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Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027

Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027

  • October 2022
  • 142 pages
  • ID: 6359529
  • Format: PDF
  • IMARC Group

Summary

Table of Contents

The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, the analyst expects the market to reach US$ 67.04 Billion by 2027, exhibiting a growth rate (CAGR) of 11.60% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.

Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices.

Advanced Packaging Market Trends:
The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth.

Key Market Segmentation:
the analyst provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on type and end use.

Breakup by Type:
Flip-Chip Ball Grid Array
Flip Chip CSP
Wafer Level CSP
5D/3D
Fan Out WLP
Others

Breakup by End Use:
Consumer Electronics
Automotive
Industrial
Healthcare
Aerospace and Defense
Others

Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).



Key Questions Answered in This Report:

How has the global advanced packaging market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global advanced packaging market?
What are the key regional markets?
What is the breakup of the market based on the type?
What is the breakup of the market based on the end use?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global advanced packaging market and who are the key players?
What is the degree of competition in the industry?

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