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Mobile World Congress 2012 Observations: Mobile Phone Application IC

  • May 2012
  • -
  • Market Intelligence & Consulting Institute
  • -
  • 12 pages

At MWC 2012, major chip suppliers aggressively promoted their respective chip products with features such as 4G connection, dual-core, quad-core, and new process technologies. Emerging suppliers also introduced various solutions. These products and solutions reflect future development of mobile devices. This report offers insight into products demonstrated at MWC 2012 by major chip suppliers. Analyzing product development strategies adopted by suppliers in order to compete and future trends in the mobile communications IC industry.

Table Of Contents

Mobile World Congress 2012 Observations: Mobile Phone Application IC
Table of Contents

1. Background
2. 40nm and Above Processes are Mainstream; Qualcomm, Samsung Lead the Market
3. Multi-mode Chips to Challenge LTE
4. Vendors to Seek Balance between Performance and Power Consumption through Quad-core Product Design
5. Emerging Suppliers Aggressively Foray into Total Solution Market
6. GPU Plays Important Role in Competition
MIC Perspective
Appendix


List of Topics

- Background introduction, touching on chip products released by major chip suppliers at MWC2012
- Chip process technology enhancement, especially products released by Qualcomm and Samsung
- Chips supporting LTE/HSPA become the mainstream, future development of the said chips and major suppliers
- Chip suppliers' quad-core product design with an aim to seek balance between performance and power consumption
- Products unveiled by emerging chip suppliers to challenge leading suppliers, efforts made by the leading suppliers to compete in mobile communications market
- GPU development and its importance
- ARM Cortex A9 architecture expected to become the mainstream in 2012, key technologies of system design, increasing importance of total solutions and advantages of leading suppliers, future development of GPU technology
- Companies and organizations analyzed or mentioned in the report include: ARM, Broadcom, GCT, HiSilicon, Huawei, Icera, Imagination, Infineon, Intel, LG, Marvell, MediaTek, Motorola, MWC (Mobile World Congress), Nvidia, Orange, Qualcomm, Renesas, Samsung, ST-Ericsion, TI, TSMC

List of Tables

Table 1 Products Demonstrated and Released by Major Chip Suppliers at MWC 2012
Table 2 Quad-core AP Design Unveiled at MWC 2012

Companies Mentioned

ARM, Broadcom, GCT, HiSilicon, Huawei, Icera, Imagination, Infineon, Intel, LG, Marvell, MediaTek, Motorola, MWC (Mobile World Congress), Nvidia, Orange, Qualcomm, Renesas, Samsung, ST-Ericsion, TI, TSMC

List of topic

Background introduction, touching on chip products released by major chip suppliers at MWC2012

Chip process technology enhancement, especially products released by Qualcomm and Samsung

Chips supporting LTE/HSPA become the mainstream, future development of the said chips and major suppliers

Chip suppliers' quad-core product design with an aim to seek balance between performance and power consumption

Products unveiled by emerging chip suppliers to challenge leading suppliers, efforts made by the leading suppliers to compete in mobile communications market

ARM Cortex A9 architecture expected to become the mainstream in 2012, key technologies of system design, increasing importance of total solutions and advantages of leading suppliers, future development of GPU technology

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