INTRODUCTION

OBJECTIVES

This study focuses on plastics usage in electronic components; however, it is not a review of the electronic industry but deals with development of resins and resin grades to meet requirements of these electronic products used in computers, telecommunications, automotive, and other major industries employing these electronic components.

SCOPE AND FORMAT

This study covers all electronic components where plastics are used to a significant extent in mostly molding electronic components and excludes fiber optics, wire and cable, enclosures, recording media, etc. This study covers single devices (e.g., connectors, capacitors, switches, bobbins), multiple-component devices (e.g., printed circuit boards, interconnects, etc.) and encapsulants.

In addition, key participants in the electronic components industry in terms of resin producers, and molders are identified along with inclusion of key technologies, and the competitive resin scenario.

REASONS FOR DOING THE STUDY

Resin consumption in electronic components had been growing at rates well above the Gross Domestic Product (GDP) for many years. Aside from the recent “economic recovery,” there has been continued demand for electronic products, proliferation of new technologies, and “handling” of environmental pressures brought to bear on the industry has resulted in the need, in many instances, for higher performance plastics for many electronic components. Thus, it is appropriate for a new appraisal of this market at this time.

METHODOLOGY

A comprehensive review was undertaken of literature relating to resins used to produce electronic components, their applications, technology, markets and new developments. Included in the review were supplier trade literature, texts, and monographs. Unresolved issues were clarified by contact with those involved in the industry.

ABOUT THE AUTHOR

Research analyst Mel Schlechter has more than 40 years in the chemical industry, and specializes in plastics market research. He has been with BCC Research for more than 10 years and holds a B.S. in chemistry, an M.S. in organic chemistry, and an M.B.A. in marketing.

