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Use this report to:
- Analyze current and likely future sizes of thermoplastics and thermosetting polymer markets, broken down by component and by type.
- Learn about the use of plastics in electronic components.
- Identify major material suppliers and key processors.
- Review important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components.

Highlights
- The global electronic component totaled 3.6 billion pounds in volume in 2014. This market should reach nearly 3.8 billion pounds in 2015 and more than 4.4 billion pounds by 2020, demonstrating a compound annual growth rate (CAGR) of 3.3% from 2015 to 2020.
- The global thermoplastic market should reach nearly 2.7 billion pounds n 2015 and 3.2 billion pounds by 2020, with a CAGR of 3.8% for 2015-2020.
- The global thermoset market should total nearly 1.1 billion pounds in 2015 and 1.2 billion pounds by 2020, with a CAGR of 2.0% through 2020.

Introduction & Scope

INTRODUCTION

OBJECTIVES
This study focuses on the use of plastics in electronic components. It considers the wide range of thermoplastics and thermosetting polymers (including polyurethanes) that are being used in electronic components found in industrial, automotive and consumer electronics. It reviews the most recent developments in these materials that respond to the changing needs of the markets, and it analyzes the current and likely future sizes of these markets, broken down by component and by polymer type.

SCOPE AND FORMAT
This study covers all electronic components where plastics are used to a significant extent. It concentrates on components produced by injection molding, compression molding and encapsulation. It does not cover wire and cable, films used in capacitors or recording media, or enclosures. The study also identifies major material suppliers and key processors. It reviews important new technologies, as well as changes in legislation and industry standards and norms that may have significant effects on markets for electronic components, and it looks at interpolymer competition.

REASONS FOR DOING THE STUDY
Overall, plastics consumption in electronic components had been growing at rates well above those of growth in gross domestic product for many years. Electronic products have invaded virtually all areas of our personal and business lives, and their levels of sophistication continue to increase. The amount of electronics in automobile control, driver assist and infotainment systems is rising rapidly. Cloud computing is carried out on a massive scale, and now the Internet of Everything is connecting devices as well as people. At the same time, the tendency of many personal electronics to become fashion items has reduced product life cycles, with each new product generation putting new demands – in performance and especially cost – on the materials that go into them. In addition, the increasing visibility of electronic devices, most notably in mobile devices (smartphones and tablets), has been a key driver in pushing electronics companies to use more “environment-friendly” technologies and materials in their products. So the market is in a state of permanent flux, and regular reappraisals are called for. This report is a fully revised update of one carried out in 2012.

INTENDED AUDIENCE
This report should be of interest to a wide audience of organizations following the development of the market for engineering thermoplastics and thermosets in
electronic components. Interested parties are likely to include:
- Companies involved in the development, manufacture and supply of plastics materials for the electronics market.
- Companies involved in the development, manufacture, supply and use of passive electronic components that make incorporate plastics.
- Manufacturers and suppliers of plastics processing equipment.
- Public and private agencies involved in materials and component research.
- Academia.
- Venture capital companies and financial institutions interested in new and attractive investments.

METHODOLOGY AND INFORMATION SOURCES
Both primary and secondary information sources were used in preparing this report. A comprehensive review was undertaken of literature relating to polymers used to produce electronic components, their applications, technologies used to produce the components, markets and producers along the supply chain around the world. Included in the review was literature from manufacturers, associations and independent
observers. Interviews were also carried out with various experts in the field.

