AC-DC Power Supplies: Economic Factors, Application Drivers, Architecture/Packaging Trends, Regulatory and Technology Developments, Ninth Edition

AC-DC Power Supplies: Economic Factors, Application Drivers, Architecture/Packaging Trends, Regulatory and Technology Developments, Ninth Edition

Over the next few years, ac-dc power supplies will represent a faster growth opportunity than board-mounted dc-dc converter modules. This is a major development and marks a significant departure from past patterns. Historically, power converter makers have turned to dc-dc converter modules for high growth rates. That will no longer be possible. As a result of numerous factors, ac-dc power supplies now represent a better long-term growth opportunity than dc-dc converter modules (see Graphs 1-3).

Despite a global economic slowdown, the outlook for the worldwide embedded ac-dc power supply market is expected to remain strong. Evolving powering architectures, packaging trends, and global standards for improvements in energy efficiency are combining with developments in advanced components and new markets for ac-dc power and to create new opportunities for makers of ac-dc power supplies.

Two particularly significant technological and architectural trends include the continued move towards single-output power supplies and the further adoption of front-end power supplies. Evidence of this can be seen in the complexity of today’s electronics applications, which use an increasing number of voltage rails, making multiple-output power supplies impractical in many devices. This can be seen in applications ranging from personal computers and plasma TVs to servers and Ethernet switches. Higher–end devices present even more opportunities, as modern telecommunications and data communications are deploying ac front ends as the primary means of converting ac mains voltage to the more useable voltages required by logic devices, auxiliary/peripheral devices, and/or alternate point-of-load regulators and dc-dc converters. Hot swap capability and the need to parallel ac-dc front ends for redundancy in mission critical facilities will also act as a driving factor.

The emergence of LED lighting as a major application area is another instance where single-output power supplies will have a strong positive impact on the market. More and more often, high-power LEDs are leaving their niche in small displays and are used in mainstream lighting applications requiring power levels of 100W or greater. At the same time, demand for lower-wattage LED power supplies will also remain strong. Given this increasing demand for LED lighting applications, a growing number of companies are introducing ac-dc power supplies designed exclusively for high-brightness LED lighting applications.

Digital power management and control have also made significant strides in ac-dc power supplies over the past several years. Digitally controlled architectures for power conversion and power management have emerged as an accepted technology. Used primarily in higher-end applications, digital power has created a number of new design opportunities. Digital power is also more efficient in applications featuring power factor correction, because these applications often require voltage and current profiling and are better implemented in digital rather than in analog. Digital power conversion has become a mainstream technology and is being used as a source of product differentiation by more and more makers of ac-dc power supplies.

In addition, there are a number of new and important packaging trends and applications moving into the market. The growing influence of the Advanced Telecommunications Computing Architecture (ATCA), which is targeted at the requirements for the next generation of carrier-grade communications equipment including telecom and data systems centers, is especially important. The ATCA architecture provides high levels of availability via redundancy and hot swapping techniques, which will provide a host of opportunities for embedded ac-dc power supplies.

A number of new materials are being developed and introduced into the industry. Among them are silicon carbide (SiC)-based power devices, which are said to exhibit superior properties such as very low switching losses, fast switching behavior, improved reliability and high temperature operation capabilities. The advantage of these properties is that they contribute toward the ability to increase switching frequency, decrease the size of passive components and switches, and reduce the need for cooling, thus making the devices good candidates for ac-dc power supplies.

In addition to the applications and trends driving the industry, the market for ac-dc power supplies is strongly influenced by a number of technological and regulatory factors. These factors vary from application to application and represent both opportunities and threats to the market. They include: the growing need for power factor correction as the average wattage for applications has increased; the further development of PoE; the already-mentioned development of ATCA; and the increasing importance of power supply efficiency, stemming from both regulatory bodies and economic conditions.

