Keywords : IC Substrate, Semiconductor, PCB, global semiconductor, image sensor
With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates include BGA (Ball Grid Array), CSP (Chip Scale Package) and FC (Flip Chip), of which the latter two now prevail. In 2012, the global IC substrate market will value USD8.67 billion. IC substrates mainly find application in PC, mobile phone and ...
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With the improvement of IC operating frequency and integration, traditional leadframe packaging is out of use, and IC has to be packaged by substrates. By packaging mode, the mainstream IC substrates include BGA (Ball Grid Array), CSP (Chip Scale Package) and FC (Flip Chip), of which the latter two now prevail.
In 2012, the global IC substrate market will value USD8.67 billion. IC substrates mainly find application in PC, mobile phone and base station, particularly PC is the biggest consumer. Inside PC, CPU, GPU and Northbridge IC all employs FC-BGA packaging, featuring large packaging area, many layers and high unit price. CPU and GPU of smartphones use FC-CSP packaging, so does CPU of some feature phones. In addition to CPU and GPU, most of the IC in mobile phone (such as Bluetooth / WiFi / FM, CMOS image sensor, USB controller, GPS, Touch Screen Controllers, Audio Codec, MOSFET, DC / DC converter) adopt WLCSP packaging. The mobile phone IC shipment is huge, but with the small-sized substrates, the mobile phone IC substrate has a far smaller market size than the PC IC substrate.
IC substrate vendors are principally PCB manufacturers, yet the direct customers of IC substrate are the IC packaging companies. IDMs or IC Foundries produce IC die at first; then, packaging companies complete IC packaging; next, the products are delivered to IC design companies or IDMs, and finally shipped to electronics manufacturers. In general, packaging companies exerts greatest influence on substrate suppliers.
Taiwan IC packaging and testing industry ranks first in the world, with 56% market share, while Chinese Mainland packaging and testing industry just shares 3%. The reason why Taiwan has the developed IC packaging and testing industry lies in that Taiwan boasts the globally largest wafer foundries. 60% of the 50 nm (or below 50 nm) IC business is undertaken by TSMC. Nearly all IC in smart phones is fabricated by TSMC and UMC. Three out of the global top four packaging and testing corporations are from Taiwan. In the global IC substrate packaging market, Taiwanese players sweep more than 70% share.
Japanese manufacturers occupy the market of CPU, GPU and Northbridge IC substrate for PC. In 2012, NGK quitted, and its market share was taken by Taiwan's Nanya PCB. Also, Japanese companies reign in the high-end market, they develop the FC-BGA technology with Intel and their positions remain quite stable. IBIDEN is building a base in the Philippines to lower prices. IBIDEN and Shinko focus on ABF substrates, both of which take no interest in BT substrates in the field of communications.
When it comes to the South Korean manufactures, SEMCO involves in the widest range of business. On the one hand, it obtains many orders from Qualcomm and Samsung Electronics. On the other hand, SEMCO also receives a small portion of orders from Intel or AMD. SIMMTECH, also a leading memory PCB maker, is mainly engaged in the memory substrate packaging. Memory PCBs will apply substrate packaging widely, in particular all of MCP memory PCBs may utilize substrate packaging in 2013.
Among Taiwanese manufacturers, Nanya PCB takes Intel as its major client, while Kinsus is a PCB supplier for Qualcomm and Broadcom, 90% shipment of which goes to BT substrate.
Electronic Component And Semiconductor Industry in Taiwan
1 Global Semiconductor Industry
1.1 Overview
1.2 IC Packaging
1.3 IC Packaging and Testing
2 IC Substrate
2.1 Introduction
2.2 Flip Chip IC Substrate
2.3 Trends
3 IC Substrate Market
3.1 IC Substrate Market
3.2 Mobile Phone Market
3.3 WLCSP Market
3.4 PC and Tablet PC Market
3.5 FPGA and CPLD Market
3.6 IC Substrate Industry
4 IC Substrate Manufacturers
4.1 Unimicron
4.2 IBIDEN
4.3 Dae Duck Electronics
4.4 SIMMTECH
4.5 LG INNOTEK
4.6 SEMCO
4.7 NANYA PCB
4.8 Kinsus
4.9 Shinko
5 IC Substrate Packaging Companies
5.1 ASE
5.2 Amkor
5.3 Siliconware Precision
5.4 STATS ChipPAC
Selected Charts
Unimicron’s Organizational Structure
IBIDEN’s Revenue and Operating Margin, FY2006- FY2012
IBIDEN’s Revenue by Business , FY2006-Q3 FY2012
IBIDEN’s Operating Profit by Business, FY2009-Q3 FY2012
IBIDEN’s HDI Board Output, 2008-2012