Table Of Contents

Plastics in Electronics Components: Technologies and Global Markets
TABLE OF CONTENTS
CHAPTER 1 INTRODUCTION 2
OBJECTIVES 2
SCOPE AND FORMAT 2
REASONS FOR DOING THE STUDY 2
INTENDED AUDIENCE 3
METHODOLOGY AND INFORMATION SOURCES 3
RELATED BCC RESEARCH REPORTS 3
ANALYST'S CREDENTIALS 3
BCC RESEARCH WEBSITE 4
DISCLAIMER 4
CHAPTER 2 SUMMARY 6
SUMMARY TABLE GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF
POLYMER, THROUGH 2020 (MILLION POUNDS) 7
SUMMARY FIGURE GLOBAL ELECTRONIC COMPONENT MARKET BY TYPE OF
POLYMER, 2014-2020 (MILLION POUNDS) 7
CHAPTER 3 POLYMERS USED IN ELECTRONIC COMPONENTS 11
OVERVIEW 11
TYPES OF POLYMERS 11
THERMOPLASTICS 12
STANDARD NYLONS 12
Background 12
Properties 13
Major Types 13
Nylon 66 13
Nylon 6 14
Reinforced Nylons 14
Background 14
Processing 14
Applications 14
TABLE 1 EXAMPLES OF STANDARD NYLONS USED TO MOLD ELECTRONIC
COMPONENTS BY TRADE NAME 15
Recent Developments 16
BASF Nylon Polymerization Plant in China 16
Invista to Make Nylon 66 Polymer in China 17
Lanxess Starts Up Nylons Unit in Antwerp 17
"Super 66" from Solvay Engineering Plastics 17
Wax-Free Nylons from Akro-Plastic 17
Enhanced Thermal Aging in New Zytel from DuPont 17
Halogen-Free Flame-Retardant Reinforced Nylon From BASF 17
Market Estimates and Forecasts 18
TABLE 2 GLOBAL STANDARD NYLON ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 18
THERMOPLASTIC POLYESTERS 18
Background 18
Polybutylene Terephthalate 19
Properties 19
Applications 19
TABLE 3 EXAMPLES OF POLYBUTYLENE TEREPHTHALATES USED TO MOLD
ELECTRONIC COMPONENTS BY TRADE NAME 20
Recent Developments 21
Sipchem Starts Up Polybutylene Terephthalate Plant 21
Carbon-Fiber-Reinforced Polybutylene Terephthalate From
BASF 21
Flame Retardant Polybutylene Terephthalate from
Polyplastics 21
Halogen-Free Reinforced Flame Retardant Grades From
Lanxess 21
Hydrolysis-Resistant Polybutylene Terephthalates from
BASF 21
Hydrolysis-Resistant Polybutylene Terephthalates from
DuPont 22
Hydrolysis-Resistant Polybutylene Terephthalates from
Lanxess 22
Polyethylene Terephthalate 22
Background 22
Properties and Grades 22
Applications 23
Recent Developments 23
Halogen-Free Rynite from DuPont 23
Thermally Conductive Polyethylene Terephthalate from
DSM 23
Polycyclohexylenedimethylene Terephthalate 24
Background 24
Properties 24
Recent Developments 24
Glass-Reinforced Compound from Solvay 24
Market Estimates and Forecasts 25
TABLE 4 GLOBAL POLYBUTYLENE TEREPHTHALATE ELECTRONIC COMPONENT
MARKET BY APPLICATION, THROUGH 2020 (MILLION POUNDS) 25
TABLE 5 GLOBAL PET/PCT ELECTRONIC COMPONENT MARKET BY APPLICATION,
THROUGH 2020 (MILLION POUNDS) 25
POLYPHENYLENE SULFIDE 26
Background 26
Properties 26
Advantages and Disadvantages 27
Applications 28
TABLE 6 EXAMPLES OF POLYPHENYLENE SULFIDE AND POLYPHENYLENE SULFIDE
BLENDS USED TO MOLD ELECTRONIC COMPONENTS BY TRADE NAME 28
Recent Developments 29
Solvay Completes Acquisition of Ryton PPS 29
Lumena Completes Polyphenylene Sulfide Expansion, Has Some
Liquidity Problems 29
DIC Planning Polyphenylene Sulfide Compounding Plant in China 29
Chlorine-Free Polyphenylene Sulfide From SK Chemicals 29
