1 INTRODUCTION
1.1 Study Assumptions and Market Defnition
1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS
4.1 Market Overview
4.2 Semiconductor Industry Outlook
4.3 Industry Attractiveness - Porter's Five Forces Analysis
4.3.1 Bargaining Power of Suppliers
4.3.2 Bargaining Power of Buyers
4.3.3 Threat of New Entrants
4.3.4 Threat of Substitutes
4.3.5 Intensity of Competitive Rivalry
4.4 Industry Value Chain Analysis
4.5 Assessment of the Impact of COVID-19 on the Industry

5 MARKET DYNAMICS
5.1 Market Drivers
5.1.1 Increased Applications of Semiconductors in Automotive
5.1.2 Advancement in Semiconductor Packaging Due to Trends like 5G
5.2 Market Restraint
5.2.1 Vertical Integration is one of the Significant Concerns of OSAT Players

6 MARKET SEGMENTATION
6.1 Service Type
6.1.1 Packaging
6.1.2 Testing
6.2 Type of Packaging
6.2.1 Ball Grid Array (BGA) Packaging
6.2.2 Chip-scale Packaging (CSP)
6.2.3 Stacked Die Packaging
6.2.4 Multi-chip Packaging
6.2.5 Quad Flat and Dual-inline Packaging
6.3 Application
6.3.1 Communication
6.3.2 Consumer Electronics
6.3.3 Automotive
6.3.4 Computing and Networking
6.3.5 Industrial
6.3.6 Other Applications
6.4 Country (Geography)
6.4.1 United States
6.4.2 China
6.4.3 Taiwan
6.4.4 South Korea
6.4.5 Malaysia
6.4.6 Singapore
6.4.7 Japan
6.4.8 Rest of the World

7 COMPETITIVE LANDSCAPE
7.1 Company Profiles*
7.1.1 ASE Group
7.1.2 Amkor Technology Inc.
7.1.3 Powertech Technology Inc.
7.1.4 ChipMOS Technologies Inc.
7.1.5 King Yuan Electronics Co. Ltd
7.1.6 Formosa Advanced Technologies Co. Ltd
7.1.7 Jiangsu Changjiang Electronics Technology Co. Ltd
7.1.8 UTAC Holdings Ltd
7.1.9 Lingsen Precision Industries Ltd
7.1.10 Tongfu Microelectronics Co.
7.1.11 Chipbond Technology Corporation
7.1.12 Hana Micron Inc.
7.1.13 Integrated Micro-electronics Inc.
7.1.14 Tianshui Huatian Technology Co. Ltd
7.2 Vendor Share Analysis

8 INVESTMENT ANALYSIS

9 MARKET OPPORTUNITIES AND FUTURE TRENDS

Companies Mentioned
 - ASE Group
- Amkor Technology Inc.
- Powertech Technology Inc.
- ChipMOS Technologies Inc.
- King Yuan Electronics Co. Ltd
- Formosa Advanced Technologies Co. Ltd
- Jiangsu Changjiang Electronics Technology Co. Ltd
- UTAC Holdings Ltd
- Lingsen Precision Industries Ltd
- Tongfu Microelectronics Co.
- Chipbond Technology Corporation
- Hana Micron Inc.
- Integrated Micro-electronics Inc.
- Tianshui Huatian Technology Co. Ltd