The report highlights the rigid PCB. In 2010, the output value of PCB, a full-blown industry, grew by 23.8%, a record high since 1998. In 2011, the growth in output value slowed down to only 5.9%. And the figure in 2012 is expected to further trend down to roughly 4%.

PCB industry has its unique characteristics. Firstly, it requires demanding environmental-friendly standard and enterprises concerned are obliged to obtain pollution discharge permit from the government; secondly, as a energy-intensive industry, sufficient and steady water and power supply must be ensured; thirdly, it’s a capital-intensive industry that involves chemical engineering, machinery and electronics technologies, and a large number of skilled talents are in need. Therefore, it is difficult for PCB companies to relocate for sustained and long-term development.

Since H12010, the smart phone shipment has seen sharp increase, resulting in the strong demand for HDI applied in smart phones. In H2 2010, leading PCB manufacturers expanded their HDI capacities, but in Q4 2011, HDI experienced oversupply, pulling down capacity utilization. The production capacity of HDI concentrates in Taiwanese businesses. In 2011, the Taiwan dollar appreciated against the US dollar and the Taiwan-based PCB manufacturers witnessed handsome growth in revenue if calculated by the US dollar, while a meager increase if calculated by the Taiwan dollar.

The PCB applied in iPhone, Anylayer model, is the most advanced among PCB products and the major suppliers are Taiwanese businesses. Apple has a large number of rigid PCB suppliers, including Japan-based Panasonic, Ibiden and MEIKO, Taiwan-based Tripod, Unmicron, Compeq, America-based Multek and Austria-based AT&S. For Taiwan-based manufacturers, they provide close to 60% PCB products for Apple.

In 2011, a big change in PCB industry was the capacity transferred to Chinese Mainland centering in Hubei and Chongqing. The investment in Hubei included: the third batch of investment in Wuhan by Japan-based MEIKO, the investment in Wuhan by Beijing-based KDS, the investment in Xiantao by Tripod Technology Corporation and the investment in Huangshi by WUS Printed Circuit. And investors in Chongqing included: GBM, AT&S and HannStar Board. In addition, there were Huatao Electronics which invested in Suining of Sichuan, Taiwan PCB Techvest which invested in Chengdu and, Trendtronics and Huaxiang Circuit which invested in Jiujiang of Jiangxi.

Still, Yangtze River Delta is the first choice of PCB industry. New PCB entrants are piling into Kunshan and Wuxi markets, while the time-honored players are still on regular operation. Generally speaking, the PCB businesses to establish branches in Mainland China takes strategic development into account, and their main playing ground is still in Yangtze River Delta.

For PCB manufacturers, the traditional PCB products even Anylayer HDI which have seen tough competition and downward gross margin. Relatively, IC substrate features the highest gross margin among all the PCB products. In 2002, IC substrates made a success in mass production by a Japanese enterprise thanks to the assistance from Intel. The IC with the manufacturing process below 50nm requires using substrate, which originally found limited application in CPU, Graphics and Chipset. The boom of mobile phone industry presses the massive application of IC substrate in mobile phone CPU, memory and application processor. In the 4G era, IC substrate gets applied in almost all CPUs for mobile phones to avoid generating enormous heat.

Apart from mobile phone, other applications of IC substrate include HDTV, MPU of STB, base station and high-speed Networking IC. However, the biggest market of IC substrate lies in PC industry and the market is largely dominated by Japanese corporations. In 2012, the Japan-based NGK withdraw from the market and Taiwan-based Nanya PCB became a substitute. Whereas, the PC field has presented low growth but very high threshold admittance.

The IC substrate is not in blue-sea market any more, and the competition is very fierce. But for PCB leaders who seek for rising revenue, there are no way out but to expand IC substrate business. A case in point is Unimicron, the largest PCB supplier around the globe, which has intensified its investment in IC substrate industry in 2012. In addition, ZDT under Hon Hai also announced to made inroad in the area.