Table Of Contents

TABLE OF CONTENTS

CHAPTER ONE: INTRODUCTION 1
OBJECTIVES 1
SCOPE AND FORMAT 1
REASONS FOR DOING THE STUDY 1
METHODOLOGY . 1
ABOUT THE AUTHOR 2
RELATED BCC REPORTS 2
BCC ONLINE SERVICES 2
DISCLAIMER . 2
CHAPTER TWO: SUMMARY 3
SUMMARY TABLE GLOBAL ELECTRONIC COMPONENTS MARKET
BY TYPE OF RESIN, THROUGH 2017 (MILLION POUNDS) 3
SUMMARY FIGURE GLOBAL ELECTRONIC COMPONENTS MARKET
BY TYPE OF RESIN, 2011-2017 (MILLION POUNDS) 4
SUMMARY (CONTINUED) . 5
CHAPTER THREE: RESINS USED IN ELECTRONIC COMPONENTS 6
OVERVIEW . 6
TYPES OF RESINS 6
THERMOPLASTICS 7
STYRENICS . 7
High Impact Polystyrene (HIPS) 7
Background . 7
Properties 7
Applications . 7
Reinforced Polystyrene Products 8
Styrenic Polymer Producer Scenario 8
The New Domestic Styrenic Scenario . 9
Processing 9
Overview 9
TABLE 1 FABRICATION METHODS AND USES FOR POLYSTYRENE 10
Injection Molding 10
NYLONS . 10
Background 10
Properties 11
Major Types . 11
Nylon 66 11
Nylon 6 12
Similarities and Difference between Properties of
Nylon 6 and Nylon 66 12
TABLE 2 COMPARISON OF NYLON 6 AND NYLON 66 PROPERTIES . 12
Other Nylons 13
Overview 13
Nylon 46 13
Nylon 6/9 . 13
Nylon 6/10 and Nylon 6/12 . 13
Nylon 11 13
Nylon 12 14
Reinforced Nylons 14
Background . 14
Processing 14
Electric/Electronic Applications 15
TABLE 3 EXAMPLES OF NYLON RESINS USED TO MOLD
ELECTRONIC COMPONENTS . 15
Market Estimates and Forecasts 16
TABLE 4 GLOBAL NYLON MARKET FOR ELECTRONIC
COMPONENTS, THROUGH 2017 (MILLION POUNDS) 16
Recent Developments 17
New Nylon Resins Target Electronic Uses 17
DuPont Expands Asia Nylon Compounding 17
Ascend Performance Materials LLC Plans
Increases in Number of Nylon Plants . 17
DSM Buys Mitsubishi Chemical’s Novamid 17
DSM Increases Capacity for New Nylon Grades . 17
New Nylon Grades for High-Current Circuit
Breakers . 17
Arkema Increasing Nylon Production in China 18
Solvay Advanced Polymers Buys Rhodia . 18
THERMOPLASTIC POLYESTERS 18
Background 18
Polybutylene Terephthalate (PBT) . 18
Background . 18
Properties 19
Applications . 19
Selected Key PBT Trade Names 20
New Developments and Products. 20
PBTs Developed for MIDs 20
New Chinese PBT Plant . 21
Non-Halogenated PBTs for E/E Products 21
Polyethylene Terephthalate (PET) . 21
Overview 21
Properties and Grades 21
Modified PET Resins 22
Engineering-Grade PET . 23
Reinforced PET . 23
Electronic/Electrical Applications 24
Producers and Capacities . 25
Specific PET Products Used to Mold Electronic
Components . 25
New Developments . 25
Indorama Bought Several Eastman Units 25
Japanese Firms Merge Their Respective PET
Businesses 26
DAK Americas Completed the Eastman
Withdrawal from the PET Business . 26
DAK Americas Also Purchased Wellman’s
PET Business . 26
MandG Group is Planning a new PET Plant 26
Polycyclohexyldimethylene Terephthalate (PCT) 26
Background . 26
Properties 27
Ticona Engineering Polymers . 27
Market Estimates and Forecasts . 28
TABLE 5 GLOBAL PBT ELECTRONIC COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 28
TABLE 6 GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 29
POLYPHENYLENE SULFIDE (PPS) . 29
Background 29
Properties . 29
Advantages and Disadvantages 30
Applications . 31
Other Technology Considerations . 31
Producers . 31
New Developments 32
Chinese Company Claims Large PPS Capacity 32
Low-Chlorine PPS Geared for E/E Applications . 32
