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3D IC and 2.5D IC Packaging Market by Application, Packaging Technology, End-User Industry, and Region - Global Forecast to 2022

3D IC and 2.5D IC Packaging Market: Global Forecast until 2022

  • January 2017
  • 175 pages
  • ID: 4606001
In this report:
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"3D IC and 2.5D IC packaging market is estimated to rise at a compound annual growth rate of ~38.3 percent between 2016 and 2022"

The 3D IC and 2.5D IC packaging market has entered the increase phase and is anticipated to grow further in the next years. The industry is anticipated to be worth ~$170.5B in 2022, at a compound annual growth rate (CAGR) of ~38.3 percent between 2016 and 2022. The drivers for this sector are the growing need for advanced architecture in electronic products, growing trend of miniaturization of electronic devices, and increasing market for tablets, smartphones, and gaming devices. The main restraint for this industry is created by the thermal issues caused by higher levels of integration.

"3D TSV in 3D IC and 2.5D IC packaging market is forecasted to grow at the maximal compound annual growth rate (CAGR) during the outlook period"

The 3D TSV market is anticipated to rise at the highest CAGR (Compound annual growth rate) during the estimate period. The main factors driving the 3D IC and 2.5D IC packaging market for 3D TSV include more significant interconnect density and greater space efficiencies in 3D TSV compared to all other types of advanced packaging including 3D WLCSP and 2.5 D.

"Logic market held the biggest share of the 3D IC and 2.5D IC packaging market in 2015"

The industry demand for 3D IC and 2.5D IC packages in logic is increasing because of the high product availability. An rising number of manufacturers in this market offer innovative products with advanced packaging. For example, Intel Corp. is driving the sector for advanced packaging in field programmable gate arrays. Overall firms started introducing 3D logic ICs in various programmable logics to assure operational efficiency with added convenience and rised productivity.

"Asia-Pacific is anticipated to be the quickest developing market for 3D IC and 2.5D IC packaging during the outlook period"

The industry in Asia-Pac is anticipated to grow at the highest compound annual growth rate (CAGR) because there is a strong demand for 3D IC and 2.5D IC packaging technology from the increasing consumer electronics market in this zone, particularly for smartphones and tablets. The presence of main 3D IC and 2.5D IC packaging manufacturers and providers in this area helps to decrease the time to market for 3D IC and 2.5D IC packaging products. This makes the integration of 3D IC and 2.5D IC packaging technology in the Asia-Pacific regions much easier.

Key players' distribution profiles:

- By Organization: Tier 1 - 45 %, Tier 2 - 32.0 percent, and Tier 3 - 23.0 percent

- By Designation: C-suite executives - 25.0 percent, Directors - 32.0 percent, and Others - 43.0 percent

- By area: North america (NA) - 25.0 percent, Europe - 37.0 percent, APAC - 28.0 percent, and rest of the world - 10.0 percent

Segment Research

The study segments in the 3D IC and 2.5D IC packages market report are packaging technology wich contains 3D wafer-level chip-scale packaging, 3D TSV, and 2.5D; application which comprises logic, imaging and optoelectronics, memory, MEMS/sensors, LED, power, analog and mixed signal, RF, and photonics.

The market research also includes end-user sector and geographic forecast of the market size for various parts with regard to four main regions, that is, Asia Pacific (APAC), North America continent, Europe (EU), and RoW.

Why acquiring this study can help you

The analysis would benefit the market top players/new sector entrants in this sector in these ways:

1. This document breaks down the 3D IC and 2.5D IC packages market comprehensively and offers the closest approximations of the global market size and those of the subsegments across distinct applications and localities.

2. The market research benefits partners to apprehend the pulse of the sector and offers them information on main market drivers, market restraints, opportunities, and alternatives.

3. This industry report would benefit partners to comprehend their players better and acquire additional insights to improve their rank in the business sector. The competitive outlook section includes competitor landscape, new industry product developments, alliances, and mergers and acquisitions in the sector.

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