After the withdrawn of NGK, only 2 Japanese corporations left-Ibiden and Shinko. With high quoted prices, both of them mainly offer products for Intel. Ibiden is establishing its base in the Philippines, in a bid to lower the price. Both Ibiden and Shinko focus on ABF substrate and have no interest in BT substrate in the communication field.

When it comes to the South Korean manufactures, SEMCO involves in the widest range of businesses. On the one hand, it has the VIP customer of Qualcomm; and on the other hand, considerable ICs from its parent company-Samsung Electronics-are needed packaging by substrates. Besides, SEMCO also receives a small amount of orders from Intel or AMD. SIMMTECH is mainly engaged in the packaging of memory substrate. Also, SIMMTECH is a leading memory PCB manufacturer.

Among Taiwanese manufacturers, NANYA takes Intel as its major client, while Kinsus is a PCB supplier for Qualcomm and Broadcom, 90% shipment of which goes to BT substrate. Unimicron is focused on Graphics IC business.

Table Of Contents

Table of Contents
1. Overview of PCB Industry
1.1 Industrial Output Value
1.2 Recent Developments and Trends
1.3 PCB Industry in Taiwan
1.4 PCB Industry in Chinese Mainland
1.4.1 Industry Scale
1.4.2 Investment Projects and Positions of Major PCB Corporations in 2011
1.4.3 Policies on PCB Industry
1.5 PCB Industry in Europe

2. PCB Downstream Market
2.1 Mobile Phone
2.1.1 Global Market Size
2.1.2 Market Share of Brands
2.1.3 Smartphone Market and Industry
2.1.4 China Mobile Phone Industry by Region
2.1.5 Ranking by Output of Mobile Phone Corporations
2.2 Notebook
2.2.1 Global Market Size and Brand Pattern
2.2.2 Tablet PC Market

3. PCB Industry
3.1 PCB for Mobile Phone
3.1.1 Ranking of Mobile Phone PCB Corporations
3.1.2 Supply Relation of PCB Corporations for Mobile Phone Brands
3.2 PCB for Memory
3.3 Photovoltaic Panel
3.4 PCB for Automotive Electronics
3.5 PCB for Notebook
3.6 IC Substrate Industry
3.6.1 Profile
3.6.3 Technology Development
3.6.4 Market
3.6.5 Industry
3.7 Ranking of PCB Corporations Worldwide

4. PCB Corporations
4.1 Unimicron
4.2 Compeq
4.3 Hannstar Board
4.4 Gold Circuit Electronics
4.5 Tripod Technology
4.6 Meiko
4.7 CMK
4.7.1CMK Electronics (Wuxi)
4.7.2 CMK GBM
4.7.3 CMKC Dongguan
4.8 IBIDEN
4.9 Daeduck Electronics
4.10 TTM
4.11 Unitech PCB
4.12 ATandS
4.13 Kingboard
4.13.1 Elec and Eltek
4.13.2 Techwise Circuits
4.13.3 Express Electronics
4.14 SIMMTECH
4.15 Taiwan PCB TECHVEST
4.16 Ellington Electronics
4.17 Chin Poon Industrial
4.18 LG INNOTEK
4.19 SEMCO
4.20 Founder PCB
4.21 Gul Tech
4.22 Dynamic Electronics
4.23 Viasystems
4.24 Nanya PCB
4.25 Shennan Circuit
4.26 WUS Printed Circuit
4.27 Guangdong Goworld
4.28 ZDT
4.29 Multek
4.30 Kinsus
4.31 Shinko

