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Global 3D TSV Devices Industry

Global 3D TSV Devices Industry

  • August 2021
  • 215 pages
  • ID: 5818192
  • Format: PDF
  • Global Industry Analysts


Table of Contents


Global 3D TSV Devices Market to Reach $12.7 Billion by 2026

Three-Dimensional (3D) Through-Silicon-Via (TSV) technology is steadily gaining image as the highly-advanced semiconductor packaging model that dramatically improves chip performance and functionality. A breakthrough System-in-Package (SiP) model, 3D TSV basically focuses on making interconnects to stack multiple dies, by drilling via-holes that are later filled with conductive material such as copper, to fabricate integrated chips (ICs) with high-level performance and space efficiency attributes. Driven by growing demand from global electronics manufacturers for innovative, high-performance chip architectures and designs in advanced packaging with superior performance, power consumption, and form factor features, 3D TSV technology has made robust progress within the global semiconductor sector. While the trends in the global electronics sector continue to put focus on advanced wafer packaging technologies such as 3D TSV technology, factors such as expanding Information & Communication Technologies (ICT) sector, stupendous increase in communications services providers (CSPs) operations, intensified activity in corporate data centers, and growing proliferation of cloud computing services are placing laser focus on 3D TSV. Over the past few years, the global electronics sector has been witnessing progressive advancements in all the core segments including consumer electronics, automotive electronics, medical electronics, and defense electronics among others.

Amid the COVID-19 crisis, the global market for 3D TSV Devices estimated at US$4.2 Billion in the year 2020, is projected to reach a revised size of US$12.7 Billion by 2026, growing at a CAGR of 20.5% over the analysis period. Memory, one of the segments analyzed in the report, is projected to grow at a 19.9% CAGR to reach US$4.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Mems segment is readjusted to a revised 21.6% CAGR for the next 7-year period. This segment currently accounts for a 22.2% share of the global 3D TSV Devices market.

The U.S. Market is Estimated at $808.8 Million in 2021, While China is Forecast to Reach $3.4 Billion by 2026

The 3D TSV Devices market in the U.S. is estimated at US$808.8 Million in the year 2021. The country currently accounts for a 16.73% share in the global market. China, the world second largest economy, is forecast to reach an estimated market size of US$3.4 Billion in the year 2026 trailing a CAGR of 24.4% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 15.7% and 17.1% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 15.6% CAGR while Rest of European market (as defined in the study) will reach US$4.3 Billion by the close of the analysis period.

Asia-Pacific (including China and Japan) is spearheading growth in the global 3D TSV market, led by countries such as China, South Korea, Australia, Singapore, and Indonesia that are key centers for the production of consumer electronics and automobiles. The growing demand for silicon wafers in the production of smartphones and the implementation of 5G technology, are particularly fueling market growth in the region. In 2019, collective laser?assisted bonding process for 3D TSV integration using nonconductive paste (NCP) was developed in South Korea. This allows the simultaneous stacking of many TSV dies to enhance productivity, while keeping the solder joints reliable using LAB (laser?assisted bonding) technology. Growth of the Asian 3D TSV market is also being fostered by the rising adoption of new memory technology and the presence of key market players in the region. In Europe and North America, increasing R&D activities related to 3D IC design is aiding market growth. The rising 3D packaging with the use of TSV technology in the semiconductor sector is being fueled by the requirement to enhance performance and lower time delays. Also, the growing use of TSV technology for functional integration along with wafer fabrication and assembly in the semiconductor sector is spurring market growth. Europe is at the forefront in terms of 3D TSV technology, given the presence of various R&D companies. In Latin America, the 3D TSV market is gaining from the rising demand for various electronic products. In the region, Brazil is a main market for cell phones, computers and other consumer electronics.

CMOS Image Sensors Segment to Reach $1.7 Billion by 2026

In the global CMOS Image Sensors segment, USA, Canada, Japan, China and Europe will drive the 18.9% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$390.7 Million in the year 2020 will reach a projected size of US$1.3 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$570.9 Million by the year 2026.

Select Competitors (Total 68 Featured)
  • Amkor Technology, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Broadcom Ltd.
  • Intel Corporation
  • Pure Storage, Inc.
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • United Microelectronics Corporation

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