Among the areas examined in this report are the technology, architecture and packaging trends affecting the industry, as well as a thorough discussion of new and emerging technologies and materials, potential threats and the latest regulatory developments and standards. Over 25 tables, graphs and illustrations are presented depicting a variety of power system schematics and comparisons, architectural standards, product introductions, packaging solutions, efficiency standards and other relevant information. The focus of this comprehensive analysis provides decision makers with an insightful look into the current and future opportunities and threats available in the embedded ac-dc power supply market.


Topics Covered Include:
• Introduction
• General Economic Environment
• Application Segments
• Technology, Architectures and Packaging Trends
• Advanced Technology, Materials and Packaging
• Potential Technological Threats
• Technological and Regulatory Developments
• Powerline Communications & Broadband-over-Powerline

The market for ac-dc power supplies will continue to grow, but the rate and trajectory of that growth are being altered by numerous factors. In the near term, growth will slow as result of the current economic downturn. However, the impact of today’s economic troubles will vary widely from potentially devastating to hardly noticeable, depending on the specific market segment and product category being considered. One of the accomplishments of this current analysis is to identify the varying intensities of these changing economic dynamics. Critical and often subtle longer-term trends are also identified and discussed.

Among the areas examined in this report are the technology, architecture and packaging trends affecting the industry, as well as a thorough discussion of new and emerging technologies and materials, potential threats and the latest regulatory developments and standards. Over 25 tables, graphs and illustrations are presented depicting a variety of power system schematics and comparisons, architectural standards, product introductions, packaging solutions, efficiency standards and other relevant information. The focus of this comprehensive analysis provides decision makers with an insightful look into the current and future opportunities and threats available in the embedded ac-dc power supply market.


7X24 Exchange, 80-Plus, A1Tech, Advanced Micro Devices, Advanced Telecommunications Computing Architecture, AFCOM, Alcatel, Alliant Energy, American Power Conversion, American Society of Heating, Refrigeration and Air Conditioning Engineers, Analog Devices, Armstrong World Industries, Astrodyne, AT&T, AVP, Black & Decker, Brinjac Engineering, Brocade, California Energy Commission, C&D Technologies, Cherokee International, ChiL Semiconductor, China Compulsory Certificate, China Energy Conservation Project, China National Regulatory Commission for Certification and Accreditation, Cisco Systems, CleanTech Commercialization, Comcast, Communications Platforms Trade Association, Consumer Electronics Association, Cree, Crestron Electronics, Critical Facilities Roundtable, Current Group, Darnell’s Digital Power Forum, Defense Assurance Guidance for Airborne Electronic Hardware, Dell, Delta Power, DirectTV, D-Link, Dranetz-BMI, Ecos Consulting, den Park Illumination, Electric Power Research Institute, EMC, EMerge Alliance, Emerson Network Power, Enel, Energias de Portugal, Ericsson, E-Street, European Commission, European Telecommunications Standards Institute, European Union Code of Conduct, Fairchild Semiconductor, Federal Energy Management Program, Finelite, Fujitsu-Siemens, Future Facilities, GigaFast, Green Grid, Green Plug, Hawking, HCL Infosystems, Hewlett-Packard, HomePlug, Hong Kong International Lighting Fair, Houston Advanced Research Center, Huawei, Iberdrola SA, IBM, iControl, ICP America, IEEE, Industrial Technologies Program Save Energy Now Initiative, Infineon Technologies, Information Technology Industry Council, Intel, International Electrotechnical Commission, International Energy Agency, International Monetary Fund, Inventronics, IPC – Association Connecting Electronics Industries, Ixia, Jane’s Information Group, Johnson Controls, Juniper Networks, Kanepi Innovations, Lambda, Laurence Berkeley National Laboratory, Lighting Science Group, Lineage Power, Linksys, LonWorks, Lucent, Marconi, Matsushita, Mean-Well, Murata, National Data Center Energy Efficiency Information Program, NEBS, Netgear, Nextek Power Systems, Nortel, Open Source Development Labs, Oracle, Osram-Sylvania, Panasonic, PCI Industrial Computer Manufacturer’s Group, Pentadyne Power Corp., Pivot, PMBus, Polaris Networks, Portland General Electric, PowerDsine, PowerGate, Powerline AV, Power-One, Powerstax, Rackable Systems, RJ45 Power, Restriction on the use of certain Hazardous Substances (RoHS), Roal, Schlage, Sensor Switch, Server System Infrastructure Forum, Siemens, Silicon Valley Leadership Group, Southern California Edison, Southern Co., SprayCool, Standard Performance Evaluation Corp., Steelcase, Storage Networking Industry Association, Sun Microsystems, SynQor, Taiyo Yuden, TDK-Lambda, Telecommunications Industry Association, Telkoor, Texas Instruments, Toshiba, Traco, TrumPower, Tyan, Underwriters Laboratory, Union Fenosa SA, Universal Powerline Association, U.S. Department of Defense, U.S. Department of Energy, U.S. Energy Independence and Security Act 2007, U.S. Environmental Protection Agency, Verizon, Vizio, VMware, Waste Electrical and Electronic Equipment (WEEE), WattStopper, WAVE, Wayne Dalton, X-10, XP Power, Zilker Labs, ZTE, Zumtobel