Selected Charts

Output Value of PCB Industry, 2006-2012
Revenue of PCB Industry by Technology, 2009-2015E
Global CDMA/WCDMA Mobile Phone Shipment by Region, 2010-2012
Smartphone Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011
Output of Mobile Phones by Region in China, 2011
Shipment of Netbook, iPad and Tablet PC, 2008-2012
PCB Suppliers of Nokia Mobile Phone, 2010-2011
PCB Suppliers of Samsung Mobile Phone, 2010-2011
PCB Suppliers of LG Mobile Phone, 2011
PCB Suppliers of ZTE Mobile Phone, 2010-2011
PCB Suppliers of RIM Mobile Phone, 2010-2011
PCB Suppliers of Apple Mobile Phone, 2010-2011
Market Share of Memory PCB Manufacturers, 2010-2011
Market Share of Key Photovoltaic Panel Manufacturers, 2006, 2010 and 2011
Major Customers of IC Substrate Manufacters
Associate Companies of Hannstar Board
Revenue and Gross Margin of Hannstar Board, 2006-2011
Revenue and Gross Margin of Gold Circuit Electronics, 2005-2011
Revenue and Gross Margin of Tripod Technology, 2006-2011
Revenue and Operating Margin of Meiko, FY2006-FY2012
Revenue of Meiko by Application, FY2010-H1 FY2012
Revenue of Meiko by Technology, FY2010-H1 FY2012
Revenue and Operating Margin of CMK, FY2005-FY2012
Revenue of CMK by Application, FY2007-FY2015
Revenue of CMK by Technology, FY2007-FY2011
Revenue of CMK by Region, FY2007-FY2015
Revenue and Operating Margin of IBIDEN, FY2006-FY2012
Revenue of IBIDEN by Business, FY2006-Q3FY2012
Operating Income of IBIDEN by Business, FY2009-Q3FY2012
HDI Board Output of IBIDEN, 2008-2012
Revenue and Operating Margin of Daeduck Electronics, 2005-2012
Revenue of Daeduck Electronics by Business, 2009-2011
Revenue of Daeduck Electronics by Business, Q1 2010-Q4 2011
Revenue and Operating Margin of Daeduck GDS, 2005-2012
Revenue of Daeduck GDS by Business, 2010-2012
Revenue of TTM by Technology, Q1 2009-Q4 2010
Revenue and Gross Margin of Unitech PCB, 2006-2011
Revenue and EBITDA of ATandS, FY2006-FY2012
Output Value of ATandS by Region, FY2006-FY2012
Revenue of ATandS by Region, FY2011-FY2012
Revenue of ATandS by Application, FY2009-FY2011
Revenue of ATandS by Application, Q1FY2011-Q3FY2012
Production Capacity of Elec and Eltek by Plant, End 2010
Multi-layer Board Output of Express Electronics, 2004-2009
Two-sided Board Output of Express Electronics, 2004-2009
Revenue and Operating Margin of SIMMTECH, 2004-2012
Revenue and Operating Margin of SIMMTECH, Q1 2010-Q4 2011
Memory Revenue by SIMMTECH by Speed, Q1 2010-Q4 2011
Substrate Revenue of SIMMTECH by Product, Q1 2010-Q4 2011
Revenue of SIMMTECH by Application, Q1 2004-Q4 2010
Customer Distribution of SIMMTECH, 2004-2010
Plants of SIMMTECH
Revenue and Gross Margin of Taiwan PCB TECHVEST, 2005-2011
Equity Structure of Ellington Electronics
Revenue and Gross Margin of Chin Poon Industrial, 2005-2011
PCB Business Revenue of LG INNOTEK, Q4 2010-Q4 2011
Revenue of SEMCO by Division, 2010-2011
Revenue and Operating Margin of SEMCO ACI Business Division, Q1 2010-Q4 2011
Revenue and Operating Margin of Founder PCB, 2007-2011
Downstream Applications of Founder PCB, 2010
Capacity of Founder Chongqing Plant by Technology
Capacity of Zhuhai Founder No.1 Plant by Technology
Capacity of Zhuhai Founder No.3 Plant by Technology
Capacity of Zhuhai Founder No.5 Plant by Technology
Capacity of Founder Hangzhou No.2 Plant by Technology
Capacity of Zhuhai Founder No.4 Plant by Technology
Associate Companies of Gul Tech
Revenue and Gross Margin of Dynamic Electronics, 2006-2011
Production Capacity of Dynamic Electronics, 2009-2012
Revenue and Operating Margin of ViaSystems, 2006-2011
Revenue of ViaSystems by Business, 2008-2011
Global Presence of ViaSystems
Revenue of ViaSystems by Application, 2008-2011
Major Customers of ViaSystems
Production Capacity and Global Operations of Nanya PCB
Customer Structure of Nanya PCB, 2010
Revenue and Operating Income of WUS Printed Circuit, 2007-2011
Revenue of WUS Printed Circuit by Application, 2007-2010
Revenue and Operating Margin of Guangdong Goworld, 2005-2011
Organization of Guangdong Goworld
Revenue of Guangdong Goworld by Business, 2007-2011

