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Evolving High Speed Backplane Connectors

  • June 2013
  • 217 pages
  • Bishop & Associates inc
Report ID: 1556716


Table of Contents

Bishop and Associates, Inc. has just released a new 10-chapter 217 page research report providing a detailed analysis of the market for high-speed backplane connectors designed specifically to perform in 6 to 40 Gb/s circuits. In addition to traditional backplane architecture, this new report provides insight on emerging packaging options that are spurring interest in midplane, orthogonal, ruggedized, cable, and fiber optic backplane connectors.

Connectors designed to operate in multi-gigabit applications have proliferated over the past four years providing system designers greatly expanded interconnect options and performance levels. Advances in connector, as well as signal conditioning technology, have pushed interface bandwidth from 6 Gb/s to 25+ Gb/s, with several suppliers introducing new connectors designed to offer a migration path to 40 Gb/s performance.

This market research report addresses the many aspects of the high-speed interconnect market from what is driving demand for faster channels, to defining the key characteristics of the leading connector families that are currently available. The report also includes a reference chart that outlines the rated bandwidth of all currently released backplane connectors designed for circuits operating at 6 Gb/s to 40 Gb/s.

A variety of factors associated with high-speed channels have a major influence on their behavior. Chapters are devoted to reviewing related system elements including driver and receiver technology, printed circuit board materials and design, as well as channel modeling, and performance measurement systems.
Chapter 8 explores the advantages and technical challenges of alternatives to traditional backplane connector design including orthogonal, cable, ruggedized and optical interconnects. A discussion of the key Issues that are driving interest in these interconnects, as well as examples of currently available products, provide insight on how the industry is preparing to support future generations of high-speed equipment.

The report also includes several tutorial chapters on connector and high-speed system design issues that enable a non-technical reader to gain from the information provided.

This market research report is the fourth in a continuing series of investigations of this highly dynamic product segment. The advancement of this technology together with experience gained in designing these unique interfaces may set the stage for the evolution of all types of next generation electronic connectors. Those suppliers who have consistently made the necessary investment in resources to develop this expertise may emerge as the only viable suppliers capable of supporting future application requirements.

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