Celanese Adds Polyphenylene Sulfide to Compounding Capacity
in Nanjing 30
Idemitsu Transfers Polyphenylene Sulfide Business to Lion
Idemitsu Composites 30
Toray to Establish New Production Base for Torelina
Polyphenylene Sulfide in South Korea 30
Halogen-Free Polyphenylene Sulfide from Celanese 30
Market Estimates and Forecasts 30
TABLE 7 GLOBAL POLYPHENYLENE SULFIDE ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 31
POLYIMIDES 31
Background 31
Properties and Applications 31
Polyimide Films 32
Polyetherimide 33
Background and Properties 33
Applications 33
Recent Developments 33
Ultem Shortage 33
Polyamide-Imide 34
Background and Properties 34
Applications 34
Market Estimates and Forecasts 34
TABLE 8 GLOBAL POLYIMIDE* ELECTRONIC COMPONENT MARKET BY APPLICATION,
THROUGH 2020 (MILLION POUNDS) 34
POLYCARBONATES 35
Background 35
General Grades 35
Properties 35
Overview 35
Property Advantages and Disadvantages 36
Polyester Carbonates 36
Impact of Bisphenol A on Polycarbonate Usage 36
Processing 36
Applications 37
TABLE 9 EXAMPLES OF POLYCARBONATES USED TO MOLD ELECTRONIC
COMPONENTS BY TRADE NAME 37
Alloys/Blends 37
Supply and Demand 38
Recent Developments 38
Sabic Codevelops Conductive Transparent Polycarbonate Film 38
Mitsubishi Gas Chemical Doubles Specialty Polycarbonate
Capacity 38
Teijin Shutting Polymer Plant in Singapore 39
Trinseo Realigns Businesses 39
Market Estimates and Forecasts 39
TABLE 10 GLOBAL POLYCARBONATE ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 39
POLYPHTHALAMIDES AND OTHER HIGH-TEMPERATURE NYLONS 40
Overview 40
Polyphthalamides 40
Properties and Applications 41
TABLE 11 EXAMPLES OF POLYPHTHALAMIDE POLYMERS USED TO MOLD
ELECTRONIC COMPONENTS BY TRADE NAME 41
Other High-Temperature Nylons 42
Nylon 46 42
Nylon 4T 42
Nylon 9T 42
MXD6 43
Recent Developments 43
Biosourced Nylon 610, MXD6-Based Compound from Solvay
Specialty Polymers 43
DuPont Adding Zytel HTN Capacity 43
6T and 10T Types from Evonik 43
Solvay Compounding in China 44
Market Estimates and Forecasts 44
TABLE 12 GLOBAL POLYPHTHALAMIDES AND HIGH-TEMPERATURE NYLONS
ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH 2020 (MILLION
POUNDS)
44
LIQUID CRYSTAL POLYMERS 44
Background 44
Properties 45
Applications 46
TABLE 13 EXAMPLES OF LIQUID CRYSTAL POLYMERS USED TO MOLD ELECTRONIC
COMPONENTS BY TRADE NAME 46
Recent Developments 46
Polyplastics Launches Second-Generation Laperos Liquid Crystal
Polymer 46
New Xydar Liquid Crystal Polymer for High-Speed Surface-Mount
Device Connectors 47
Market Estimates and Forecasts 47
TABLE 14 GLOBAL LIQUID CRYSTAL POLYMER ELECTRONIC COMPONENT MARKET
BY APPLICATION, THROUGH 2020 (MILLION POUNDS) 47
SULFONE POLYMERS 48
Background 48
Properties 48
Applications 49
Producer Scenario 49
Recent Developments 49
BASF Opens Ultrason Plant in South Korea 49
Another High-Temperature Sulfone from Solvay 49
Market Estimates and Forecasts 50
TABLE 15 GLOBAL SULFONE POLYMER ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 50
ALLOYS/BLENDS 50
Background 50
Polyphenylene Ether/High-Impact Polystyrene 51
Background 51
Properties 51
Polyphenylene Ether/Nylon 51
Background and Properties 51
