The MEMS packaging, assembly, test & calibration market will reach $2.3B value by 2016, growing three times faster than the overall IC packaging industry
MEMS PACKAGING MARKET IS GROWING FASTER THAN IC PACKAGING MARKET
In package unit shipments, the MEMS packaging market is growing 2x faster (~ 20% CAGR) than what is predicted for the overall IC package market. WLP / TSV platform is set to grow the fastest while leadframe and organic laminate based packages are poised to grow a comfortable 16% CAGR over the next 5 years to come.
There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.
CHANGING THE PARADIGM
In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged module’s cost.
MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.
The application scope of MEMS is broad and very diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with NO manufacturing standards clearly emerging
Packaging always needed to cope with the very specific end-applications requirements of MEMS modules
However, the MEMS law “One MEMS = 1 Device with 1 Process with 1 Package” is now changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for e.g.)
This report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.
STANDARDS ARE ON THE WAY
While there are a lot of developments happening for high reliability, low cost MEMS packages in the automotive, medical and industrial application space, the number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket, driving integration of an incredibly high number of MEMS and sensor devices in unprecedented volume. As a result, OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of MEMS SiP modules is increasing dramatically, implying several key trend in this space:
-IDMs needs to find second sources partners and qualify some OSATs in order to secure their supply chain
-Standardization (coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, test and calibration cost of MEMS modules under control.
More than ever, system-level integration (including package co-design & software competencies, SiP module assembly, passive integration and 3D TSV / WLP capabilities) will be key to leverage a high added value solution to final OEM customers as well as an efficient infrastructure to support the high volume grow of consumer MEMS applications. There are many different players with different designs, and it’s not likely we’ll see one solution adopted by all the players. Expect to see a blooming of several “big niches” standards in the future, driven by the biggest and most successful players.
KEY FEATURES OF THE REPORT
*To provide market data on key MEMS packaging industry market metrics & dynamics
Focus on key MEMS applications (including Silicon microphones, gyroscopes, accelerometers, magnetometers, fusion sensor combo units & IMU, pressure sensors, TPMS modules, micro-mirrors, micro-bolometers, oscillators & resonators, switches, FBAR/BAW filters, SAW filters, ink-jet MEMS modules, microfluidic & Biochips, micro-displays, micro-actuator auto-focus, etc…)
MEMS package and substrate unit shipments and revenues application by application
Market shares for key MEMS player with detailed breakdown inside each MEMS applicative segment
*To provide technical insight about key MEMS packaging technology trends & challenges
From MEMS-ASIC integration trends (SiP module versus SOC) to interconnect trends (wire-bond versus flip-chip versus WLP / TSV) to substrate approach (ceramic, leadframe, organic laminate, silicon/glass interposers)
Teardowns module analysis and reverse costing analysis of the main key MEMS package modules design wins from top tiers player leaders in their respective applicative market space
Specific requirements in each MEMS packaging applications along with packaging technologies roadmaps
Focus on final test and calibration trends which represent more than 20-30% of the total MEMS modules value
*To provide a deep understanding of the MEMS packaging value chain, infrastructure & players
Who are the key players (IDMs, fab-less, wafer foundries, packaging & test subcontractors) involved in the MEMS packaging business and how are they related?
Where is the value in the MEMS packaging, assembly, test & calibration area depending on each application? How this value is shared among the different business models in this space and how does this value flows?
COMPANIES CITED IN THIS REPORT
AAC Acoustic Technologies, Aichi MI, AKM, Akustica, Amkor, Analog Devices, ASE, Avago Technologies, bTendo, Bosch, Carsem, Canon, China WLCSP, Colibrys, DALSA / Teledyne, DelfMEMS, Denso, Discera, DRS, Epcos – TDK, EPWorks, FLIR Systems, Freescale, Fujifilm Dimatix, Fujikura, GE Sensing, Goodrich-AIS, Hana Microelectronics, Honeywell, Hosiden, HP, Infineon, Invensense, Ion Torrent, JCAP, J-Devices, Kionix, Knowles Electronics, KYEC, Kyocera, Lemoptix, Lexmark, Lingsen, MEM Hitech, Melexis, MEMJET, MEMSiC, Microvision, Miradin, Murata, NEC / Schott, Oak-Mitsui, NXP Semiconductor, Olympus, Omron, Panasonic, PlanOptik, PoLight, Pyreos, Qualcomm MEMS Technologies, Raytheon, Rohm, Rood Microtec, Sand9, Sencio, Seiko-Epson, Sensata, Sensonor, Sensor Dynamics, Shinko, SiTime, Silex Microsystems, Silicon Sensing Systems, Sony, SPIL, StatsChipPAC, STMicroelectronics, Systron Donner Inertial, Taiyo-Yuden, Tecnisco, Teramikros, Texas Instruments, Tong Hsing Electronics, Triquint Semiconductor, Tronics Microsytems, TSMC, ULIS, Unimicron, Unisem, UTAC, VTI Technologies, WiSOL, Wispry, X-Fab, Xintec, Yamaha…
WHO SHOULD BUY THE REPORT?