PPS Grades for Thin-Walling and High-Flow
Characteristics . 33
Dainippon Ink (DIC) Acquires Solvay’s PPS
Compounding Business in Europe 33
Market Estimates and Forecasts 33
TABLE 7 GLOBAL PPS ELECTRONIC COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 34
POLYIMIDES/PEI/PAI 34
Background 34
Properties . 35
Early E/E Applications 35
Vespel Parts . 36
A Major Electric/Electronic Application—Dielectric
Interlayers 36
Polyimide Films . 37
Polyetherimides (PEIs) 38
Background . 38
Properties 38
Applications . 39
Polyamide-imides (PAIs) . 39
Background . 39
Properties 39
Applications . 40
Producers . 40
New Developments . 40
Polyetheramides Used to Produce Fiber-Optic
Connectors . 40
Sabic Increases Ultem Production in Spain 41
New Thermoplastic Polyimide Blends . 41
Market Estimates and Forecasts 41
TABLE 8 GLOBAL POLYIMIDE ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 41
POLYCARBONATES . 42
Background 42
General Grades 42
Properties . 42
Overview 42
Property Advantages and Disadvantages 43
Polyester Carbonates . 43
Impact of Bisphenol A on Polycarbonate Usage . 44
Processing 44
Applications . 44
Alloys/Blends . 44
Marketing 45
Fiber-Reinforced Polycarbonates . 45
Producers and Capacities 45
Producers and Capacities (Continued) 46
TABLE 9 MAJOR POLYCARBONATE PRODUCERS AND TRADE
NAMED PRODUCTS 47
A New Development—Thinnest Commercial
Polycarbonate . 47
Market Estimates and Forecasts 47
TABLE 10 GLOBAL POLYCARBONATE ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) 48
POLYPHTHALAMIDES (PPA) . 48
Background 48
Properties and Applications 49
Producers . 50
Market Estimates and Forecasts 50
TABLE 11 GLOBAL POLYPHTHALAMIDE ELECTRONIC
COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 50
New Developments 51
New Grades of Polyphthalamide Have High Flow
and Reflectivity 51
Improved Corrosion-Resistant PPA Grades 51
LIQUID CRYSTAL POLYMERS (LCP) 51
Background 51
Properties . 51
Applications . 52
Background . 52
Electrical/Electronics 52
LCP Fiber-Reinforced Products 53
Producers . 53
New Developments and Products . 54
New Reinforced Grades 54
LCP Finds Growth in Smaller and Thinner
Connectors . 54
MIDs Using LCPs . 54
LCPs Provide High Heat Resistance 54
Ticona Now Producing LCPs in China . 54
Market Estimates and Forecasts 55
TABLE 12 GLOBAL ELECTRONIC COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 55
POLYSULFONES 56
Background 56
Types of Polysulfones 56
Overview 56
Polyarylsulfones 57
Grades 57
Properties . 57
Applications of Polysulfones 57
Electrical/Electronic Applications . 58
Producer Scenario 58
Solvay 58
RTP 59
Sumitomo Chemical 59
Polysulfone Producers and Trade Named Products . 59
Recent Developments 59
BASF Low-Friction Wear Polysulfone Grades 59
BASF to Build Plant in Asia. 59
Market Estimates and Forecasts 60
TABLE 13 GLOBAL POLYSULFONE ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) 60
ALLOYS/BLENDS . 60
Background 60
PPO/HIPS 61
Background . 61
Properties 61
Grades . 61
Applications . 62
PPO/Nylon . 62
Background and Properties 62
Grades and Applications . 63
Use of PC/PBT Blends . 63
Recent Alloy/Blend Developments 63
New LCP/PPS Alloys Aim for Complex Parts . 63
PEEK/PBI Blends for High Heat Applications 64
Market Estimates and Forecasts 64
TABLE 14 GLOBAL POLYMER ALLOY/BLEND ELECTRONIC
COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 64
FLUOROPOLYMERS 65
Background 65
Properties and Applications 65
Producers . 65
Market Estimates and Forecasts 65
TABLE 15 GLOBAL FLUOROPOLYMER COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 66
POLYKETONES 66
Background 66
Properties . 66
Polyketone Composites 67
Applications . 67
Producers . 67
Recent Developments 68
Daicel-Evonik Joint Venture 68
Victrex Activities . 68
New Polyketones Can Provide Lower Cost and/or
Higher Performance 68
Market Estimates and Forecasts 68
TABLE 16 GLOBAL POLYKETONE ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 69
THERMOPLASTIC MARKET ESTIMATES AND FORECASTS
SUMMARY 69
TABLE 17 GLOBAL TOTAL THERMOPLASTIC RESIN MARKET FOR
ELECTRONIC COMPONENTS, THROUGH 2017 (MILLION
POUNDS) . 70
THERMOSET RESINS 70
OVERVIEW 70
FIBER-REINFORCED GRADES 71
GENERAL PROPERTIES . 71
TABLE 18 FIBER-REINFORCED THERMOSET PROPERTIES AND
MANUFACTURING PROCESSES 71
EPOXY RESINS . 71
Background 71
Chemistry . 72
Chemical Epoxy Types 72
Processing 72
Technology . 73
Epoxy Systems . 73
Background . 73
Non-Molded . 73
Laminating Systems . 73
Molded Epoxies . 74
Advanced Epoxy Composites 74
General Applications . 74
Electronic Applications 75
Molded Epoxies . 76
Important Epoxy Grades and Producers 76
Market Estimates and Forecasts 76
TABLE 19 GLOBAL EPOXY RESIN ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 77
POLYURETHANES . 77
Background 77
Polyureas 78
RIM Products . 78
RRIM Products 78
SRIM Products . 79
Additional Details 79
Applications . 79
Key Polyurethane Suppliers . 79
Market Estimates and Forecasts 80
TABLE 20 GLOBAL POLYURETHANE ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 80
PHENOLICS 80
Background 80
Grades 81
Molding Compounds 81
Background . 81
Typical Applications for Phenolic Molding
Compounds 82
Electric/Electronic Applications 82
Producers . 83
Market Estimates and Forecasts 83
TABLE 21 GLOBAL PHENOLIC ELECTRONIC COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 83
UNSATURATED POLYESTERS 84
Background 84
Ingredients of Unsaturated Polyester Formulations . 84
TABLE 22 INGREDIENTS OF UNSATURATED POLYESTER
FORMULATIONS IN DESCENDING ORDER OF COMMERCIAL
USE . 85
Applications . 85
Overview 85
Electrical/Electronic 86
Market Estimates and Forecasts 86
TABLE 23 GLOBAL UNSATURATED POLYESTER COMPONENT
MARKET, THROUGH 2017 (MILLION POUNDS) . 87
DIALLYL PHTHALATE (DAP) . 87
Overview 87
Background and Applications . 87
Producers . 88
Market Estimates and Forecasts 88
TABLE 24 GLOBAL DAP ELECTRONIC COMPONENT MARKET,
THROUGH 2017 (MILLION POUNDS) 88
BT-EPOXY RESINS AND CYANATE ESTERS . 88
COMPOSITES 89
THERMOSET MARKET ESTIMATE AND FORECAST
SUMMARY 90
TABLE 25 GLOBAL TOTAL THERMOSET RESIN ELECTRONIC
COMPONENT MARKET, THROUGH 2017 (MILLION POUNDS) 90
CHAPTER FOUR: RECENT RESIN DEVELOPMENTS RELATED TO
ELECTRONIC COMPONENTS 91
DUPONT ACTIVITIES . 91
CHAPTER FIVE: TICONA ADVANCES . 92
BAYER MATERIAL SCIENCE DEVELOPMENT . 92
CHAPTER SIX: ELECTRONIC COMPONENT PRODUCTS 93
INTRODUCTION . 93
ACTIVE DEVICES . 93
ACTIVE/PASSIVE DEVICES 93
PASSIVE DEVICES 93
FOCUS OF THIS REPORT 94
DIELECTRIC PROPERTIES OF PLASTICS 94
OVERVIEW 94
BACKGROUND . 94
TABLE 26 DIELECTRIC CONSTANTS OF SELECTED MATERIALS
(DK) . 95
TABLE 27 DIELECTRIC CONSTANTS FOR SELECTED
THERMOPLASTICS (DK) 95
