ADVANCED ELECTRONIC PACKAGING MCP-1203
A GLOBAL STRATEGIC BUSINESS REPORT
CONTENTS
I. INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS
Study Reliability and Reporting Limitations I-1
Disclaimers I-2
Data Interpretation & Reporting Level I-2
Quantitative Techniques & Analytics I-3
Product Definitions and Scope Of Study I-3
Ball Grid Arrays I-3
Chip Scale Packaging (CSP) I-3
Multi Chip Modules (MCM) I-3
II. EXECUTIVE SUMMARY
1. Current and Future Analysis II-1
Industry Faces Challenging Times II-1
2. Industry Overview II-2
A Brief Insight II-2
Table 1: Semiconductor Capital Equipment Market Worldwide
(2005) - Percentage Breakdown of Dollar Revenues by Region:
Japan, North America, Korea, Taiwan, Europe, and Rest of
World (include corresponding Graphs/Chart) II-2
Table 2: Semiconductor Plastic Packaging Materials Market
Worldwide (2005) - Percentage Breakdown of Dollar Revenues
by Geographic Region- Southeast Asia, Japan, Taiwan, Korea,
China, and Rest of World (include corresponding
Graphs/Chart) II-2
Advanced Electronic Packaging Technology Trends (2000-2015) II-3
Table 3: Laminate Substrate Market Worldwide (2005) -
Percentage Breakdown by Technology- Flip Chip, Wire Bond,
and Chip Scale Packaging (include corresponding
Graphs/Chart) II-3
Table 4: Leading Fabless Packaging Techniques Worldwide
(2004 & 2005) - Percentage Share Breakdown for QFP, BGA,
SOIC, Leadless, CSP, FBGA, Discrete and Other (include
corresponding Graphs/Chart) II-3
Table 5: Leading Foundry Manufacturing Regions Worldwide
(2004 & 2005) - Percentage Share Breakdown for Taiwan,
Singapore/Malaysia, Korea, China, Philippines, and Other
(include corresponding Graphs/Chart) II-4
Market Share Scenario II-4
Table 6: Leading IC Socket Manufacturers Worldwide (2004 &
2005) - Percentage Share Breakdown for Yamaichi, AMP, Molex,
Thomas & Betts, FCI/Berg, and Others (include corresponding
Graphs/Chart) II-4
Table 7: Leading CSP Substrate Suppliers Worldwide (2004
&2005) - Percentage Share Breakdown for Unimicron, Ibiden,
Shinko, JCI, Samsung, LG, and Others (include corresponding
Graphs/Chart) II-5
Table 8: Leading Chip Packaging Manufacturers Worldwide (2004
& 2005) - Percentage Share Breakdown for Amkor, ASE, ChipPac,
Siliconware, Orient, STATS, ASAT, and Others (include
corresponding Graphs/Chart) II-5
3. Issues and Trends II-6
Suppliers Outsource Packaging To Curtail Costs II-6
BGAs on a Tremendous Growth Path II-6
Glue Logic Makers Move to Advanced Packaging II-6
Contractors Move Towards High Pin-Count Packages II-7
Wafer Scale Packaging Anticipated to Cut Costs II-7
Disparity in Scale Sizes - A Reason for Concern II-7
Miniaturization Impels Adoption of Wafer-Level Chip Scale
Packaging II-8
Challenges Facing Assembly and Packaging II-8
Technology Trends II-9
4. Growth Drivers II-10
Portable Equipment Drives Growth in Flip Chips II-10
Drivers for Electronic Packaging Technologies II-10
Shrinking Die Sizes to Drive New Packaging Technologies II-10
Factors Driving Growth in the Chip Scale Packaging Market II-11
Market Technology Drivers by Major End-Use Sectors II-11
5. Product Overview II-12
Definition II-12
Packaging Hierarchy II-13
Semiconductor Manufacturing Process II-13
IC Supply Chain II-13
Applications of Electronic Packaging Research II-14
Industrial Applications of Advanced Packaging and
Interconnection II-14
Requirements for Electronic Packaging II-14
Technologies that Facilitate Electronic Packaging II-14
Origin and Evolution II-14
Electronic Packaging Advances II-15
Semiconductor Packaging - Significance II-15
Product Segments II-16
Ball Grid Arrays II-17
Types of BGA II-17
Flip Chip Technology (FCT) II-18
Advantages of Flip-Chip Technology II-18
Flip Chip Materials & Modeling Infrastructure II-19
Table 9: Trends in Flip Chip Production Worldwide (2000 Vs
2005): Percentage Breakdown by End Product - Lower Lead
Count Products, Non Solder Bumped Die with TCB, Integrated
Passives, Displays/Micro displays, Non Solder Bumped Die
