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Table of Contents

  • Publication date: April 2012
  • Report size: 89 pages
Keywords : IC Substrate, Semiconductor, PCB, global semiconductor, image sensor

With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates include BGA (Ball Grid Array), CSP (Chip Scale Package) and FC (Flip Chip), of which the latter two now prevail. In 2012, the global IC substrate market will value USD8.67 billion. IC substrates mainly find application in PC, mobile phone and ...

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