RESIN CONSUMPTION 96
BACKGROUND . 96
MARKETS 96
GROWTH 96
TECHNOLOGIES 97
REINFORCED PLASTICS MOVE AHEAD IN ELECTRONICS 97
PRINTED CIRCUIT BOARDS (PCBS) 97
BACKGROUND . 97
OVERVIEW 98
PROPERTY REQUIREMENTS . 98
Electrical 98
Mechanical . 99
Other Property Requirements. 99
PHYSICAL COMPOSITION . 99
ASSEMBLY TECHNOLOGIES . 99
ISSUES FACING PLASTICS USAGE 100
PCB SUBSTRATES . 100
TABLE 28 IMPORTANT TECHNICAL FACTORS TO CONSIDER
WHEN SELECTING PCB SUBSTRATE MATERIALS 100
RIGID SUBSTRATES 101
Overview 101
Standard FR-4 Epoxy Resin 101
SPECIFIC MATERIALS USED IN PCBS 102
Higher-Performance Epoxies 102
Polyimides 102
Cyanate Esters 102
Silicon-Carbon . 103
PTFE 103
BT Resins . 103
Phenolics 103
Melamine . 103
Other Materials . 103
Copper Foils 103
Glass Cloth 104
Types of Reinforcements . 104
OTHER DEVELOPMENTS . 104
Impact of Lead-Free Soldering 104
Aramid Fibers 105
Production of Rigid PCBs 105
NEW DEVELOPMENTS . 106
ENVIRONMENTAL ISSUES 106
Overview 106
Some Recycling Technologies for PCBs . 106
FLEXIBLE PRINTED CIRCUIT BOARDS 107
Background 107
Technology . 107
Standards . 107
Advantages 107
Materials Used . 108
Overview 108
Polyimides . 108
Polyesters 108
Liquid Crystalline Polymers. 108
Aramids . 109
Epoxy Resins . 109
Adhesiveless Laminates . 109
Rigid-Flex Circuits. 109
Comparison Between Rigid and Flexible Circuit Boards 109
TABLE 29 COMPARISON BETWEEN RIGID AND FLEX CIRCUIT
BOARDS . 110
SOLDERING 110
Background 110
Some Technologies . 110
Lead-Free Electronic Soldering 111
PRODUCTION STATISTICS 111
INDUSTRY TRENDS 112
MARKET SIZES . 112
MARKET ESTIMATES AND FORECASTS . 113
TABLE 30 TOTAL GLOBAL PCB MARKET BY RESIN TYPE
THROUGH 2017 (MILLION POUNDS) 113
TABLE 31 GLOBAL PCB MARKET BY THERMOSET RESIN
THROUGH 2017 (MILLION POUNDS) 114
TABLE 32 GLOBAL PCB MARKET BY THERMOPLASTIC RESIN,
THROUGH 2017 (MILLION POUNDS) 114
ELECTRONIC PACKAGING . 114
OVERVIEW 114
BACKGROUND . 115
THROUGH-HOLE TECHNOLOGY— A TYPE OF PCB
ASSEMBLY . 115
WIRE BONDING . 116
TAPE AUTOMATED BONDING (TAB) . 116
Overview 116
Advantages 116
CHIP-ON-BOARD (COB) . 117
Background 117
Advantages 117
Substrate Materials . 118
FLIP CHIP BONDING 118
DUAL-IN-LINE 119
SURFACE-MOUNT TECHNOLOGY (SMT) 119
Background 119
The Process 119
Additional Details 120
Design and Manufacturing Process 120
Advantages Versus Through-Hole 121
Wave Soldering Moving to Vapor Phase/IR 121
Resin and Material Usage . 122
More Details on the Competitive Resin Scenario with
SMT and Previously Discussed Electronic Packaging
Technologies . 122
OTHER KEY, SELECTED ELECTRONIC
PACKAGING/INTERCONNECTION TECHNOLOGIES 123
Multichip Modules (MCMs). 123
Definitions . 123
Background . 123
Rationale for Use 123
Types of MCMs 124
Materials Used 124
Problems for MCMs 124
Pin Grid Arrays (PGAs) 125
Overview 125
DGA Versus BGA 125
High-Density Chips . 125
Background . 125
Technology . 126
Materials Used . 126
Background . 126
Epoxy Alternatives . 126
Alternatives with Polyimides . 127
MOLDED/3D PCBS . 127
Background 127
Technology . 128
Manufacturing . 128
History 128
How Do They Differ From PCBs? . 129
Materials Used . 129
Market Target 129
Process Technologies . 129
Impact of MIDs 130
New Plastics for MIDs . 130
Lanxess 130
BASF . 131
Ticona 131
Evonik 131
ENCAPSULANTS 131
Definitions and Background . 131
Primary Purposes of Encapsulation . 132
