Glossary

Overview/Introduction

Companies Profile

iPhone 5S Teardown

Physical Analysis
- Physical Analysis Methodology
- Package
- - Package Views & Dimensions
- - Package Opening
- - Package Cross-Section
- ASIC Die
- - View, Dimensions & Marking
- - Delayering, Process Identificatio- - Cross-Section
- - Process Characteristics
- MEMS Die
- - View, Dimensions & Marking
- - Dicing
- - Bond Pads
- - Diaphragm & Backplate
- - Cavities
- - Anti-stiction features
- - Cross-Section

Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- ASIC Wafer Fabrication Unit
- MEMS Process Flow
- MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit

Cost Analysis
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test & Dicing
- ASIC Wafer Cost
- ASIC Die Cost
- MEMS Front-End Cost
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Front-End Cost per process steps
- MEMS Front-End: Equipment Cost per Family
- MEMS Front-End: Material Cost per Family
- MEMS Wafer Cost
- MEMS Die Cost
- Back-End : Packaging Cost
- Back-End : Packaging Cost per Process Steps
- Back-End : Final Test Cost
- Microphone Component Cost & Price