Polycarbonate/Polyester Blends 51
Market Estimates and Forecasts 51
TABLE 16 GLOBAL POLYMER ALLOY/BLEND ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 52
FLUOROPOLYMERS 52
Background 52
Properties and Applications 52
Producers 53
Recent Developments 53
DuPont Establishes Chemours 53
Solvay Sets Up Fluoropolymer Joint Venture in China 54
Market Estimates and Forecasts 54
TABLE 17 GLOBAL FLUOROPOLYMER ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 54
POLYARYLETHERKETONES 54
Background 54
Properties 55
Applications 55
TABLE 18 EXAMPLES OF PAEK USED TO MOLD ELECTRONIC COMPONENTS BY
TRADE NAME 55
Recent Developments 56
Solvay Builds U.S. Specialty Polymers PEEK Production Unit 56
New Victrex Polymer Plant 56
Victrex Opens PAEK Films Plant 56
New Capacity from Gharda 56
Market Estimates and Forecasts 56
TABLE 19 GLOBAL POLYARYLETHERKETONE ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 57
CYCLIC OLEFIN COPOLYMERS 57
Background 57
Properties and Applications 57
Producers 57
THERMOPLASTIC MARKET ESTIMATES AND FORECASTS SUMMARY 58
TABLE 20 GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY TYPE,
THROUGH 2020 (MILLION POUNDS) 58
THERMOSET POLYMERS 59
OVERVIEW 59
GENERAL PROPERTIES 59
TABLE 21 THERMOSET PROPERTIES AND MANUFACTURING PROCESSES 60
EPOXY RESINS 60
Background 60
Chemistry and Properties 61
Processing 61
Applications 62
Important Epoxy Grades and Producers 63
TABLE 22 EXAMPLES OF EPOXY RESINS USED FOR ELECTRONIC COMPONENTS BY
TRADE NAME 63
Recent Developments 64
Dow Possibly Exiting Epoxies 64
PPE from Sabic Acts as Epoxy Modifier 64
Market Estimates and Forecasts 64
TABLE 23 GLOBAL EPOXY RESIN ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 65
POLYURETHANES 65
Background 65
Reaction-Injection Molding Products 66
Applications 66
Producers 66
TABLE 24 EXAMPLES OF POLYURETHANE SYSTEMS USED FOR ELECTRONIC
COMPONENTS BY TRADE NAME 67
Recent Developments 67
Market Estimates and Forecasts 67
TABLE 25 GLOBAL POLYURETHANE ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS 68
PHENOLICS 68
Background 68
Molding Compounds 69
Applications 69
Producers 69
TABLE 26 EXAMPLES OF PHENOLICS USED FOR ELECTRONIC COMPONENTS BY
TRADE NAME 70
Market Estimates and Forecasts 70
TABLE 27 GLOBAL PHENOLIC ELECTRONIC COMPONENT MARKET BY APPLICATION,
THROUGH 2020 (MILLION POUNDS) 70
UNSATURATED POLYESTERS 71
Background 71
Applications 71
Overview 71
Electrical/Electronic 72
Producers 72
TABLE 28 EXAMPLES OF UNSATURATED POLYESTER AND VINYL ESTER RESINS AND
COMPOUNDS USED FOR ELECTRONIC COMPONENTS BY TRADE NAME 72
Market Estimates and Forecasts 73
TABLE 29 GLOBAL UNSATURATED POLYESTER ELECTRONIC COMPONENT MARKET
BY APPLICATION, THROUGH 2020 (MILLION POUNDS) 73
DIALLYL PHTHALATE 73
Overview 73
Background and Applications 73
Producers 74
Market Estimates and Forecasts 74
TABLE 30 GLOBAL DIALLYL PHTHALATE ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 74
BT-EPOXY RESINS AND CYANATE ESTERS 75
THERMOSET MARKET ESTIMATES AND FORECASTS SUMMARY 75
TABLE 31 GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY TYPE,
THROUGH 2020 (MILLION POUNDS) 75
CHAPTER 4 OVERVIEW OF KEY COMPONENTS, PRINTED CIRCUIT BOARDS AND
