1. Market Research
  2. > Packaging Market Trends
Fan Out Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

Fan Out Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

  • April 2021
  • 107 pages
  • ID: 6067797
  • Format: PDF
  • Mordor Intelligence LLP
Up to $750 off Until Jun 20th 2021

Summary

Table of Contents

Search Inside

The Fan-out Packaging market is expected to witness a CAGR of 18% during the forecasted period (2021 - 2026). The fan-out technologies prevalance since a long time is mainly due to cost, reliability and customer adoption. Approximately more than 20% thinner than traditional Flip Chip assembly, fan out packaging is supplementing the trend of slim profile of smart phones.

- Fan-out wafer level packaging (FOWLP) finds its increased application in footprint-sensitive devices such as smartphones due to requirement of high-performing, energy-efficient thin- and small-form-factor packages.
- Furthermore, with disadvantages of PoP in terms of thickness and not being able to reduce beyond 0.8mm, the market has gradually shifted onto fan-out for the application processor based on 10nm process.
- According to the Semiconductor Industry Association report 2018, the end-use categories like computer and communications hold major sales of USD 144.3 billion and USD 151.9 billion respectively.
- The semiconductors enable a wide variety of products for smartphones and computers and the demand for these devices is increasing year on year. A positive outlook for IoT and artificial intelligence are also increasing the growth of the semiconductor industry which in turn would require intensive use of fan-out technologies.

Key Market Trends
Panel Level Packaging to Hold a Significant Share during the Forecast Period

- Several packaging houses are implementing panel-level fan-out, a low-density technology that promises to lower the cost of fan-out. FOPLP is expected to be essential for future applications on 5G, AI, Biotech, Advanced Driver- Assistance System (ADAS), smart city, and IoT related products. Ability to develop advanced packing and testing services and secure customer relations serve as major factors.
- Smaller form factor with enhanced thermal performance has generated huge demand for panel level packaging technology among several industrial applications such as consumer electronics, automotive, aerospace & defense, telecommunication, and others.
- Market trends of reduced cost of circuit packaging, enhanced design flexibility and physical performance, and increased investment on research & development activities are the factors for manufacturers to continue on this technology.
- Time to Market is a major consideration for PLP as most of the players in the market are still in their R&D phase for PLP, for instance, in September 2018, Powertech Technology Inc, is investing in panel-based fan-out technology and has a five-year TWD 50 billion (USD 1.6 billion) investment plan for the technology, began since 2017 and is expected to ramp up production by the later half of 2020.

Taiwan to Hold a Significant Share in the Market

- Taiwan houses some of the major semiconductor manufacturing companies which are fueling the demand for advanced semiconductor packaging especially in PLPs. According to the Semiconductor Industry Association (SIA), Asia-Pacific generates more than 50% revenue for global semiconductor sales, this in turn, is providing Taiwanese vendors with an opportunity to supply FOWLP for increased semiconductor applications.
- Most of the companies in the country are expanding their production capacity of Fan-out packaging which is further expected to increase the exports and will also help in developing local market.
- For instance, ASE Group brought up a FO-WLP line, in Kaohsiung, Taiwan, with other major OSATs in production or planning their launch phases for fan-out packaging. Also, Fab 3 in Hsinchu Science Park is expectd be the world’s first fab that would commercially use fan-out panel-level packaging (FOPLP) technology as it starts operations in the second half of 2020, according to Powertech Technology Inc.
- Also, the growing market for fifth generation (5G) wireless communication and high performance computing has enabled the manufacturers to come up with newer technologies. For instance, in High-Density Fan-out segment, TSMC as a sole leader, is planning to extend its FO-WLP segment into technologies like inFO-Antenna-in-Package (AiP) and inFO-on-Substrate (oS).

Competitive Landscape
The competitive landscape involves huge investment in Research and Development by major companies, like Samsung and TSMC. Parallelly, many IDMs are pushing for Fan-Out development and embedding of their dies through R&D and small series in collaboration with OSATs.

- Sept 2019 – Innolux Corp confirmed on developing fan-out panel-level packaging (FOPLP) for semiconductors along with the Industrial Technology Research Institute.
- Aug 2019 - Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, ammounced that its M-Series fan-out wafer-level packaging (FOWLP) was adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s flagship S10 handset, along with the Xiaomi Mi 9 and LG G8 handsets.

Reasons to Purchase this report:
- The market estimate (ME) sheet in Excel format
- 3 months of analyst support

Get Industry Insights. Simply.

  • Latest reports & slideshows with insights from top research analysts
  • 150+ Million searchable statistics with tables, figures & datasets
  • More than 25,000 trusted sources
10% Off

$4250

  • Single User License — provides access to the report by one individual.
  • Department License — allows you to share the report with up to 5 users
  • Site License — allows the report to be shared amongst all employees in a defined country
  • Corporate License — allows for complete access, globally.

ReportLinker may already be registered as a supplier with your company. If you want to Order by PO, check with us first and we'll let you know if we are a registered supplier and what the vendor number is. Otherwise, we'll provide you with the necessary information to register ReportLinker as a vendor.