Traditional PCB Revenue by Product, 2011
Revenue of Global PCB Industry by Region, 2000-2012
Revenue of Global PCB Industry by Region, 2010-2011
Revenue of Global PCB Industry by Application, 2010-2011
Revenue of Taiwan PCB Industry by Product, 2005-2011
Import and Export Value of Taiwan PCB Industry, 2000-2010
Revenue of Taiwan PCB Industry by Application, 2009-2010
Global Market Share of Taiwan Mobile Phone PCB Shipment, 2004-2012
Output Value of China PCB Industry, 2001-2012
Output Value by Product of Taiwanese PCB Manufacturers in Mainland China, 2004-2011
Output Value by Application of Taiwanese PCB Manufacturers in Mainland China, 2009-2010
Laser Drilling Machine Sales Volume in Taiwan and China, Q3 2005-Q3 2011
Investment Structure of PCB Companies in Chinese Mainland, 2010-2011
Revenue of European PCB Manufacturers by Country, 2010
Top 50 PCB Manufacturers in Europe, 2010
Global Shipment of Mobile Phones, 2007-2014
Global Shipment and Annual Growth Rate of Mobile Phones, Q1 2009-Q4 2011
Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
Shipment of Major Mobile Phone Vendors Worldwide, 2010-2011
Market Share of Smartphone OS, 2011
Mobile Phone Output by Province in China, Jan.-Nov., 2011
Ranking by Output of 45 Chinese Mobile Phone Manufacturers, 2011
Global Shipment of Notebook Computers and Growth Rate, 2007-2013
Shipment of Major Notebook Vendors Worldwide, 2010-2011
Market Share of Major Notebook Vendors Worldwide, Q4 2010-Q1 2012
Ranking of Mobile Phone PCB Manufacturers, 2010-2011
Market Share by Revenue of Automotive Electronics-used PCB Manufacturers, 2010-2011
Notebook-used PCB Technology Roadmap
Market Share by Shipment of Notebook-used PCB Manufacturers, 2011
Proportion of IC Substrate in PCB Industry, 2006-2015
Application Ratios of IC Substrate, 2011-2012
Revenue of Major IC Substrate Manufacturers, 2010-2011
Top 30 Rigid PCB Manufacturers Worldwide by Revenue, 2009-2011
Revenue and Gross Margin of Unimicron, 2003-2011
Revenue and Growth Rate of Unimicron, Q1 2009-Q4 2011
Revenue of Unimicron by Product, 2010-2011
Revenue of Unimicron by Application, 2010-2011
Distribution of Unimicron Production Bases
Mergers and Acquisitions of Unimicron in Past Years
Financial Data of Unimicron’s Main Subsidiaries, 2009-2010
Revenue and Gross Margin of Compeq, 2006-2011
Revenue and Growth Rate of Compeq, Jan.2010-Jan.2012
Financial Data of Compeq’s Main Subsidiaries, 2009-2010
Revenue and Growth Rate of Gold Circuit Electronics, Jan.2010-Jan.2012
Revenue of Gold Circuit Electronics by Product, 2010-2011
Revenue and Growth Rate of Tripod Technology, Jan.2010-Jan.2012
Production Capacity of Tripod Technology, 2006-2011
Revenue and Operating Margin of Main Subsidiaries of Meiko in Chinese Mainland, FY2009-FY2011
Revenue and Output of CMK Electronics (Wuxi), 2003-2010
Revenue of IBIDEN, 2007-2011
Revenue of Daeduck by Product, Q1 2011-Q1 2012
Revenue and Operating Income of TTM, 2004-2008