ENCAPSULANTS 77
INTRODUCTION 77
FOCUS OF THIS REPORT 77
RESIN CONSUMPTION 77
BACKGROUND 77
MARKETS 78
GROWTH 78
MARKET DRIVERS 79
PRINTED CIRCUIT BOARDS 79
OVERVIEW 79
PROPERTY REQUIREMENTS FOR LAMINATES 80
Electrical 80
Mechanical 80
Thermal 80
Other Property Requirements 81
PHYSICAL COMPOSITION 81
ASSEMBLY TECHNOLOGIES 81
PCB SUBSTRATES 81
TABLE 32 IMPORTANT TECHNICAL FACTORS TO CONSIDER WHEN SELECTING
PRINTED CIRCUIT BOARD SUBSTRATE MATERIALS 81
FR-2 Paper/Phenolic 82
FR-4 Epoxy 82
Other Types 82
SPECIFIC POLYMERS USED IN PRINTED CIRCUIT BOARDS 83
Epoxies 83
Polyimides 83
Cyanate Esters 83
Polytetrafluoroethylene 83
Bismaleimide-Triazine Resins 83
Phenolics 84
Melamine 84
OTHER MATERIALS USED IN PRINTED CIRCUIT BOARDS 84
Copper Foils 84
FIBER REINFORCEMENTS 84
Glass Cloth 84
Aramid Fibers 85
PRODUCTION OF CIRCUITRY 85
ENVIRONMENTAL ISSUES 85
Flame Retardants 85
RECENT DEVELOPMENTS 86
Extruded Thermoplastic Circuit Board 86
High Thermal Conductivity PCB Material 86
FLEXIBLE PRINTED CIRCUIT BOARDS 87
Background 87
Applications 87
Technology 87
Standards 87
Advantages 88
Materials Used 88
Overview 88
Polyimides 88
Polyesters 88
Aramids 88
Epoxy Resins 89
Adhesiveless Laminates 89
Rigid-Flex Circuits 89
Recent Developments 90
High-Temperature Flexible Circuit Material System From DuPont 90
Flame-Retardant Polyester Film From Teijin DuPont Films 90
Polyimide-Based System for High Temperatures 90
Kaneka Expands Film Business 90
SKC Kolon PI Expanding 91
Comparison Between Rigid and Flexible Circuit Boards 91
TABLE 33 COMPARISON BETWEEN RIGID AND FLEXIBLE CIRCUIT BOARDS 91
Producers of Rigid and Flexible Circuit Boards 91
TABLE 34 MAJOR PRODUCERS OF RIGID AND FLEXIBLE CIRCUIT BOARDS 91
SOLDERING 92
Background 92
Some Technologies 92
Lead-Free Electronic Soldering 93
PRODUCTION STATISTICS 93
INDUSTRY TRENDS 93
ELECTRONIC PACKAGING 94
Overview 94
Background 94
Wire Bonding 94
Chip-On-Board 95
Tape Automated Bonding 95
Flip Chip Bonding 95
Package Types 96
Dual-in-Line 96
Pin Grid Arrays 96
Ball Grid Arrays 96
Other Key, Selected Electronic Packaging/Interconnection
Technologies 97
Multichip Modules 97
Printed Circuit Board Assembly Techniques 98
Overview 98
Through-Hole technology 98
Surface-Mount Technology 98
Intrusive Reflow 99
Process 99
Advantages and Disadvantages of SMT vs. Through-Hole 99
Advantages 99
Disadvantages 100
Soldering Techniques 100
Resin and Material Usage 101
Competitive Resin Scenario for Surface-Mount Technology
Devices 101
Three-Dimensional Molded Interconnected Devices 101
Background 101
Applications 102
Manufacturing Technologies 102
TABLE 35 POLYMERS SUITABLE FOR PRODUCTION OF 3D-MIDS USING LDS
TECHNOLOGY 103
Alternative MID Technologies 103
TABLE 36 ADVANTAGES AND DISADVANTAGES OF LDS AND TWO-COMPONENT
MOLDING FOR 3D-MIDS 104
Recent Developments 104
Laser Plasma Coating 104
Integrated Plastic-Metal Injection Molding 105
Three-Dimensional Printed Electronics 106
MARKET ESTIMATES AND FORECASTS 106
TABLE 37 GLOBAL PRINTED CIRCUIT BOARD MARKET BY POLYMER TYPE, THROUGH
2020 (MILLION POUNDS) 106
TABLE 38 GLOBAL PCB* MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
