The first complete report analyzing in detail the  opportunities for Polymeric Materials in 3DIC & Wafer-Level Packaging applications
 
POLYMER USAGE WILL GROW BY 26% CAGR IN WAFER LEVEL APPLICATIONS OVER 5 YEARS

Polymeric semiconductor material market reached a value of $274M last year and its growth over the next 5 years of more than 26% CAGR will be fueled by the expansion of flip-chip wafer bumping, Fan-in WLCSP packages, 3D WLP, FO WLP packages, 2.5D Glass / Silicon interposers and 3DIC  packages.

Yole analysts have gathered market data, technology information and analysis necessary to answer the following questions:

What materials are being used in what applications ?
What key properties do I need to understand before I make a material choice ?
Who are the key supplies of these materials  and what is their market share?
What synergies do competitors have in their product lines ?
 
AN INCREASING NUMBER OF POLYMERS ARE USED FOR WLP APPLICATIONS 

About half of the demand today for polymeric materials in 3DIC & WLP applications is driven by dielectric passivation resins which reached about $107M market value in 2011.

Polymide (PI) and BCB of DOW Chemical still account for > 70% of the total demand, historically by the growth flip-chip bumping an WLCSP passivation steps. 

PBO, epoxies, WPR and AL-X recently entered the market thanks to the recent growth demand in 300mm WLCSP, FOWLP and emerging 3DIC applications.

This research will cover :
Global materials market forecast
Global forecast  breakdown by application
Global forecast  breakdown by function
Detailed market breakdown of permanent dielectrics by material, supplier, account
 
A WIDE RANGE OF POLYMERIC MATERIALS ARE USED TO SOLVE WLP ISSUES

There is a wide range of polymeric material available on the market. This study will feature:
Chemistries  and history of key microelectronic polymers
Properties, pros & cons for each solution
Applications by polymer type
Processing considerations

 NEW FUNCTIONS OF POLYMERIC MATERIALS ARE LEVERAGING BURGEONING WLP MARKET

Today demand is driven by FC wafer bumping, fan-in WLCSP and thin-film IPD. Tomorrow,  significant demand will shift to FOWLP, 3DIC stacks,  3D WLP, and 2.5D interposer substrate platforms.


Types of polymeric materials covered:
Permanent dielectric polymers
Thick plating resists
Temporary bonding &
de-bonding adhesives
Hard mask resist for DRIE etch
Wafer-level underfills
Wafer-level molding compounds
Adhesive tape (BG/Dicing tape)
 
DETAILED MATERIAL SUPPLIER PROFILES

Corporate profiles detailing financials, employees, polymer products for wafer level packaging and selected properties  of these  products are compared and contrasted for: 3M, Ajinomoto, Asahi Glass, Asahi Kasei, Brewer Science, Cookson, Dow Chemical, Dow Corning, DuPont, HD Microsystems, Fujifilm, Hitachi Chemical, Henkel, JSR Micro, Lord, Namics, Nitto Denko, Nippon Kayaku, Shin Etsu, Silecs, Simitomo Bakeite, TOK and Toray.
 
WHO SHOULD BUY THIS REPORT?

*Material suppliers 
Assess the TAM ( total accessible market) for your company’s polymeric products
Identify tech trends, challenges and requirements for each 3DIC / WLP scenarios. Are their markets you could be serving?
*Materials users (IDMs,  Wafer Foundries, Packaging Houses)
Identify competitive materials, What are others using ?
Consolidate suppliers by understanding their full product offerings
*Equipment Vendors  
What materials should you be developing processes for ?
What are the technology trends ?
 

Table Of Contents

Table of Contents

Scope of the report p.4
Executive summary p.10
Key Properties of Polymeric materials p.22-6
Electrical properties
Mechanical Properties
Thermal Properties
Others Properties
Comparison of Polymer  Properties
Commercial Microelectronic Polymer Chemistries p.62
Epoxies
Polyimides
Polybenzoxozoles (PBO)
BCB
Siloxanes   
Parylene   
Polynorbornenes
AL-X aromatic fluoropolymer
Polymeric materials for Wafer Level Packaging Functions Applications p.111
Permanent dielectric polymers
Strippable plating resists   
Temporary bonding and de-bonding  Adhesives
Hard mask Thick resist for DRIE
Wafer-level underfills
Wafer-level Molding Compounds
Permanent Dielectric -Material Processing Considerations p.199
Wafer-level Molding Compounds
Spin-coating
Spray-coating
Other depositions
Lithography (Expose and Develop)
Curing / Descum
Stripping/cleaning
Mid-End / WLP Application platforms p.237
Flip-chip wafer bumping
‘Fan-in’ WL CSP
FO WLP
3D WLP
3D IC with TSV
2.5 silicon interposers
Passive Integration - Thin-film IPD
Market size by Material / Application/Supply chain p.280
WLP Materials market forecast for WLP applications
2011-2016 Global Materials Market Forecast
2011-2016 Global Materials market forecast breakdown
2010-2016 Polymer materials forecast breakdown by materials functions
Dielectric passivation polymers: details market forecast
WLP cost breakdown per material supplier 2011
WLP cost breakdown by polymer type 2011
Polymer market share per supplier
Demand by player breakdown by application per player
Polymeric material suppliers - Company  profiles p.321
Conclusions and Perspectives 
Appendix p.439

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