Current Development and Future Trends of Worldwide Baseband IC and AP Industries

  • July 2012
  • -
  • Market Intelligence & Consulting Institute
  • -
  • 23 pages

Worldwide Smartphone shipment volume is estimated to reach approximately 660 million units in 2012, accounting for around 37% of total mobile phone shipments, and this figure is projected to exceed 60% in 2016. Smartphones gradually become market mainstream, and vendors also begin to shift their focus from high-end to entry-level products and from 3G/3.5G to 4G system support. This trend is expected to pose impacts on competition in the upstream mobile communications core IC industry. This report offers insight into the worldwide baseband IC and application processor industries and strategies taken by major suppliers, as well as future development of high-end, mid-range, and entry-level solution markets.

List of Topics
Worldwide baseband IC industry, including industry shipment structure and major baseband IC suppliers' market shares
Worldwide AP (Application Processor) industry, touching on industry shipment structure and market shares of major AP suppliers
Development and trends of worldwide baseband IC and AP industries, covering high-end, mid-range, and entry-level IC markets
Relationship between the emergence of new smart handheld devices and IC market structure, forecasts of future development in high-end, mid-range, and entry-level IC markets

Table Of Contents

Current Development and Future Trends of Worldwide Baseband IC and AP Industries

Table of Contents
1. Worldwide Baseband IC Industry
1.1 Industry Shipment Structure
1.2 Market Share of Major Baseband IC Suppliers
2. Worldwide Application Processor Industry
2.1 Industry Shipment Structure
2.2 Market Shares of Major AP Suppliers
3. Worldwide Baseband IC and Application Processor Industry Development Trends
3.1 High-end IC Market: Reducing AP Power Consumption Gradually Becomes more Important than Performance Enhancement
3.2 Mid-range IC Market: Suppliers Providing Total Solutions Integrating between Baseband and AP Expected to Standout in Competition
3.3 Entry-level IC Market: Offering Reference Design is the Key; Complex Industry Structure Allows Various Suppliers to Compete in the Market
MIC Perspective
Appendix

List of Tables
Table 1 Application Processor Suppliers and Branded Vendors, 2011
Table 2 Major Chip Suppliers' Technology Blueprint for High-end Products, 2012 - 2013
Table 3 Major Chip Suppliers' Technology Blueprint for Mid-range Products, 2012 - 2013
Table 4 Smartphones Adopting Marvell TD-SCDMA Solutions
Table 5 Major Chip Suppliers' Technology Blueprint for Entry-level Products, 2012 - 2013

List of Figures
Figure 1 Worldwide Mobile Device Baseband IC Market Volume, 2010 - 2016
Figure 2 Worldwide Mobile Phone Shipment Volume by System Technology, 2010 - 2016
Figure 3 Worldwide Baseband IC Market Volume Share by Solution Provider, 2011
Figure 4 Worldwide 2G and 3G Mobile Communications Baseband IC Market Volume Share by Solution Provider, 2011
Figure 5 Worldwide Mobile Device Application Processor Market Volume, 2010 - 2016
Figure 6 Worldwide Application Processor Market Volume Share by Solution Provider, 2011
Figure 7 Worldwide Mobile Phone IC Market Volume and Value, 2012
Figure 8 ARM big.LITTLE Computing Structure Concept
Figure 9 Total LTE Patents and Pending Patents

List of Companies
Acer, Amazon, Apple, Asus, ATandamp;T, Barnes andamp; Noble, CoolPAD, Ericsson, ETSI (European Telecommunications Standards Institute), Google, GSA (The Global mobile Suppliers Association), Hisense, HTC, Huawei, Infineon, Intel, Intel Mobile, InterDigital, Leadcore, Lenovo, LG, Marvell, MediaTek, Motorola, Mstar, Nokia, NTT Docomo, Nvidia, Qualcomm, RIM, Samsung, Sharp, Sony Ericsson, Spreadtrum, ST-Ericsson, STMicroelectronics, The Research Institution of China Mobile, TI, Verizon, ZTE

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