. LEDs and OLEDs
12.8. Optoelectronics
12.9. Smart Cards and RFID
13. EMERGING MARKETS
13.1. Automotive Electronics
13.2. Flexible Displays
13.3. Future of Flexible Displays in Portable Devices
13.4. Displays for automotive industry
13.5. In-mould electronics
13.6. OLED lighting
13.7. Thin Film Photovoltaics
13.8. Thin Film Photovoltaics
13.9. E-textiles
14. VALUE CHAIN
14.1. Value Chain
15. FINANCIALS
15.1. Isotropic Conductive Paste
15.2. ACF
15.3. ACF - Dexerials
16. FORECASTS
16.1. Forecast: ICP
16.2. Forecast: ACF by Function
16.3. Forecast: Revenue by Type
17. CONCLUSIONS
17.1. Conclusions
17.2. On-going research
18. MANUFACTURERS
18.1. IDTechEx Portal Profiles
19. COMPANIES PRODUCING ICP
19.1. Chemtronics
19.2. Daejoo
19.3. DELO
19.4. EMS
19.5. Epotek
19.6. Ferro
19.7. Heraeus
19.8. Nepes
20. COMPANIES PRODUCING ACP
20.1. DELO
20.2. Henkel
20.3. Panacol
20.4. Panacol Products
20.5. Sun Ray Scientific
20.6. Tatsuta
20.7. Three Bond
21. COMPANIES PRODUCING ACF
21.1. 3M
21.2. Btech
21.3. Hitachi Chemical
21.4. Kyocera
21.5. Tatsuta
22. COMPANY PROFILES
22.1. Creative Materials Inc.
22.2. Daejoo Electronic Materials Co., Ltd
22.3. Dai Nippon Printing
22.4. Dexerials America Corporation
22.5. Fujikura Kasei Co Ltd
22.6. Henkel
22.7. Mosaic Solutions AS
22.8. Nagase America Corporation
22.9. Seashell Technology
22.10. Showa Denko
22.11. TactoTek

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