Organic Encapsulants . 133
Overview 133
Background . 133
Impact of Thermoplastics . 133
Background . 133
Types and Application Modes . 134
TABLE 33 ENCAPSULANTS - APPLICATION MODE, ADVANTAGES
AND DISADVANTAGES . 134
Epoxy Encapsulation Formulations 134
TABLE 34 EPOXY ENCAPSULANT FORMULATIONS . 135
Encapsulated Electrical Components . 135
Background . 135
Specific Encapsulant Applications . 136
Epoxy Encapsulant Systems 136
Specifications and Standards 137
Overview 137
UL 1694 Looks at Circuit Boards . 137
Silicone Encapsulants . 138
Major Selected Encapsulant Producers and Their Product
Lines . 139
Huntsman 139
Lord Chemical . 139
Loctite 139
TABLE 35 SELECTED ENCAPSULANT SUPPLIERS . 140
A New Development 140
Market Estimates and Forecasts 140
TABLE 36 GLOBAL ELECTRONIC ENCAPSULATION MARKET BY
RESIN TYPE, THROUGH 2017 (MILLION POUNDS) . 141
TABLE 37 GLOBAL ENCAPSULANT MARKET BY THERMOSET
RESIN, THROUGH 2017 (MILLION POUNDS) . 141
TABLE 38 GLOBAL ENCAPSULATION MARKET BY
THERMOPLASTIC RESIN, THROUGH 2017 (MILLION POUNDS) 142
CHAPTER SEVEN: MOLDED ELECTRONIC PRODUCTS . 143
OVERVIEW . 143
BACKGROUND . 143
RESINS USED . 143
DEMAND 144
TABLE 39 DEMAND FOR PASSIVE ELECTRONIC COMPONENTS (%) 144
MARKET DRIVERS . 144
CONNECTORS 145
Background 145
Trends 145
Materials and Applications for Electronic Connectors 145
Industrial Applications 146
Function of Connectors 146
The Industry 146
Electronic Connector Types . 146
Resin Selection . 146
Resin Selection (Continued) . 147
Standards . 148
NEMA AND ANSI 148
Manufacturers . 148
TABLE 40 SELECTED MANUFACTURERS OF HIGH DENSITY,
MULTIPIN CONNECTORS 149
End-Use Markets . 149
Background . 149
Communications Industry 150
Automotive Industry . 150
Background . 150
Resin Scenario . 150
Other Markets . 151
New Resin Developments 151
New Polyester Advantages . 151
Nylon Activities . 151
Market Estimates and Forecasts 152
TABLE 41 GLOBAL CONNECTOR MARKET BY RESIN THROUGH
2017 (MILLION POUNDS) 152
TABLE 42 GLOBAL CONNECTOR MARKET BY THERMOPLASTIC
RESIN THROUGH 2017 (MILLION POUNDS) 153
TABLE 43 GLOBAL CONNECTOR MARKET BY THERMOSET RESIN,
THROUGH 2017 (MILLION POUNDS) 153
SWITCHES . 154
Background 154
Market Estimates and Forecasts 154
TABLE 44 GLOBAL SWITCH MARKET BY RESIN, THROUGH 2017
(MILLION POUNDS) 155
TABLE 45 GLOBAL SWITCH MARKET BY THERMOPLASTIC
RESINS, THROUGH 2017 (MILLION POUNDS) 155
TABLE 46 GLOBAL SWITCH MARKET BY THERMOSET RESIN,
THROUGH 2017 (MILLION POUNDS) 156
BOBBINS 156
Background 156
TABLE 47 SELECTED BOBBIN MOLDERS . 157
Market Estimates and Forecasts 157
TABLE 48 GLOBAL BOBBIN MARKET BY RESIN, THROUGH 2017
(MILLION POUNDS) 157
TABLE 49 GLOBAL BOBBIN MARKET BY THERMOPLASTIC RESIN,
THROUGH 2017 (MILLION POUNDS) 158
TABLE 50 GLOBAL BOBBIN MARKET BY THERMOSET RESINS,
THROUGH 2017 (MILLION POUNDS) 158
RELAYS 159
Background 159
Market Estimates and Forecasts 159
TABLE 51 GLOBAL RELAY MARKET BY RESIN THROUGH 2017
(MILLION POUNDS) 159
TABLE 52 GLOBAL RELAY MARKET BY THERMOPLASTIC RESIN,
THROUGH 2017 (MILLION POUNDS) 160
TABLE 53 GLOBAL RELAY MARKET BY THERMOSET RESIN,
THROUGH 2017 (MILLION POUNDS) 160
CAPACITORS. 160
Background 160
Applications . 161
Dielectric Materials . 161
Capacitor Types . 161
Consumption by Market Segment 162
Market Estimates and Forecasts 162
TABLE 54 TOTAL GLOBAL CAPACITOR MARKET BY
