The IC manufacturing industry mainly involves memory vendors, IDMs and foundries. By technology, IC can be divided into analog, digital and mixed signal. Most digital IC businesses are IC design houses and, analog signal businesses commonly refer to IDMs. But it is not the case for Japanese manufacturers, which have long been applying vertical supply chain system and bringing the whole link of the supply chain under control. Thus, nearly all the semiconductor manufacturers in Japan are IDMs.
The foundries fall into two types, one produces high-volume digital IC and the other produces low-volume analog IC, high-voltage IC and mixed signal IC. For high-volume digital IC foundries, they are required to ceaselessly improve the IC process technology by CAPEX at least USD1 billion annually, more than 50% of which are earmarked for equipment depreciation and R&D; for the later, they are much smaller by operation scale, with each annual revenue no more than 700 million USD.
For digital IC foundries, efficiency is the top priority, since only those that can develop the most advanced process technology in the shortest duration can come out top in the cut-throat competition. For instance, the R&D cost is likely to recover within one year provided a company makes the initiative to develop the world’s first 90-nm process technology within six months at a cost of USD1 billion. However, if a company develops the same technology by investing the same amount two years later than the pioneer, it means that there is little chance for it to recover its R&D cost, for the less advanced technology is no longer a magnet for customers. Therefore, there is, in general, only one lucrative in digital IC foundries, and one with meager profit, while the rest are either loss-making or with a narrow margin of profit.
TSMC is the biggest player among wafer foundries worldwide, with the market occupancy approximating 48% and its profit making up roughly 85% in the whole industry. The market capitalization of TSMC is as high as USD68 billion, as opposed to the NO.4 SMIC whose market cap is less than USD1.5 billion.
TSMC, UMC and SMIC are among digital IC foundries, while VIS, TowerJazz, Dongbu HiTek and ASMC are among analog IC, high-voltage IC and mixed-signal foundries. For UMC, its considerable profit is yielded from the investment in a series of well performing IC design houses, such as Mediatek, Novatek and Sunplus, all of which are loyal customers of UMC. Analog foundries have suffered hefty loss for many years, which largely attributed that all its customers are small analog IC designers that are very sensitive to economic climate.
Among foundries in Chinese Mainland, SMIC enjoys absolute dominance. It is the only that has 12-inch wafer fab, comparing to HHNEC and Grace Semiconductor, which were merged by SMIC in late 2011, that only have three 8-inch wafer fabs. Both state-run enterprises, HHNEC and Grace Semiconductor monopolize government-related IC business, which makes them possible to reap lucrative profit. However, both feature laggard of technologies and are hard to face real tough competition. Another case is Shanghai Huali Microelectronics, the investment of which amounts to RMB14.5 billion, by and large backed by the government. In terms of competitiveness, all these businesses far lag behind SMIC
Although Samsung embarked on wafer foundry business as early in 2007, no remarkable achievements have been made over the past five years. In 2007, Samsung’s revenue from foundry business reported USD370 million, and the figure in 2011 rose to USD470 million excluding that brought by Apple, the sole big customer of Samsung. Being involved in intellectual property issue, Apple is forced to commission Samsung as its OEM. For Samsung, it sets foot in wafer foundry business with the aim of transferring the excessive capacity. Unlike Samsung, Intel has no intention at all to develop wafer foundry business.
It is worth mentioning that, Taiwan-based DRAMs have been struggling to make the tough choice of transformation or closedown after suffering heavy losses for many years. For instance, Powerchip has shifted its business to foundry. In Q4 2011, 60% revenue of Powerchip was from foundry business. In 2011, Powerchip’s revenue from foundry business hit USD431 million, against USD149 million in 2010, marking the fastest developed foundry.