Ahmad helps you find the right report:
Testimonials

The research specialist advised us on the best content for our needs and provided a great report and follow-up, thanks very much we shall look at ReportLinker in the future.

Kate Merrick

Global Marketing Manager at
Eurotherm by Schneider Electric

We were impressed with the support that ReportLinker’s research specialists’ team provided. The report we purchased was useful and provided exactly what we want.

Category Manager at
Ikea

ReportLinker gave access to reliable and useful data while avoiding dispersing resources and spending too much time on unnecessary research.

Executive Director at
PwC Advisory

The customer service was fast, responsive, and 100% professional in all my dealings (...) If we have more research needs, I'll certainly prioritize working with ReportLinker!

Scott Griffith

Vice President Marketing at
Maurice Sporting Goods

The research specialist provided prompt, helpful instructions for accessing ReportLinker's product. He also followed up to make sure everything went smoothly and to ensure an easy transition to the next stage of my research

Jessica P Huffman

Research Associate at
American Transportation Research Institute

Excellent customer service. Very responsive and fast.

Director, Corporate Strategy at
Ingredion

I reached out to ReportLinker for a detailed market study on the Air Treatment industry. The quality of the report, the research specialist’s willingness to solve my queries exceeded my expectations. I would definitely recommend ReportLinker for in-depth industry information.

Mariana Mendoza

Global Platform Senior Manager at
Whirlpool Corporation

Thanks! I like what you've provided and will certainly come back if I need to do further research works.

Bee Hin Png

CEO at
LDR Pte Ltd

The research specialist advised us on the best content for our needs and provided a great report and follow-up, thanks very much we shall look at ReportLinker in the future.

Kate Merrick

Global Marketing Manager at
Eurotherm by Schneider Electric

FAQ
  • How we can help
    • I am not sure if the report I am interested in will fulfill my needs. Can you help me?
    • Yes, of course. You can call us at +33(0) 4 37 65 17 03 or drop us an email at researchadvisor@reportlinker.com to let us know more about your requirements.
    • We buy reports often - can ReportLinker get me any benefits?
    • Yes. Set up a call with a Senior Research Advisor to learn more - researchadvisor@reportlinker.com or +33(0) 4 37 65 17 03.
    • I have had negative experiences with market research reports before. How can you avoid this from happening again?
    • We advise all clients to read the TOC and Summary and list your questions so that we can get more insight for you before you make any purchase decision. A research advisor will accompany you so that you can compare samples and reports from different sources, and choose the study that is right for you.

  • Report Delivery
    • How and when I will receive my Report?
    • Most reports are delivered right away in a pdf format, while others are accessed via a secure link and access codes. Do note that sometimes reports are sent within a 12 hour period, depending on the time zones. However, you can contact us to escalate this. Should you need a hard copy, you can check if this option is offered for the particular report, and pay the related fees.
  • Payment conditions
    • What payment methods do you accept?
      1. Credit card : VISA, American Express, Mastercard, or
      2. You can download an invoice to pay by wire transfer, check, or via a Purchase Order from your company, or
      3. You can pay via a Check made out in US Dollars, Euros, or British Pounds for the full amount made payable to ReportLinker
    • What are ReportLinker’s Payment Terms?
    • All payments must normally be submitted within 30 days. However, you can let us know if you need extended time.
    • Are Taxes and duties included?
    • All companies based in France must pay a 20% tax per report. The same applies to all individuals based in the EU. All EU companies must supply their VAT number when purchasing to avoid this charge.
    • I’m not satisfied. Can I be refunded?
    • No. Once your order has been processed and the publisher has received a notification to send you the report, we cannot issue any refund or cancel any order. As these are not ‘traditional’ products that can be returned, reports that are dispatched are considered to be ‘consumed’.
  • User license
    • The license that you should acquire depends on the number of persons that need to access the report. This can range from Single User (only one person will have the right to read or access the report), or Department License (up to 5 persons), to Site License (a group of persons based in the same company location), or Corporate License (the entire company personnel based worldwide). However, as publishers have different terms and conditions, we can look into this for you.
Purchase Reports From Reputable Market Research Publishers

Advanced Packaging Market - Growth, Trends, COVID-19 Impact, and Forecasts (2021 - 2026)

  • $ 4250
  • March 2021
  • 115 pages

The Advanced Packaging Market was valued at USD 24.93 billion in 2020, and it is expected to reach a value of USD 38.62 billion by 2026, at a CAGR of 7.8% over the forecast period (2021 - 2026). The innovation ...

  • World
  • Taiwan
  • Packaging
  • Semiconductor
  • Industry analysis
  • Electronics Production
  • Semiconductor Revenue

ref:plp2021

Reportlinker.com © Copyright 2021. All rights reserved.

ReportLinker simplifies how Analysts and Decision Makers get industry data for their business.

Make sure you don’t miss any news and follow us on