THERMOPLASTIC RESIN THROUGH 2017 (MILLION POUNDS) 163
OTHER MOLDED ELECTRONIC COMPONENTS 163
Resistors . 163
Background . 163
Applications . 164
Inductors/Transformers. 164
Plastic Usage . 165
Market Estimates and Forecasts (Other Molded
Electronic Components) . 165
TABLE 55 OTHER GLOBAL ELECTRONIC COMPONENT MARKET
BY RESINS, THROUGH 2017 (MILLION POUNDS) . 165
TABLE 56 GLOBAL OTHER ELECTRONIC COMPONENT MARKET
BY THERMOPLASTIC RESIN, THROUGH 2017 (MILLION
POUNDS) . 166
TABLE 57 GLOBAL OTHER ELECTRONIC COMPONENT MARKET
BY THERMOSET RESIN, THROUGH 2017 (MILLION POUNDS) . 166
CHAPTER EIGHT: RECENT PATENTS RELATED TO THE INDUSTRY . 167
RECENT PATENTS RELATED TO THE INDUSTRY . 167
RECENT PATENTS RELATED TO …(CONTINUED) . 168
RECENT PATENTS RELATED TO …(CONTINUED) . 169
SUMMARY OF MARKET ESTIMATES AND FORECASTS FOR
ELECTRONIC DEVICES . 170
TABLE 58 TOTAL GLOBAL RESIN ELECTRONIC COMPONENT
MARKET BY APPLICATION, THROUGH 2017 (MILLION POUNDS) 170
TABLE 59 TOTAL THERMOPLASTIC RESIN ELECTRONIC
COMPONENT MARKET BY APPLICATION, THROUGH 2017
(MILLION POUNDS) 171
TABLE 60 TOTAL GLOBAL THERMOSET PLASTIC ELECTRONIC
COMPONENT MARKET BY APPLICATION, THROUGH 2017
(MILLION POUNDS) 172
CHAPTER NINE: CHANGES IN ELECTRONIC COMPONENT
MANUFACTURE WHICH COULD IMPACT RESIN CHOICES 173
CHANGES IN ELECTRONIC COMPONENT… 173
CHANGES IN ELECTRONIC COMPONENT…(CONTINUED) 174
CHAPTER TEN: APPLICATIONS AND INDUSTRY TRENDS 175
OVERVIEW . 175
SNAPSHOT OF THE ELECTRONIC DEVICE MARKET . 175
EXAMPLES OF STATIONARY ELECTRONIC DEVICES 176
COMPUTERS . 176
Overview 176
Desktops . 177
ELECTRONIC DISPLAYS 177
Background 177
Flat-Panels Displays . 178
The Future of CRT Technology . 178
PRINTERS 179
Overview 179
Ink Jet printers 179
Monochrome Laser Printers 179
Color Laser Printers 179
Manufacturers . 179
Printer Market Matures 180
“ALL-IN-ONE” MACHINES 180
PHONES . 180
Corded 180
Cordless 180
FACSIMILE MACHINES (FAX MACHINES) . 181
Overview 181
Background 181
SCANNERS 181
Background 181
EXAMPLES OF MOBILE ELECTRONIC DEVICES . 182
CELLULAR PHONES . 182
History 182
Overview 182
Producers . 182
Current Market Update 182
NOTEBOOKS/NETBOOKS . 183
Overview 183
Netbooks. 183
TABLETS/I-PADS 184
E-READERS . 184
I-PODS/MP3 . 185
COMBINATION-TYPE MOBILE ELECTRONIC
ENCLOSURES 185
SPECIAL END-USE MARKET FOR PLASTIC ELECTRONIC
COMPONENTS —AUTOMOTIVE UNDER-THE HOOD . 185
OVERVIEW 185
TABLE 61 HISTORICAL, CURRENT AND PROJECTED U.S.
AUTOMOTIVE SALES (MILLION UNITS) 185
TABLE 62 ESTIMATED HYBRID SALES FOR THE U.S. (THOUSAND
UNITS) . 186
CAFÉ ISSUES 186
OVERVIEW OF ELECTRONIC COMPONENTS 187
FLEXIBLE CIRCUITRY 188
MATERIAL USAGE . 189
EXPANDED USE OF ENCAPSULATED COMPONENTS . 190
BOBBINS/CONNECTORS 190
SWITCHES/SOCKETS 191
IGNITION COMPONENTS . 191
CHAPTER ELEVEN: TECHNOLOGY TRENDS RELATED TO
ELECTRONIC COMPONENTS 192
BACKGROUND 192
IMPORTANCE OF MINIATURIZATION . 192
PACKAGING . 193
CONCEPT OF MICROMOLDING . 193
REPLACEMENT OF CERAMICS WITH PLASTICS . 194
THIN-WALLING ELECTRONIC COMPONENTS . 195
BACKGROUND . 195
THIN-WALLING IS NOT A NOVEL CONCEPT . 195
EFFECTS ON PERFORMANCE REQUIREMENTS AND
DESIGN . 195
APPLICATION REQUIREMENTS . 196
MATERIAL AND PROCESS SELECTION 196
PROPERTIES REQUIRED . 197
CHALLENGES IN DOWNSIZING . 198
SOFTWARE THAT AIDS THIN-WALL DESIGN 198
PRINTED ELECTRONICS 198
FLEXIBLE ELECTRONICS 199
Overview 199