with Conductive Adhesive, High Performance Processors,
High Performance Memory, High Performance ASICS Mid I/O
Die, and High Frequency Products (include corresponding
Graphs/Chart) II-20
Multi Chip Modules (MCM) II-20
Advantages of MCM II-20
Disadvantages of MCM II-21
Module Assembly Techniques II-21
Module Encapsulation Techniques II-21
Chip Scale Packaging (CSP) II-21
Lead Counts by Packaging Technology - A Comparison II-22
Wafer-Level Packages II-22
Wire Bonding II-23
Stacked Die Packages II-23
Die Products II-23
Chip-On-Board (COB) II-23
Flip-Chip and Wafer-Level Packaging II-23
Adhesive Flip Chip on Flex II-24
Solder Flip-Chip II-24
6. Product Introductions/Innovations II-25
Telit Introduces M2M BGA Module II-25
RJR Polymers Introduces LCP Compatible Epoxies II-25
Five Star Technologies Launches Advanced Dispersion Products II-25
STATS Complements 3D Technology Portfolio II-25
Toshiba Develops TSSOP Advance Package II-25
Semtech Expands MicroClamp™ Family II-26
7. Recent Industry Activity II-27
TSI Group Acquires Three Los Angeles Based Brazing and
Machining Businesses II-27
Ferro Creates New Electronic Packaging Materials Unit II-27
A Group of US Based Investors Establish Chip-Packaging Plant
in Vietnam II-27
Blackstone Acquires Klockner II-27
Micronic Gets Another Asian Customer for FPS5100 Laser Pattern
Generator II-27
ASE and Flip Chip in a Licensing Agreement II-28
Quantum Acquires CiP technology from Silicon Bandwidth II-28
Sumitomo Acquires Stake in Quantum II-28
8. Focus on Select Players II-29
Advanced Semiconductor Engineering Group (Taiwan) II-29
ASAT Holdings Limited (Hong Kong) II-29
Amkor Technology Inc. (US) II-29
ASM International NV (The Netherlands) II-29
ASM Pacific Technology Ltd (Hong Kong) II-30
CARSEM (Malaysia) II-30
Chipbond Technology Corp (Taiwan) II-30
ChipMos Technologies (Taiwan) II-30
FlipChip International (US) II-30
Fujitsu Ltd (Japan) II-31
NEC Electronics Corporation (Japan) II-31
Orient Semiconductor Electronics (Taiwan) II-31
Sliconware Precision Industries Co., Ltd. (Taiwan) II-31
STATS ChipPAC Ltd. (Singapore) II-32
Tessera, Inc. (US) II-32
Toshiba America Electronic Components Inc. (US) II-32
Major Strategies of Integrated Solution Providers II-32
9. Global Market Perspective II-33
Table 10: World Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Geographic Region - US,
Canada, Japan, Europe, Asia-Pacific (excluding Japan), and
Rest of World Markets Independently Analyzed with Annual
Revenues in US$ Million for Years 2000 through 2010 (includes
corresponding Graph/Chart) II-33
Table 11: World Long-Term Projections for Advanced Electronic
Packaging by Geographic Region - US, Canada, Japan, Europe,
Asia-Pacific (excluding Japan), and Rest of World Markets
Independently Analyzed with Annual Revenues in US$ Million for
Years 2011 through 2015 (includes corresponding Graph/Chart) II-34
Table 12: World 10-Year Perspective for Advanced Electronic
Packaging by Geographic Region - Percentage Breakdown of
Dollar Revenues for US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets for Years 2003,
2008 & 2012 (includes corresponding Graph/Chart) II-35
Table 13: World Recent Past, Current & Future Analysis for
Ball Grid Arrays by Geographic Region - US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan), and Rest of World
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) II-36
Table 14: World Long-Term Projections for Ball Grid Arrays by
Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets Independently
Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) II-37
Table 15: World 10-Year Perspective for Ball Grid Arrays by
Geographic Region - Percentage Breakdown of Dollar Revenues
for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets for Years 2003, 2008 & 2012
(includes corresponding Graph/Chart) II-38
Table 16: World Recent Past, Current & Future Analysis for
Chip Scale Packages by Geographic Region - US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan), and Rest of World