Introduction 4
General Economic Environment 9
Application Segments 10
Application Trends 11
Computers 11
Communications 15
Consumer 18
Military/Aerospace 20
Industrial and Instrumentation 22
Medical 25
Technology, Architectures and Packaging Trends 26
Single vs. Multiple Output 26
Number of System Voltage Rails Continues to Grow 28
The Trend towards Front Ends 30
The Growing Influence of ATCA 34
Emergence of LED Lighting Applications 37
Packaging 40
Advanced Technology, Materials and Packaging 44
Digital Power Management and Control 44
Power Factor Correction (PFC) 49
Silicon Carbide (SiC) 51
Potential Technological Threats 53
The Development of DC-Powered Facilities 53
Technological and Regulatory Developments 55
Power Factor Correction (PFC) 55
Power-over-Ethernet (PoE) 57
ATCA Standards 60
Efficiency Standards 62
Power Supplies as the New Differentiator 69

Appendix A: Powerline Communications & Broadband-over-Powerlines 71

Tables
Table 1 – Projected Impact of Economic Slowdown on Computer Apps. 13
Table 2 – Projected Impact of Economic Slowdown on Communications Apps.. 16
Table 3 – PoE Power Market by Power Source.. 18
Table 4 – Projected Impact of Economic Slowdown on Consumer Apps. 19
Table 5 – Projected Impact of Economic Slowdown on Mil/Aero Apps. 21
Table 6 – Projected Impact of Economic Slowdown on Ind. /Instrumentation 23
Table 7 – Projected Impact of Economic Slowdown on Medical Applications. 26
Table 8 – Application Segment Voltage Rail Comparison 30
Table 9 – 80 Plus Performance Specifications 63

Graphs
Graph 1 – Long-Term Growth Rates for Embedded AC-DC Power Supplies 6
Graph 2 – Long-Term Growth Rates for DC-DC Modules 7
Graph 3 – Comparison between Long-Term AC-DC and DC-DC Growth Rates 8

Figures
Figure 1 – ICP America Multiple Output Power Supply 27
Figure 2 – Emerson Network Power Single Output Power Supply 28
Figure 3– Redundant/Non-Redundant Power Supply Systems 32
Figure 4 – Murata Power Solutions Front End 34
Figure 5 – ATCA Packaging Example 35
Figure 6 – Use of Lighting Technologies in Signs 39
Figure 7 – Inventronics AC-DC Power supply 40
Figure 8 – Lambda Enclosed AC-DC Power Supply 41
Figure 9 – Astrodyne DIN Rail Power AC-DC Supply 42
Figure 10 – TelKoor Rackmount AC-DC Power Supply 43
Figure 11 – Emerson Network Power Open Frame Power Supply 44
Figure 12 – Five Levels of Digital Power 45
Figure 13 – TDK Lambda Digital AC-DC Power Supply 47
Figure 14 – AC-DC Power Supply with Power Factor Correction 50
Figure 15 – Power over Ethernet (PoE) Midspan 58
Figure 16 – Power over Ethernet (PoE) Endspan 59