PART 01: Executive summary
- Highlights
PART 02: Scope of the report
- Definition
- Source year and forecast period
- Market reportage
- Market size computation
- Market segmentation
- Geographical coverage
- Vendor segmentation
- Common currency conversion rates
- Top-vendor offerings
PART 03: Market research methodology
- Research methodology
- Economic indicators
PART 04: Introduction
- Key market highlights
PART 05: Technology landscape
- Wafer-level versus die-level packaging and assembly
- Roadmap of semiconductor packaging industry
- Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
- Customer perspective
- Market size and forecast
- Five forces analysis
PART 07: Market segmentation by type
- Types of packaging equipment
- Die-level packaging equipment
- Wafer-level packaging equipment
PART 08: Market segmentation by end-user
- Global semiconductor packaging equipment market by end-user
- OSATs
- IDMs
PART 09: Geographical segmentation
- Global semiconductor packaging equipment market by region
- APAC
- North America
- Europe
PART 10: Market drivers
- Growing number of fabs
- High demand for polymer adhesive wafer bonding equipment
- Complex semiconductor IC designs
- Explosive growth of wireless computing devices along with advent of IoT
- Growing demand for compact electronic devices
- High need for SoC technology
PART 11: Impact of drivers
PART 12: Market challenges
- High inventory levels in supply chain
- Dependency on few key suppliers
- Fluctuation of foreign exchange rates
- High investment market
PART 13: Impact of drivers and challenges
PART 14: Market trends
- Development of 3D chip packaging
- Increase in number of OSAT vendors
- Growing number of mergers and acquisitions
- FOWLP technology
- High need for semiconductor memory devices
- Growing acceptance of wearable devices
- Automation in automobiles
PART 15: Vendor landscape
- Competitive scenario
- Key vendors
- Other prominent vendors
PART 16: Appendix
- List of abbreviations
PART 17: Explore Technavio


List of Exhibits
Exhibit 01: Segmentation of global semiconductor packaging equipment market
Exhibit 02: List of countries in key regions
Exhibit 03: Market vendors
Exhibit 04: Currency conversions
Exhibit 05: Product offerings
Exhibit 06: Steps involved in back-end chip formation
Exhibit 07:.5D IC block diagram
Exhibit 08:D IC block diagram
Exhibit 09: Supply chain in traditional semiconductor IC packaging industry
Exhibit 10: Supply chain in new semiconductor IC packaging industry
Exhibit 11: Global semiconductor packaging equipment market 2015-2020 ($ billions)
Exhibit 12: Five forces analysis
Exhibit 13: Global semiconductor packaging equipment market by type 2015 (% share)
Exhibit 14: Global semiconductor packaging equipment market by type 2020 (% share)
Exhibit 15: Global semiconductor packaging equipment market by die-level packaging equipment 2015-2020 ($ millions)
Exhibit 16: Global semiconductor packaging equipment market by wafer-level packaging equipment 2015-2020 ($ millions)
Exhibit 17: Global semiconductor packaging equipment market by end-user 2015 (% share)
Exhibit 18: Global semiconductor packaging equipment market by end-user 2020 (% share)
Exhibit 19: Global semiconductor packaging equipment market by OSAT 2015-2020 ($ millions)
Exhibit 20: Global semiconductor packaging equipment market by IDM 2015-2020 ($ millions)
Exhibit 21: Global semiconductor packaging equipment market by region 2015 (% share)
Exhibit 22: Global semiconductor packaging equipment market by region 2020 (% share)
Exhibit 23: Semiconductor packaging equipment market in APAC 2015-2020 ($ millions)
Exhibit 24: Semiconductor packaging equipment market in North America 2015-2020 ($ millions)
Exhibit 25: Semiconductor packaging equipment market in Europe 2015-2020 ($ millions)
Exhibit 26: Global semiconductor packaging equipment market 2015-2020 (% share)
Exhibit 27: CAGR of LED chip and sensor market 2015-2020
Exhibit 28: Impact of drivers
Exhibit 29: Impact of drivers (continued)
Exhibit 30: Global semiconductor market trend 1992-2015 ($ billions)
Exhibit 31: Impact of drivers and challenges
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 34: Applied Materials: Segment-wise revenue contribution 2015 (% share)
Exhibit 35: Applied Materials: Segment-wise revenue break-up 2015 ($ billions)
Exhibit 36: Applied Materials: Silicon system segment performance 2014-2015 ($ billions)
Exhibit 37: Applied Materials: R&D expenses 2011-2015 ($ billions)
Exhibit 38: TEL: Sector performance by revenue 2012-2015
Exhibit 39: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
Exhibit 40: Other vendors in global semiconductor packaging equipment market