Revenue and Operating Margin of TTM, 2005-2011
Revenue of TTM by Application, 2008-2011
Revenue of TTM by Region, 2008-2011
Plants of TTM in China
Revenue and Growth Rate of Unitech PCB, Jan.2010-Jan.2012
Rigid Board Technology Roadmap
Flexible Board Technology Roadmap
Bases of ATandS Worldwide
Revenue of ATandS Bases by Product, 2011
Production Capacity of ATandS Bases, 2011
Organization of Kingboard Group
Revenue and Profit Margin Attributable to Shareholders of Kingboard Group, 2002-2011
Revenue of Kingboard Group by Business, 2008-2011
Organization of Elec and Eltek
Revenue of Elec and Eltek by Region, 2006-2011
Revenue of 2 Elec and Eltek by Technology, 2006-2011
Technology Capability of Elec and Eltek
Process Capability of Express Electronics, 2010
Revenue by Product of Memory Business Division of SIMMTECH, 2010-2012
Substrate Revenue of SIMMTECH by Product, 2010-2012
Production Capacity of SIMMTECH, Q1 2010-Q4 2011
Revenue and Growth Rate of Taiwan PCB TECHVEST, Jan.2010-Jan.2012
Customer Structure of Taiwan PCB TECHVEST, 2010
Production Capacity of Taiwan PCB TECHVEST by Plant, 2007-2011
Revenue and Gross Margin of Ellington Electronics, 2007-2011
Output of Ellington Electronics, 2007-Q3 2010
Production Capacity of Ellington Electronics, 2010-2011
Revenue of Ellington Electronics by Technology, 2001-2010
Revenue of Ellington Electronics by Application, 2007-Q3 2010
Revenue of Ellington Electronics by Region, 2007-Q3 2010
Revenue of Ellington Electronics by Customer, 2007-Q3 2010
Revenue and Growth Rate of Chin Poon Industrial, Jan.2010-Jan.2012
Monthly Capacity of Plants of Chin Poon Industrial, 2007-2010
Revenue and Operating Margin of LG INNOTEK, 2006-2011
Revenue of LG INNOTEK by Product, Q4 2010-Q4 2011
HDI Technology Capability of Founder PCB
Revenue and Operating Income of Gul Tech, 2005-2011
Revenue and Growth Rate of Dynamic Electronics, Jan.2010-Jan.2012
Major Customers of ViaSystems, 2008-2011
Revenue of ViaSystems by Destination, 2009-2010
Revenue and Gross Margin of Nanya PCB, 2006-2011
Revenue nd Growth Rate of Nanya PCB, Jan.2010-Jan.2012
Technology Capability of Shennan Circuit
Products by Layer of WUS Printed Circuit, 2010
Shipment by Layer of WUS Printed Circuit, 2007-2009
Revenue by Layer of WUS Printed Circuit, 2007-2009
Major Customers of WUS Printed Circuit, 2010
Output of Guangdong Goworld, 2007-2010
Organization of ZDT
Global Presence of ZDT
Revenue and Operating Margin of ZDT, 2008-2012
Workforce of ZDT, 2006-Jan.2011
ELIC Technology Roadmap of Multek, 2011-2013
Flex.and Rigid Board Technology Roadmap of Multek, 2011-2013
Microvias Technology Roadmap of Multek, 2011-2013
Revenue and Gross Margin of Kinsus, 2003-2012
Revenue and Growth Rate of Kinsus, Jan.2010-Jan.2012
Revenue of Kinsus by Product, 2011
Revenue of Kinsus by Application, 2011
Revenue and Net Income of Shinko, FY2007-FY2012
Revenue of Shinko by Business, FY2011-FY2012

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