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) II-39
Table 17: World Long-Term Projections for Chip Scale Packages
by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets Independently
Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) II-40
Table 18: World 10-Year Perspective for Chip Scale Packages by
Geographic Region - Percentage Breakdown of Dollar Revenues
for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets for Years 2003, 2008 & 2012
(includes corresponding Graph/Chart) II-41
Table 19: World Recent Past, Current & Future Analysis for
Multi Chip Modules by Geographic Region - US, Canada, Japan,
Europe, Asia-Pacific (excluding Japan), and Rest of World
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 II-42
Table 20: World Long-Term Projections for Multi Chip Modules
by Geographic Region - US, Canada, Japan, Europe, Asia-Pacific
(excluding Japan), and Rest of World Markets Independently
Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) II-43
Table 21: World 10-Year Perspective for Multi Chip Modules by
Geographic Region - Percentage Breakdown of Dollar Revenues
for US, Canada, Japan, Europe, Asia-Pacific (excluding Japan),
and Rest of World Markets for Years 2003, 2008 & 2012
(includes corresponding Graph/Chart) II-44
III. MARKET
1. The United States III-1
A.Market Analysis III-1
Outlook III-1
Chip Manufacturers - Looking for Greener Pastures III-1
Key US Players III-1
Product Launches III-2
Strategic Developments III-3
B.Market Analytics III-4
Table 22: US Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Product Segment - Ball
Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-4
Table 23: US Long-Term Projections for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale
Packages, and Multi Chip Modules Markets Independently
Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) III-5
Table 24: US 10-Year Perspective for Advanced Electronic
Packaging by Product Segment - Percentage Breakdown of
Dollar Revenues for Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-5
2. Canada III-6
A.Market Analysis III-6
Outlook III-6
B.Market Analytics III-6
Table 25: Canadian Recent Past, Current & Future Analysis
for Advanced Electronic Packaging by Product Segment - Ball
Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-6
Table 26: Canadian Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-7
Table 27: Canadian 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-7
3. Japan III-8
A.Market Analysis III-8
Outlook III-8
Weakness in the Industry Structure III-8
Japanese Companies on Comeback Trial III-8
Select Players III-9
B.Market Analytics III-10
Table 28: Japanese Recent Past, Current & Future Analysis
for Advanced Electronic Packaging by Product Segment - Ball
Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-10
Table 29: Japanese Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-10
Table 30: Japanese 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-11
4. Europe III-12
A.Market Analysis III-12
European Advanced Packaging Technologies III-12
B.Market Analytics III-13
Table 31: European Recent Past, Current & Future Analysis
for Advanced Electronic Packaging by Geographic Region -
France, Germany, Italy, UK, and Rest of Europe Markets
Analyzed with Annual Revenues in US$ Million for Years 2000
through 2010 (includes corresponding Graph/Chart) III-13
Table 32: European Long-Term Projections for Advanced
Electronic Packaging by Geographic Region - France, Germany,
Italy, UK, and Rest of Europe Markets Analyzed with Annual
Revenues in US$ Million for Years 2011 through 2015
(includes corresponding Graph/Chart) III-14
Table 33: European 10-Year Perspective for Advanced
Electronic Packaging by Geographic Region - Percentage
Breakdown of Dollar Revenues for France, Germany, Italy, UK,
and Rest of Europe Markets for Years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-15
Table 34: European Recent Past, Current & Future Analysis
