1. Introduction

2. Physical Analysis
- Physical Analysis Methodology
- Package
- Package Characteristics Marking & Pin-out
- Package Opening
- Package Bonding
- Package Cross-Section
- ASIC Die
- View, Dimensions & Marking
- Delayering & Process Identification
- Cross-Section
- MEMS Accelero Die
- View, Dimensions & Marking
- MEMS TGV
- MEMS Cross-Section
- Process Characteristics
- Silicon Sensing Patents
- MEMS Gyro Die
- View, Dimensions & Marking
- MEMS Piezoelectric film
- MEMS Pedestal
- Cross-Section
- Process Characteristics
- Silicon Sensing Patents

3. Comparison with Murata’s SCC2000

4. Manufacturing Process Flow
- Global Overview
- ASIC Front-End Process
- MEMS Process Flow
- Wafer Fabrication Units
- Packaging Process Flow & Assembly Unit

5. Cost Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Probe Test & Dicing Cost
- ASIC Wafer & Die Cost
- MEMS Gyro Front-End Cost
- MEMS Gyro Front-End Cost per process steps
- MEMS Gyro Probe Test & Dicing Cost
- MEMS Gyro Wafer & Die Cost
- MEMS Accelero Front-End Cost
- MEMS Accelero Front-End Cost per process steps
- MEMS Accelero Probe Test & Dicing Cost
- MEMS Accelero Wafer & Die Cost
- Back-End : Packaging Cost
- Back-End : Final Test & Calibration Cost
- CMS300 Component Cost

6. Price Analysis
- Definition of Prices
- CMS300 Selling Price Estimation