(MILLION POUNDS) 107
TABLE 39 GLOBAL PRINTED CIRCUIT BOARD MARKET BY THERMOSET TYPE,
THROUGH 2020 (MILLION POUNDS) 108
ENCAPSULANTS 108
DEFINITIONS AND BACKGROUND 108
PRIMARY PURPOSES OF ENCAPSULATION 109
ENCAPSULANT MATERIALS 109
Overview 109
Impact of Thermoplastics 110
Types 110
TABLE 40 TYPES OF ENCAPSULANT MATERIALS - ADVANTAGES AND
DISADVANTAGES 110
EPOXY ENCAPSULATION FORMULATIONS 111
TABLE 41 EPOXY ENCAPSULANT FORMULATIONS 111
ENCAPSULATED ELECTRICAL AND ELECTRONIC COMPONENTS 111
Background 111
Specific Encapsulant Applications 112
EPOXY ENCAPSULANT SYSTEMS 112
SILICONE ENCAPSULANTS 112
THERMOPLASTIC ENCAPSULANTS 113
MAJOR SELECTED ENCAPSULANT PRODUCERS AND THEIR PRODUCT LINES 114
Bostik 114
Henkel 114
Huntsman 114
Lord Chemical 114
MARKET ESTIMATES AND FORECASTS 115
TABLE 42 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY POLYMER TYPE,
THROUGH 2020 (MILLION POUNDS) 115
TABLE 43 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOPLASTIC TYPE,
THROUGH 2020 (MILLION POUNDS) 115
TABLE 44 GLOBAL ELECTRONIC ENCAPSULANTS MARKET BY THERMOSET TYPE,
THROUGH 2020 (MILLION POUNDS) 116
CHAPTER 5 MOLDED ELECTRONIC PRODUCTS 118
OVERVIEW 118
BACKGROUND 118
POLYMERS USED 118
MARKET DRIVERS 118
CONNECTORS 119
BACKGROUND 119
TRENDS 119
APPLICATIONS FOR ELECTRONIC CONNECTORS 120
MATERIAL SELECTION 120
FLAME RETARDANCE 121
STANDARDS RELATING TO CONNECTORS 123
MANUFACTURERS 124
TABLE 45 MAJOR MANUFACTURERS OF ELECTRONIC CONNECTORS 124
END-USE MARKETS 125
Background 125
Automotive Industry 125
Appliances 126
Other Markets 126
MARKET ESTIMATES AND FORECASTS 127
TABLE 46 GLOBAL ELECTRONIC CONNECTOR MARKET BY POLYMER TYPE,
THROUGH 2020 (MILLION POUNDS) 127
TABLE 47 GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOPLASTIC TYPE,
THROUGH 2020 (MILLION POUNDS) 127
TABLE 48 GLOBAL ELECTRONIC CONNECTOR MARKET BY THERMOSET TYPE,
THROUGH 2020 (MILLION POUNDS) 128
SWITCHES 128
BACKGROUND 128
MARKET ESTIMATES AND FORECASTS 129
TABLE 49 GLOBAL ELECTRONIC SWITCH MARKET BY POLYMER TYPE, THROUGH
2020 (MILLION POUNDS) 129
TABLE 50 GLOBAL ELECTRONIC SWITCH MARKET BY THERMOPLASTIC TYPE,
THROUGH 2020 (MILLION POUNDS) 130
TABLE 51 GLOBAL ELECTRONIC COMPONENT SWITCH MARKET BY THERMOSET
TYPE, THROUGH 2020 (MILLION POUNDS) 130
COIL FORMERS 131
BACKGROUND 131
MANUFACTURERS 131
TABLE 52 SELECTED MANUFACTURERS MOLDING COIL FORMERS FOR ELECTRONIC
APPLICATIONS 131
MARKET ESTIMATES AND FORECASTS 132
TABLE 53 GLOBAL COIL-FORMER MARKET BY POLYMER TYPE, THROUGH 2020
(MILLION POUNDS) 132
TABLE 54 GLOBAL COIL-FORMER MARKET BY THERMOPLASTIC TYPE, THROUGH
2020 (MILLION POUNDS) 132
TABLE 55 GLOBAL COIL-FORMER MARKET BY THERMOSET TYPE, THROUGH 2020
(MILLION POUNDS) 133
RELAYS 133
BACKGROUND 133
MARKET ESTIMATES AND FORECASTS 134
TABLE 56 GLOBAL RELAY MARKET BY POLYMER TYPE, THROUGH 2020 (MILLION
POUNDS) 134
TABLE 57 GLOBAL RELAY MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
(MILLION POUNDS) 134
TABLE 58 GLOBAL RELAY MARKET BY THERMOSET TYPE, THROUGH 2020 (MILLION
POUNDS) 135
CAPACITORS 135
BACKGROUND 135
APPLICATIONS 136
CAPACITOR MATERIALS 136
CONSUMPTION BY MARKET SEGMENT 137
MARKET ESTIMATES AND FORECASTS 138