Assembly & test service packaging subcontractors (OSATs)
Understand the MEMS packaging industry market dynamics and its key future applications
Get the list of today’s and tomorrow key MEMS players to drive your business
Understand the key MEMS modules cost structures through explicit teardown analysis
Plan ahead for needed investments capacity related to this field
MEMS IDM’s (Integrated Device Manufacturers) and fabless companies
Get the list of the top assembly, packaging & test packaging subcontractors active in the MEMS packaging business
Benchmark competition activity and choose the right package and partner for your future MEMS module applications
Substrate suppliers
Understand the differentiated value of your products and technologies in the MEMS market
Evaluate your related TAM ‘Total Accessible Market’ in this market
Get the list of today’s and tomorrow key MEMS players to drive your business
MEMS and CMOS wafer foundries
Spot new opportunities and define diversification strategies, especially related to the MEMS Wafer-Level-Packaging opportunity (with wafer bonding, TSV, RDL and bumping features)
Electronic module makers and OEMs
Evaluate the benefits of using these new technologies in your end system
Monitor new application and package trends
Electronic Component And Semiconductor Industry
TABLE OF CONTENTS
Introduction to MEMS industry p.8
Applications, players and market dynamics
Executive Summary p.21
Global MEMS packaging 2010-2016 market forecast p.40
Overall MEMS package shipments forecast (in units)
Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…
Global MEMS package, assembly & test value (in M$)
Breakdown by package type, applications, assembly trends, interconnect type, substrate type, etc…
Supply & value chain for MEMS Packaging p.80
MEMS module packaging
Key manufacturing steps
Who is doing what?
Main key business models
MEMS packaging supply chain
Example of supply chains for several case examples
Overall supply chain with links between major key players
MEMS packaging industry value chain analysis
‘captive’ versus ‘outsourced’ strategy trends for MEMS packaging, assembly, test & calibration
Application focus for MEMS packaging p. 99
Silicon microphones p. 100
Key players & market shares
Teardowns module analysis
Packaging, assembly & test specificities
Cost structure analysis (MEMS / ASIC, module assembly &Test)
Supply chain & infrastructure
Packaging roadmaps & perspectives
Accelerometers p.109
Gyroscopes p.125
Magnetometers p.137
Motion sensor Combos & IMUs p.146
Pressure-sensors & TPMS p. 153
Oscillators & resonators p. 163
FBAR / BAW filters p. 177
SAW filters p.190
Micro-mirrors p.202
Micro-bolometers p. 212
Ink-jet MEMS modules p. 225
Microfluidic packaging p. 236
Emerging MEMS (switches, µdisplays) p.242
MEMS testing & calibration trends p. 257
Focus on MEMS wafer testing
Focus on MEMS final test & calibration
Conclusions & Perspectives p.288
Appendix p. 294
Acronyms & Definitions p.295
Yole Developpement presentation p. 296
LIST OF FIGURES
2010-2016 MEMS market forecast shipments by applications (in Munits) p.10
2010-2016 MEMS market value forecast evolution by industry (in M$) p.12
2010-2016 MEMS market forecast by applications (in USM$ revenues) p.13
MEMS market value 2011 versus 2017 breakdown by application (in M$) p.14
2011 MEMS Ranking in $M – TOP 30 players p.15
2011 MEMS Ranking in $M – TOP 30 to 70 players p.16
TOP 30 MEMS players ranking by Business Model p.18
2011 MEMS Foundries Ranking p.20
MEMS Packages versus IC Packages Shipment forecast (in Munits) p.23
MEMS Packaging versus IC Packaging Market forecast (in BUS$, including Final Test value) p.24
2010 MEMS Packaging assembly trends (in Munit shipments) p.43
2010 MEMS Packaging platform assembly trends (in Munit shipments) p.45
2010 MEMS Packaging, Assembly, Final Test & Calibration market breakdown by applications p.48
2010-2016 MEMS Packaging, Assembly, Final Test & Calibration value forecast breakdown by applications (in MUS$) p.49
2010-2016 MEMS packaging & assembly value forecast breakdown by applications (in MUS$) p.51
2010-2016 MEMS packaging Final Test & Calibration value forecast breakdown by applications (in MUS$) p. 52
2010 ASIC-to-MEMS integration trends Breakdown in Munits (SiP integration / SOC single die) p.56
2010 MEMS first-Level Packaging Breakdown by technology (no 1st level /WLCapping / Thin-film packaging) p.61
2010 MEMS interconnect assembly Trends breakdown (Wire-bond / flip-chip / WLCSP / 3D TSV) p.65
2010 MEMS Substrates business (in MUS$) Breakdown per category (ceramic / leadframe / organic laminate / Glass&Silicon) p. 69
2010 Organic laminate substrate for MEMS applications - Value Breakdownp.70
2010 Leadframe substrates for MEMS applications - Value Breakdown p.71
2010 Ceramic substrate market for MEMS applications - Value Breakdownp.72
2010 Glass/Silicon 2.5D interposer substrates for MEMS applications - Value Breakdown p.73
2010 MEMS Encapsulation/Sealing/Protection - Trends Breakdown in Munitsp.77
2010 MEMS packaging, assembly, test & calibration trends- ‘captive’ versus ‘outsourced’ strategy p.94
2010 – 2016 MEMS packaging, assembly, test & calibration activity ‘captive’ versus ‘outsourced’ strategy trends p.95
2010 MEMS packaging value chain Representative view of business model’s intersections p.96