for Advanced Electronic Packaging by Product Segment - Ball
Grid Arrays, Chip Scale Packages, and Multi Chip Modules
Markets Independently Analyzed with Annual Revenues in US$
Million for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-16
Table 35: European Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-16
Table 36: European 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-17
4a. France III-18
Market Analysis III-18
Table 37: French Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Product Segment - Ball Grid
Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-18
Table 38: French Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-19
Table 39: French 10-Year Perspective for Advanced Electronic
Packaging by Product Segment - Percentage Breakdown of
Dollar Revenues for Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-19
4b. Germany III-20
A.Market Analysis III-20
Outlook III-20
B.Market Analytics III-20
Table 40: German Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Product Segment - Ball Grid
Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-20
Table 41: German Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-21
Table 42: German 10-Year Perspective for Advanced Electronic
Packaging by Product Segment - Percentage Breakdown of
Dollar Revenues for Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-21
4c. Italy III-22
Market Analysis III-22
Table 43: Italian Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Product Segment - Ball Grid
Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-22
Table 44: Italian Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-23
Table 45: Italian 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-23
4d. The United Kingdom III-24
Market Analysis III-24
Table 46: UK Recent Past, Current & Future Analysis for
Advanced Electronic Packaging by Product Segment - Ball Grid
Arrays, Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2000 through 2010 (includes corresponding
Graph/Chart) III-24
Table 47: UK Long-Term Projections for Advanced Electronic
Packaging by Product Segment - Ball Grid Arrays, Chip Scale
Packages, and Multi Chip Modules Markets Independently
Analyzed with Annual Revenues in US$ Million for Years 2011
through 2015 (includes corresponding Graph/Chart) III-25
Table 48: UK 10-Year Perspective for Advanced Electronic
Packaging by Product Segment - Percentage Breakdown of
Dollar Revenues for Ball Grid Arrays, Chip Scale Packages,
and Multi Chip Modules Markets for years 2003, 2008 & 2012
(includes corresponding Graph/Chart) III-25
4e. Rest of Europe III-26
A.Market Analysis III-26
Outlook III-26
Strategic Development III-26
Key Player III-26
ASM International NV (The Netherlands) III-26
B.Market Analytics III-27
Table 49: Rest of Europe Recent Past, Current & Future
Analysis for Advanced Electronic Packaging by Product
Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual
Revenues in US$ Million for Years 2000 through 2010
(includes corresponding Graph/Chart) III-27
Table 50: Rest of Europe Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-28
Table 51: Rest of Europe 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-28
5. Asia-Pacific III-29
A.Market Analysis III-29
Outlook III-29
A Brief Review III-29
China - A Promising Market III-29
Taiwan - Looking Ahead III-29
Product Launch III-30
Strategic Developments III-30
Key Players III-30
Advanced Semiconductor Engineering Group (Taiwan) III-30
ASAT Holdings Limited (Hong Kong) III-31
STATS ChipPAC Ltd (Singapore) III-31
ASM Pacific Technology Ltd. (Hong Kong) III-31
CARSEM (Malaysia) III-31
Chipbond Technology Corp (Taiwan) III-31
ChipMos Technologies (Taiwan) III-31
Orient Semiconductor Electronics (Taiwan) III-32
Siliconware Precision Industries Co., Ltd. (Taiwan) III-32
STATS ChipPAC Ltd (Singapore) III-32
B.Market Analytics III-33
Table 52: Asia-Pacific Recent Past, Current & Future
Analysis for Advanced Electronic Packaging by Product
Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual
Revenues in US$ Million for Years 2000 through 2010
(includes corresponding Graph/Chart) III-33
Table 53: Asia-Pacific Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-34
Table 54: Asia-Pacific 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-34
6. Rest of World III-35
Market Analysis III-35
Table 55: Rest of World Recent Past, Current & Future
Analysis for Advanced Electronic Packaging by Product
Segment - Ball Grid Arrays, Chip Scale Packages, and Multi
Chip Modules Markets Independently Analyzed with Annual
Revenuesin US$ Million for Years 2000 through 2010
(includes corresponding Graph/Chart) III-35
Table 56: Rest of World Long-Term Projections for Advanced
Electronic Packaging by Product Segment - Ball Grid Arrays,
Chip Scale Packages, and Multi Chip Modules Markets
Independently Analyzed with Annual Revenues in US$ Million
for Years 2011 through 2015 (includes corresponding
Graph/Chart) III-36
Table 57: Rest of World 10-Year Perspective for Advanced
Electronic Packaging by Product Segment - Percentage
Breakdown of Dollar Revenues for Ball Grid Arrays, Chip
Scale Packages, and Multi Chip Modules Markets for years
2003, 2008 & 2012 (includes corresponding Graph/Chart) III-36
IV. COMPETITIVE LANDSCAPE
-Aavid Thermalloy LLC (USA)
-Advanced Interconnect Technologies (Singapore)
-Advanced Semiconductor Engineering Group (Taiwan)
-Amkor Technology, Inc (USA)
-Analog Devices, Inc (USA)-Asat Holdings Limited (Hong Kong)
-ASM International NV (The Netherlands)
-Atmel Corporation (USA)
-California Micro Devices Corporation (USA)
-Carsem (M)
Sdn Bhd (Malaysia)
-Chipscale, Inc (USA)
-Datacon Semiconductor Equipment GmbH (Austria)
-Dupont Electronic Technologies (USA)
-Fairchild Semiconductor International, Inc (USA)
-Flextronics Semiconductor (USA)
-Flip chip International LLC (USA)
-Fujitsu Limited (Japan)
-Global Advanced Packaging Technology Ltd (China)
-Globetronics Technology Bhd (Malaysia)
-Hitachi Ltd (Japan)
-Hynix Semiconductor, Inc (Korea)
-Ibiden Circuits Of America Corporation (USA)
-Infineon Technologies AG (Germany)
-Integrated Device Technology, Inc (USA)
-Intel Corporation (USA)
-Interconnect Systems, Inc (USA)
-Interpoint Corporation (USA)
-Intersil Corporation (USA)
-Ironwood Electronics, Inc (USA)
-Kingpak Technology, Inc (USA)
-Royal Philips Electronics NV (The Netherlands)
-Kyocera America, Inc (USA)
-Lattice Semiconductor Corporation (USA)
-LG Electronics (South Korea)
-LSI Logic Corporation (USA)
-Maxtek Components Corporation (USA)
-Micron Technology, Inc (USA)
-Micronic Laser Systems AB (Sweden)
-Microsemi Corporation (USA)
-Mitsubishi Electric and Electronics USA, Inc (USA)
-Mitsui High-Tec, Inc (Japan)
-Motorola, Inc (USA)
-M-Systems Flash Disk Pioneers Ltd (Israel)
-National Semiconductor Corporation (USA)
-NEC Electronics Corporation (Japan)
-NemeriX SA (Switzerland)
-NTK Technologies, Inc (USA)
-Ohmite Manufacturing Co (USA)
-OKI Semiconductor Company (USA)
-Orient Semiconductor Electronics Ltd (Taiwan)
-Pantronix Corporation (USA)
-Parelec, Inc (USA)
-Philips Semiconductors (The Netherlands)
-Phoenix Precision Technology Corporation (Taiwan)
-Polymer Assembly Technology, Inc (USA)
-Samsung Electro-Mechanics Co, Ltd (South Korea)
-Sanmina-SCI Corporation (USA)
-Semtech Corporation (USA)
-Sharp Microelectronics of the Americas (USA)
-Shellcase Limited (Israel)
-Shinko Electric Co, Ltd (Japan)
-Silicon Storage Technology (USA)
-Siliconware Precision Industries Co, Ltd (Taiwan)
-Skyworks Solutions, Inc (USA)
-ST Assembly Test Services (Singapore)
-ST Microelectronics, Inc (USA)
-Stats Chippac, Ltd (Singapore)
-TDA Systems, Inc (USA)
-Tessera Technologies, Inc (USA)
-Texas Instruments, Inc (USA)
-Toshiba America Electronic Components, Inc (USA)
-Traquair Data System, Inc (USA)
-Unimicron Corporation (Taiwan)
-Unitive, Inc (USA)
-White Electronic Designs Corporation (USA)
-WJ Communications, Inc (USA)
-Yamaichi Electronics USA, Inc (USA)