TABLE 59 GLOBAL CAPACITOR MARKET BY THERMOPLASTIC TYPE, THROUGH 2020
(MILLION POUNDS) 138
OTHER MOLDED ELECTRONIC COMPONENTS 138
RESISTORS 138
Background 138
Applications 139
Inductors/Transformers 139
Plastics Usage 140
MARKET ESTIMATES AND FORECASTS 140
TABLE 60 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY POLYMER TYPE,
THROUGH 2020 (MILLION POUNDS) 140
TABLE 61 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOPLASTIC
TYPE, THROUGH 2020 (MILLION POUNDS) 140
TABLE 62 GLOBAL OTHER ELECTRONIC COMPONENT MARKET BY THERMOSET TYPE,
THROUGH 2020 (MILLION POUNDS) 141
SUMMARY OF MARKET ESTIMATES AND FORECASTS 141
TABLE 63 GLOBAL ELECTRONIC COMPONENT MARKET BY APPLICATION, THROUGH
2020 (MILLION POUNDS) 141
TABLE 64 GLOBAL THERMOPLASTIC ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 142
TABLE 65 GLOBAL THERMOSET ELECTRONIC COMPONENT MARKET BY
APPLICATION, THROUGH 2020 (MILLION POUNDS) 143
CHAPTER 6 USES AND INDUSTRY TRENDS 145
OVERVIEW 145
SNAPSHOT OF THE ELECTRONIC DEVICE MARKET 145
COMPUTERS 146
OVERVIEW 146
DESKTOPS 146
ELECTRONIC DISPLAYS 147
BACKGROUND 147
PRINTERS 147
OVERVIEW 147
INKJET PRINTERS 147
MONOCHROME LASER PRINTERS 148
COLOR LASER PRINTERS 148
MANUFACTURERS 148
''ALL-IN-ONE'' MACHINES 148
PHONES 148
CORDED 148
CORDLESS 148
FAX MACHINES 149
SCANNERS 149
MOBILE ELECTRONIC DEVICES 149
PHONES 149
LAPTOPS/NOTEBOOKS/NETBOOKS 150
TABLETS 150
E-READERS 150
DIGITAL MUSIC PLAYERS 151
AUTOMOTIVE MARKET 151
OVERVIEW 151
ELECTRIC CARS 151
CAFE ISSUES 152
OVERVIEW OF ELECTRONIC COMPONENTS IN AUTOMOTIVE PRODUCTS 152
MATERIAL USAGE 153
CONNECTORS 154
SENSORS 154
FLEXIBLE CIRCUITRY IN AUTOMOTIVE 156
CHAPTER 7 TECHNOLOGY TRENDS AND RECENT PATENTS RELATED TO ELECTRONIC
COMPONENTS 158
BACKGROUND 158
IMPORTANCE OF MINIATURIZATION 158
THIN-WALLING ELECTRONIC COMPONENTS 159
BACKGROUND 159
EFFECTS OF THIN-WALLING ON PERFORMANCE REQUIREMENTS AND
DESIGN 159
APPLICATION REQUIREMENTS 159
MATERIAL AND PROCESS SELECTION 160
PROPERTIES REQUIRED 160
CHALLENGES IN DOWNSIZING 161
SOFTWARE THAT AIDS THIN-WALL DESIGN 161
FLEXIBLE ELECTRONICS 161
OVERVIEW 161
WEARABLE ELECTRONICS 164
CLOUD COMPUTING AND BIG DATA 165
THE INTERNET OF EVERYTHING 165
CHANGES IN ELECTRONIC COMPONENT MANUFACTURING THAT COULD IMPACT
RESIN CHOICES 165
RECENT PATENTS RELATED TO THE INDUSTRY 167
MULTI-FUNCTIONAL KEYBOARD ASSEMBLIES - APPLE INC. (CUPERTINO,
CALIF.) - 20140118264 - MAY 1, 2014 167
ELECTRONIC DEVICE IN PLASTIC - THIEL, DAVID (NATHAN, AUSTRALIA),
MADHUSUDANRAO, NEELI (NATHAN, AUSTRALIA) - 20140146501 - MAY 29,
2014
167
A METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT - BASF
(LUDWIGSHAFEN, GERMANY) - WO/2014/113323 - JULY 24, 2014 168
METHOD FOR SURFACE MOUNTING ELECTRONIC COMPONENT, AND
SUBSTRATE HAVING ELECTRONIC COMPONENT MOUNTED THEREON -
OMRON CORP. (KYOTO, JAPAN) - 20130175074 - JULY 24, 2014
168
PRINTED THREE-DIMENSIONAL (3D) FUNCTIONAL PART AND METHOD OF
MAKING - PRESIDENT AND FELLOWS OF HARVARD COLLEGE -
WO2014209994 A2 - DECEMBER 31, 2014
168
FLEXIBLE ELECTRONIC DEVICES - APPLE INC. (CUPERTINO, CALIF.) -
8929085 A2 - JANUARY 6, 2015 168
PRINTED CIRCUIT BOARD ASSEMBLY - SAMSUNG ELECTRO-MECHANICS CO.