Concept of Plastic Electronics . 199
Concept of Plastic Electronics (Continued) 200
Advantages 201
Potential Market Size 201
CHAPTER TWELVE: ELECTRONIC COMPONENT INDUSTRY
OVERVIEW 202
TOP ELECTRONIC INDUSTRY MANUFACTURERS 202
TABLE 63 TOP GLOBAL SEMICONDUCTOR COMPANIES—2010 ($
BILLIONS) . 202
MARKETING ASPECTS 203
OUTSOURCING 203
WHAT PLASTIC MOLDERS ARE DOING 203
UPSTREAM MANUFACTURING 204
CONTRACT MANUFACTURING . 204
CHAPTER THIRTEEN: RESIN PRODUCERS 205
OVERVIEW . 205
TABLE 64 TRADE NAMES OF SELECTED, KEY RESINS USED IN
ELECTRONIC COMPONENTS AND RELATED ELECTRONIC
PRODUCTS 205
TABLE 64 (CONTINUED) . 206
TABLE 64 (CONTINUED) . 207
TABLE 64 (CONTINUED) . 208
MAJOR RESIN PRODUCERS SUPPLYING PRODUCT TO THE
ELECTRONIC COMPONENT MARKET 208
THERMOSETS. 208
Epoxies . 208
Polyurethanes 208
Phenolics 208
Polyesters . 209
DAP 209
THERMOPLASTICS 209
Nylons 209
Polyesters . 209
PPS . 210
Polyimides 210
Polycarbonates . 210
LCPs . 210
Polysulfones . 210
Fluoropolymers 211
Polyphthalamides 211
Polyketones 211
Polymer Alloys/Blends . 211
New Developments 211
DuPont Sells Several Resins to Ticona 211
DuPont Resumes Delayed Chinese Expansion
Plans . 211
Solvay Advanced Polymers Moves Further into the
Electronics Market 212
Ticona to Produce LCPs in China 212
Dow Chemical Merges its Plastic Unit 212
Styron to Become Trineseo . 212
BASF and Ineos Combine Styrenics Business 212
BASF Introduces New Grades for Electronic
Components . 213
CHAPTER FOURTEEN: PRICING . 214
TABLE 65 LIST PRICES FOR SELECTED RESINS USED TO MOLD
ELECTRONIC COMPONENTS ($/LB) . 214
CHAPTER FIFTEEN: MOLDERS OF ELECTRONIC COMPONENTS . 215
TABLE 66 TOP ELECTRICAL/ELECTRONIC INJECTION MOLDERS
($ MILLIONS) 215
CHAPTER SIXTEEN ENVIRONMENTAL ISSUES . 216
OVERVIEW . 216
PRINTED CIRCUIT BOARD DISPOSAL . 216
HALOGEN-FREE PRINTED CIRCUIT BOARDS 216
RECYCLING . 217
ELECTRONIC INDUSTRY INTERFACE . 217
OVERVIEW 217
REASONS FOR INCREASED ENVIRONMENTAL
REGULATIONS FOR ELECTRONIC EQUIPMENT . 218
THE EUROPEAN UNION’S ROHS DIRECTIVE 219
THE WEEE DIRECTIVE . 220
CHAPTER SEVENTEEN: TESTING AGENCIES AND REQUIREMENTS
RELATED TO ELECTRONIC COMPONENTS 221
OVERVIEW . 221
FIRE PROTECTION STANDARDS FOR ELECTRONIC
COMPONENTS . 221
UNDERWRITERS LABORATORIES (UL) . 221
BACKGROUND . 221
FLAMMABILITY STANDARDS . 222
Definitions 222
Flammability Tests 223
Overview 223
UL 94 Vertical Burn Tests . 223
TABLE 67 CRITERIA FOR UL 94V CLASSIFICATIONS
(INCHES/MINUTE) . 224
UL Horizontal Burn Test (UL 94 HB) . 224
Summary of UL 94 Material Ratings . 224
TABLE 68 BURN SPECIFICATION FOR UL 04 MATERIAL RATINGS 224
UL 1950 . 225
CHAPTER EIGHTEEN: SELECTED COMPANY PROFILES 226
AOC, INC. 226
ASAHI KASEI CHEMICAL . 226
ASHLAND SPECIALTY CHEMICALS . 226
BASF 227
BAYER MATERIAL SCIENCE 227
CHEVRON PHILLIPS CHEMICAL 228
CYTEC INDUSTRIES, INC. 228
DSM ENGINEERING PLASTICS . 229
DUPONT, INC. . 229
EMS GRIVORY, INC. . 230
HUNTSMAN ADVANCED MATERIALS 230
INTERPLASTIC CORPORATION . 231
LOCTITE, INC. . 231
MITSUBISHI ENGINEERING PLASTICS . 232
QUANTUM COMPOSITES 232
ROGERS CORPORATION . 233
SABIC INNOVATIVE PLASTICS . 233
SOLVAY ADVANCED POLYMERS LLC 234
SUMITOMO BAKELITE NORTH AMERICA 234
TICONA, INC. . 235
TORAY PLASTICS . 236
VICTREX, USA, LTD. 236
CHAPTER NINETEEN: ACRONYMS 237
ACRONYMS 237
ACRONYMS (CONTINUED) 238

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