Revenue and Operating Margin of Dae Duck Electronics, 2005-2012
Revenue of Dae Duck Electronics by Business, 2009-2011
Revenue of Dae Duck Electronics by Business, 2010–Q4 2011
Revenue and Operating Margin of Dae Duck GDS, 2005-2012
Revenue of Dae Duck GDS by Business, 2010-2012
SIMMTECH’s Revenue and Operating Margin , 2004-2012
SIMMTECH’s Revenue and Operating Margin, Q1 2010-Q4 2011
SIMMTECH’s Memory Revenue by Speed, Q1 2010-Q4 2011
SIMMTECH’s Substrate Revenue by Product, Q1 2010-Q4 2011
SIMMTECH’s Revenue by Application, Q1 2004 -Q4 2010
SIMMTECH’s Clients, 2004-2010
SIMMTECH’s Plants
SEMCO’s Revenue by Division, 2010-2011
Revenue and Operating Margin of SEMCO’s ACI Division, Q1 2010-Q4 2011
Capacity and Global Distribution of NANYA PCB
Clients of NANYA PCB, 2010
ASE’s Organizational structure
ASE’s Revenue and Gross Margin, 2001-2012
Amkor’s Revenue and Gross Margin and Operating Margin, 2005-2011
Revenue, Gross Margin, Operating Margin of Siliconware Precision, 2003-2011
Revenue and Gross Margin of STATS ChipPAC, 2004-2011
Revenue of STATS ChipPAC by Packaging Type, 2006-2011
Revenue of STATS ChipPAC by Application, 2006-2011
Revenue of STATS ChipPAC by Region, 2006-2011
Global Semiconductor Industry and Global GDP Growth Rate, 1990-2016E
Quarterly World’s IC Shipment , 2000-2012
Annual Capital Expenditure of Semiconductor Industry, 1983-2011
Capital Expenditure of Global Semiconductor Industry by Region, 2005-2012
Global Wafer Capacity, 1994-2012
IC Packaging Types Used by Major Electronic Products
Market Share of OSAT Manufacturers Worldwide, 2011
Revenue of Taiwan Packaging and Testing Industry, 2007-2011
Revenue of Global Semiconductor Packaging Materials Manufacturers, 2010-2013
Proportion of IC Substrates in PCB Industry, 2006-2015
Application of IC Substrates, 2011-2012
Global Mobile Phone Shipment , 2007-2014
Quarterly Global Mobile Phone Shipment, Q1 2009 –Q4 2011
Quarterly CDMA and WCDMA Mobile Phone Shipment, 2007-2011
WLCSP Packaging Market Size, 2010-2016
WLCSP’s Shipment by Application , 2010-2016
Global PC-use CPU and GPU Shipment , 2008-2013
NETBOOK, iPad and Tablet PC Shipment, 2008-2012
Application Distribution and Geographical Distribution of FPGA and CPLD Market, 2011
Market Share of Major FPGA and CPLD Manufacturers, 2000-2010
Revenue of Major IC Substrate Manufacturers, 2010-2011
Unimicron’s Revenue and Gross Margin, 2003-2011
Unimicron’s Quarterly Revenue and Growth Rate, Q1 2009-Q4 2011
Unimicron’s Revenue by Product, 2010-2011
Unimicron’s Revenue by Application, 2010-2011
Unimicron's Manufacturing Bases
Unimicron's M & A
Financial Data of Unimicron's Major Subsidiaries, 2009-2010
IBIDEN’s Revenue, 2007-2011
DAEDUCK’s Revenue by Product, Q1 2011–Q1 2012
SIMM TECH’s Organizational Structure
Revenue of Memory Division of SIMM TECH by Product, 2010-2012
Substrate Revenue of SIMM TECH by Product, 2010-2012
SIMMTECH’s Capacity, Q1 2010-Q4 2011
Revenue and Operating Margin of LG INNOTEK, 2006-2011
Revenue of LG INNOTEK by Product, Q1 2010-Q4 2011
Revenue and Gross Margin of NANYA PCB, 2006-2011
Monthly Revenue and Growth Rate of NANYA PCB, Jan 2010-Jan 2012
Kinsus’ Revenue and Gross Margin, 2003-2012
Kinsus’ Revenue and Growth Rate, Jan 2010-Jan 2012
Kinsus’ Revenue by Product, 2011
Kinsus’ Revenue by Application, 2011
Shinko’s Revenue and Net Income, FY2007-FY2012
Shinko’s Revenue by Business, FY2011-FY2012
ASE’s Revenue by Business, 2010-2011
Revenue, Gross Margin and Operating Margin of ASE’s Packaging Division, Q1 2010-Q4 2011
Revenue of ASE’s Packaging Division, Q1 2010-Q4 2011
Revenue, Gross Margin and Operating Margin of ASE’s Materials Division, Q1 2010-Q4 2011
ASE’s Top 10 Clients, Q4 2011
ASE’s Revenue by Application, Q4 2011
Amkor’s Revenue by Packaging Type, 2007-2011
Amkor’s Revenue by Packaging Type, Q4 2008-Q4 2011
Amkor’s Shipment by Packaging Type, Q4 2008-Q4 2011
Amkor’s CSP Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s CSP Packaging Revenue by Application, 2011
Amkor’s BGA Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s BGA Packaging Revenue by Application, 2011
Amkor’s Leadframe Packaging Revenue and Shipment, 2005-Q3 2011
Amkor’s Leadframe Packaging Revenue by Application, Q3 2011
Amkor’s Revenue and Shipment by Region, Q3 2011
Amkor’s Packaging Capacity Utilization , Q1 2008-Q4 2011
Organizational Structure of Siliconware Precision
Revenue of Siliconware Precision by Region, 2005-2011
Revenue of Siliconware Precision by Application, 2005-2011
Revenue of Siliconware Precision by Business, 2005-2011
Capacity of Siliconware Precision, Q1 2006, Q2-Q3 2007, Q3-Q4 2011