(SUWON-SI, GYEONGGI-DO, SOUTH KOREA) - 8971047- MARCH 3, 2015 169
CASE OF ELECTRONIC DEVICE HAVING LOW-FREQUENCY ANTENNA
PATTERN EMBEDDED THEREIN, MOLD THEREFOR AND METHOD OF
MANUFACTURING THEREOF - SAMSUNG ELECTRO-MECHANICS CO.
(SUWON-SI, GYEONGGI-DO, SOUTH KOREA) - 8976074- MARCH 10, 2015
169
EPOXY RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT
DEVICE - SUMITOMO BAKELITE CO. LTD. (TOKYO, JAPAN) - 8987355 -
MARCH 24, 2015
169
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD -
AJINOMOTO CO. INC. (TOKYO, JAPAN) - 8992713- MARCH 31, 2015 170
CHAPTER 8 ELECTRONIC COMPONENT INDUSTRY OVERVIEW AND PLASTICS
PRODUCERS 172
TOP SEMICONDUCTOR PRODUCERS AND CUSTOMERS 172
TABLE 66 TOP GLOBAL SEMICONDUCTOR PRODUCER COMPANIES, 2014 ($
BILLIONS) 172
TABLE 67 TOP GLOBAL SEMICONDUCTOR CUSTOMERS, 2014 ($ BILLIONS) 173
MANUFACTURING AND MARKETING ASPECTS 173
GLOBALIZATION 173
WHAT COMPONENT SUPPLIERS ARE DOING 173
PLASTICS PRODUCERS 174
OVERVIEW 174
TABLE 68 TRADE NAMES OF SELECTED, KEY PLASTICS USED IN ELECTRONIC
COMPONENTS 174
POLYMER PRODUCERS ACCORDING TO MATERIAL TYPE 177
THERMOSETS 178
Epoxy Resins 178
Polyurethanes 178
Phenolics 178
Unsaturated Polyesters 178
Diallyl Phthalate 178
THERMOPLASTICS 178
Standard Nylons 178
Polyesters 179
Polyphenelene Sulfide 179
Polyimides 179
Polycarbonates 179
Liquid Crystal Polymers 179
Sulfone Polymers 180
Fluoropolymers 180
Polyphthalamides/HTNs 180
Polyaryletherketones 180
Alloys and Blends 180
CHAPTER 9 ENVIRONMENTAL ISSUES 182
OVERVIEW 182
PRINTED CIRCUIT BOARD DISPOSAL 182
BROMINE-FREE PRINTED CIRCUIT BOARDS 182
HALOGEN-FREE FLAME RETARDANTS FOR THERMOPLASTICS 183
RECYCLING 183
ELECTRONIC INDUSTRY INTERFACE 184
OVERVIEW 184
REASONS FOR INCREASED ENVIRONMENTAL REGULATIONS FOR
ELECTRONIC EQUIPMENT 184
THE EUROPEAN UNION ROHS DIRECTIVE 185
THE EUROPEAN UNION WEEE DIRECTIVE 186
EPEAT 186
CHAPTER 10 PERFORMANCE REQUIREMENTS RELATED TO ELECTRONIC
COMPONENTS 189
OVERVIEW 189
FLAMMABILITY STANDARDS 189
Definitions 189
FLAMMABILITY TESTS 190
Overview 190
UL 94 190
Glow-Wire Flammability Index - IEC 60695 191
UL 1694 192
UL 746C 192
OTHER STANDARDS 193
UL 1446 193
UL 1950 193
CHAPTER 11 SELECTED COMPANY PROFILES 196
ASAHI KASEI CHEMICAL 196
ASHLAND SPECIALTY CHEMICALS 196
BASF 196
CELANESE 197
COVESTRO 197
CYTEC INDUSTRIES INC. 198
DSM 198
DUPONT 199
EMS GRIVORY 199
EPIC RESINS 199
HENKEL AG 200
HUNTSMAN ADVANCED MATERIALS 200
INTERPLASTIC CORP. 200
KINGFA 201
LANXESS 201
MITSUBISHI ENGINEERING PLASTICS 201
POLYPLASTICS 202
SABIC INNOVATIVE PLASTICS 202
SOLVAY SPECIALTY POLYMERS 202
SUMITOMO BAKELITE 203
TORAY PLASTICS 203
VICTREX 204
CHAPTER 12 APPENDIX: ACRONYMS 206

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