Global Telephony Industry
Table of Contents
1. Global Semiconductor Industry
1.1 Overview
1.2 IC Design Industry
1.3 Overview of IC Packaging and Testing Industry
1.4 China IC Market
2. Semiconductor Industry
2.1 Analog Semiconductor
2.2 MCU
2.3 DRAM Industry
2.3.1 Current Status of DRAM Industry
2.3.2 Market Occupancy of DRAM Vendors
2.3.3 Market Occupancy of Mobile DRAM Vendors
2.4 NAND
2.5 Compound Semiconductor Industry
3. IC Manufacturing Industry
3.1 IC Manufacturing Capacity
3.2 Wafer Foundry
3.3 MEMS Foundry
3.4 China Wafer Foundry Industry
3.5 Wafer Foundry Market
3.5.1 Global Mobile Phone Market Size
3.5.2 Market Occupancy of Mobile Phone Brands
3.5.3 Smartphone Market and Industry
3.5.4 PC Market
3.6 IC Manufacturing and Packaging & Testing Equipment Market
3.7 Semiconductor Material Market
4. Major Semiconductor Vendors
4.1 TSMC
4.2 Samsung
4.3 Intel
4.4 UMC
4.5 SMIC
4.6 Micron
4.7TowerJazz
4.8 VIS
4.9 Texas Instruments
4.10 GlobalFoundries
4.11 Dongbu HiTek
4.12 Magnachip
4.13 ASMC
4.14 Hua Hong NEC
4.15 Shanghai Huali Microelectronics
4.16 Powerchip
Selected Charts
Semiconductor Industry and GDP Growth Worldwide, 2000-2016
Annual CAPEX in Semiconductor Industry, 1990-2011
Global Wafer Capacity (200mm Equivalent), 2000-2012
Global Top 25 Semiconductor Manufacturers by Sales, 2011
Market Occupancy of OSAT Enterprises Worldwide, 2011
Revenue of Taiwan’s IC Packaging and Testing Industry, 2007-2011
Revenue of Semiconductor Packaging Material Manufacturers Worldwide, 2010-2013
China IC Market Scale, 2007-2011
Product Distribution of China IC Market, 2011
Application Distribution of China IC Market, 2011
Market Occupancy of Major IC Manufacturers in China, 2011
Market Occupancy of Major Analog Semiconductor Manufacturers, 2011
Market Occupancy of Catalog Analog Semiconductor Manufacturers, 2011
Ranking of Top 10 Analog Semiconductor Manufacturers, 2011
Ranking of MCU Manufacturers, 2011
CAPEX in DRAM Industry, 2000-2012
Global DRAM Shipment, 2000-2013
DRAM Contract Price Fluctuation, Oct.2009-Jan.2012
Revenue of DRAM Manufacturers Worldwide, 2005Q1-2012Q4
Global DRAM Wafer Shipment, 2010Q1-2012Q4
RAM Demand, 2001-2013
Ranking of DRAM Brand Manufacturers by Revenue, 2011Q4
GaAs Industry Chain
Major Manufacturers in GaAs Industry Chain
Ranking of GaAs Manufacturers Worldwide by Revenue, 2011-2012
Capacity of 12-Inch Wafer Worldwide, 2011
Capacity of 12-Inch Wafer Manufacturers Worldwide by Region, 1999-2012
Global Wafer Equipment Expenditure by Region, 2010-2012
Ranking of Wafer Foundries Worldwide by Sales, 2005-2011
Operating Margin of Major Wafer Foundries Worldwide, 2005-2011
Ranking of Global Top 30 MEMS Enterprises by Revenue, 2011
Ranking of Global Top 20 MEMS Wafer Foundries, 2011
Sales of Wafer Foundries from Chinese Customers, 2011
Global Mobile Phone Shipment, 2007-2014
Quarterly Mobile Phone Shipment Worldwide and Annual Growth Rate, 2009Q1-2011Q4
3G/4G Mobile Phone Shipment by Region, 2010-2012
Quarterly Shipment of Major Mobile Phone Brands Worldwide, 2010-2011
Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011
Smartphone Shipment of Major Mobile Phone Manufacturers Worldwide, 2010-2011
Market Occupancy of Smartphone Operating Systems, 2011
Global Shipment of CPU and GPU for PC, 2008-2013
Shipment of Netbook, iPad and Tablet PC, 2008-2012
Global Investment in Wafer Equipment, 2007-2016
CAPEX of Global Semiconductor Manufacturers, 2011-2016
WLP Packaging Equipment Expenditure Worldwide, 2011-2016
Die Packaging Equipment Expenditure Worldwide, 2011-2016
Automatic Checkout Equipment Expenditure Worldwide, 2011-2016
CAPEX of Global Top 10 Semiconductor Manufacturers, 2011-2012
Global Semiconductor Material Market by Region, 2010-2013
Semiconductor Rear-end Equipment Expenditure Worldwide by Region, 2010-2012
Structure of TSMC
