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Global Markets for Roll-to-Roll Technologies for Flexible Devices

  • January 2016
  • 145 pages
  • BCC Research
Report ID: 1169897

Summary

Table of Contents

This BCC Research report provides new insights on flexible devices that are produced using R2R technologies, as well as outlines technological trends and offer an updated market analysis for these products. Includes forecast through 2020.

Use this report to:

Gain infomation about various device types and roll-to-roll fabrication processes
Receive information about the technological issues, including key events and the latest process developments for R2R flexible devices
Identify opportunities for process and productivity improvements and new product developments
Gain technical insights into the R2R manufacturing of flexible devices

Highlights

The global market for flexible devices manufactured by roll-to-roll (R2R) technologies totaled $14.6 billion in 2015 and is expected to reach $28.1 billion by 2020 increasing at a compound annual growth rate (CAGR) of 13.9% from 2015 to 2020.
Electronic devices as a segment should reach $13.7 billion in 2015 and $23.3 billion by 2020, with a CAGR of 11.2% through the forecast period.
Optoelectronic devices segment of this market will increase from $670 million in 2015 to $3.3 billion by 2020, a CAGR of 37.2% for the period of 2015-2020.


STUDY GOALS AND OBJECTIVES

There is growing interest in advanced devices that are thin, lightweight and bendable.
Generally known as flexible devices, these products include primarily electronics, optoelectronics, and energy devices, although other types, such as sensors and medical devices, are also beginning to emerge.

As flexible devices become more popular, the need for high-volume processes for their fabrication increases. Consequently, the industry is steadily transitioning to the integration of roll-to-roll (R2R) technologies for the fabrication of these devices.

BCC Research first published its R2R technologies and flexible devices report in April 2013. The market for these products has since experienced healthy growth, while new technological developments and industry changes have also taken place.

The primary goal of this report is to provide new insights on flexible devices that are produced using R2R technologies, as well as to outline technological trends and offer an updated market analysis for these products.

Specifically, the major objectives of this study are:

To provide an updated review of commercially available and emerging flexible devices, including a description of their types and fabrication technologies.
To highlight new technological developments in flexible device manufacturing, while outlining current technical issues.
To review various processes that are being used for R2R manufacturing, focusing on those that are quickly gaining in popularity.
To estimate current global markets for flexible devices produced by R2R technologies based on device type, manufacturing process, substrate material, and region, with growth forecasts through 2020 for each market segment.
To identify important technology and industry trends within each market segment.
To offer an updated review of current industry players, including manufacturers of devices, materials, fabrication equipment, technology developers, and future market participants.
To provide a description of the most relevant research and development activities.
To determine trends in recently issued U.S. patents.

REASONS FOR DOING THIS STUDY

Although the first flexible circuits were produced in the early 1900s, introduction of R2R technologies for manufacturing these circuits occurred many years later in Japan during the 1980s. The use of R2R methods has become more common, while various processes have been adapted for applications in creating patterns on flexible substrates.

The need to produce advanced devices on a large scale with high throughput, low cost, and high quality, while at the same time using fabrication methods that are environmentally friendly and energy efficient is also leading to the rapid expansion of the printed electronics market. This market is currently valued at approximately $9
billion and is estimated to grow at a robust rate during the five-year period between 2015 and 2020.
The availability of various printing methods adapted to R2R processing represents a major contributing factor to the current and future expansion of the flexible device market.

The principal reason for this report is to present a current assessment of the R2R flexible device industry from both a technological and market point of view, as well as outline future trends and key developments.

There is also a need to evaluate the current status and future trends of this market from a global standpoint. As the use of these products expands and new fields of application emerge, information on suppliers and developers of these devices and their regional distribution becomes more valuable.

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