Revenue and Operating Margin of TSMC, 2004-2011
Shipment and Capacity Utilization of TSMC, 2004-2011
Quarterly Revenue and Operating Margin of TSMC, 2009Q1-2011Q4
Quarterly Shipment and Operating Margin of TSMC, 2009Q1-2011Q4
Application of TSMC Products, 2005-2011Q4
Revenue of TSMC by Node, 2008Q3-2011Q4
Installed Capacity of TSMC by Plant, 2010-2012Q1
Installed Capacity of TSMC by Plant, 2008-2012
Revenue from System LSI Division of Samsung, 2011Q1-2012Q4
Revenue and Operating Margin from System LSI Division of Samsung, 2011Q1-2012Q4
Revenue and Operating Margin from NAND Business of Samsung, 2011Q1-2012Q4
Revenue and Operating Margin from DRAM Business of Samsung, 2011Q1-2012Q4
Revenue and Gross Margin of Intel, 2004-2011
Revenue and Operating Margin of Intel, 2004-2011
Revenue and Net Profit Margin of Intel, 2004-2011
Revenue of Intel by Region, 2006-2011Q4
Revenue of Intel by Product, 2006-2008
Revenue of Intel by Product, 2008-2010
CPU Technology Roadmap of Intel
Intel Bases Worldwide
Intel Wafer Fab List
Revenue and Operating Margin of UMC, 2003-2011
Shipment and Capacity Utilization of UMC, 2003-2011
Quarterly Revenue and Gross Margin of UMC, 2010Q1-2012Q1
Quarterly Revenue of UMC by Region, 2010Q1-2012Q1
Quarterly Revenue of UMC by Node, 2010Q1-2012Q1
Quarterly Revenue of UMC by Application, 2010Q1-2012Q1
Quarterly Shipment and Capacity Utilization of UMC, 2010Q1-2012Q1
Revenue and Operating Margin of SMIC, 2005-2012
Revenue and Gross Margin of SMIC, 2009Q1-2011Q4
Revenue of SMIC by Application, 2009Q1-2011Q4
Revenue of SMIC by Region, 2009Q1-2011Q4
Quarterly Revenue of SMIC by Node, 2009Q1-2011Q4
Shipment and Capacity Utilization of SMIC, 2009Q1-2011Q4
Capacity of SMIC by Plant, 2010Q1-2011Q4
Distribution of SMIC Plants
Major Customers of SMIC
Revenue and Operating Margin of Micron, FY2007-FY2012
Revenue of Micron by Division, FY2009-FY2012
Revenue of Micron by Application, 2007-2012Q1
Revenue of Micron by Technology, 2007-2012Q1
Micron Bases Worldwide
Revenue and Gross Margin of TowerJazz, 2003-2011
Revenue of TowerJazz by Technology, 2009-2011
Revenue of TowerJazz by Region, 2006-2011
Revenue and Operating Margin of VIS, 2005-2012
Revenue and Gross Margin of VIS, 2010Q1-2012Q1
Revenue of VIS by Node, 2010Q1-2012Q1
Revenue of VIS by Application, 2010Q1-2012Q1
Revenue of VIS by Product, 2009Q1-2012Q1
Shipment and Capacity Utilization of VIS, 2010Q2-2012Q1
Revenue and Operating Income of Texas Instruments, 2007-2011
Revenue of Texas Instruments by Division, 2009-2011
Revenue of Texas Instruments by Region, 2009-2011
Revenue of Texas Instruments by Product, 2006\2011\2012Q1
Production Bases of Texas Instruments Worldwide
Global Presence of GlobalFoundries
Technical Strength of GlobalFoundries
Revenue and Operating Margin of Dongbu HiTek, 2005-2012
Capacity and Output of Dongbu HiTek, 2006Q1-2011Q4
Capacity Utilization of Dongbu HiTek, 2006Q1-2011Q4
Overview of Dongbu HiTek
Capacity of Dongbu HiTek, 2007-2011
Technology Distribution of Dongbu HiTek
Major Customers of Dongbu HiTek
Technology Roadmap of Dongbu HiTek
Revenue and Gross Margin of Magnachip, 2001-2011
Revenue of Magnachip by Business, 2004-2011
Revenue of Magnachip by Region, 2009-2011
Wafer Foundry Technology Roadmap of Magnachip
Revenue from Wafer Foundry Business of Magnachip, 2011
Wafer Plants of Magnachip
ASMC's Current Shareholding Structure
Gross Margin of ASMC, 2003-2011
Revenue of ASMC by Wafer Plant, 2010Q1-2011Q4
Revenue of ASMC by Application, 2010Q1-2011Q4
Revenue of ASMC by Customer Type, 2010Q1-2011Q4
Revenue of ASMC by Region, 2010Q1-2011Q4
Quarterly Capacity Utilization of ASMC, 2009Q1-2011Q4
Capacity Utilization of ASMC by Water Plant, 2010Q1-2011Q4
Revenue of Hua Hong NEC, 2003-2010
Roadmap of Hua Hong NEC
Revenue of Grace, 2004-2010
Overview of Powerchip Fab
